Ukugoba Okuqinile

I-PCB egobile iyibhodi yesekethe ehlanganisa ama-PCB aqinile naguquguqukayo ngezinqubo ezithile, enikeza kokubili ukuqina kokusekela kanye nezici ezigobekayo/ezigoqekayo.

Izinhlobo ezivamile zifaka phakathi ukuguquguquka okukodwa/okuphindwe kabili okuhlanganiswe nokuqina okukodwa/okuphindwe kabili, kanye nokuguquguquka kwezinga eziningi okuhlanganiswe nokuqina kwezinga eziningi.

Ama-PCB aqinile aqinile futhi azinzile, ama-PCB aguquguqukayo athambile futhi ayagobeka kodwa anamandla amancane. Ama-PCB aqinile ahlanganisa izinzuzo zawo ukuze ahlangabezane nezidingo zokwakheka okuyinkimbinkimbi kanye nokusebenza kwemishini.

Yakhiwe ngezingqimba eziqinile (FR-4, njll.), izingqimba eziguquguqukayo (i-polyimide PI), izingqimba zokunamathela (iglue), kanye nezinhlayiya zensimbi.

Cabanga ngobunzima besekethe, izidingo zesignali, kanye nezindleko. Amasekethe alula adinga izendlalelo ezingu-2-4; amasekethe ayinkimbinkimbi anesivinini esikhulu angadinga izendlalelo ezingu-≥6.

Gwema ama-engeli abukhali; sebenzisa ama-engeli ayindilinga/45°. Gcina ububanzi bomugqa bufana futhi bunwetshwe ngendlela efanele. Gwema ama-vias ezindaweni ezigobile (ibanga ukusuka endaweni eqinile egobile ≥50mil).

Imigqa kufanele ishintshe kahle futhi iqonde ngqo esiqondisweni sokugoba. Izintambo kufanele zisatshalaliswe ngokulinganayo futhi zikhuliswe ngobubanzi. Imiklamo ye-PTH, i-Coverlay, kanye ne-PP engagelezi ayivunyelwe endaweni yokuguquka.

Sebenzisa isofthiwe yokulingisa ukuze ubale amapharamitha. Khetha ama-dielectric alahlekelwa kancane (isb., uchungechunge lwe-RO4000). Lawula ngokuqinile ukugoba ukuqinisekisa ukulingana kobubanzi bomugqa.

Faka ama-vias okushisa ezingqimbeni eziqinile ngaphansi kwezingxenye ezinamandla aphezulu. Sebenzisa izisekelo zensimbi/izinamathiseli eziqhuba ukushisa. Yenza ukulingisa ukushisa esiteji sokuklama ukuze uthuthukise izindlela zokushabalalisa ukushisa.

Umklamo ngokwesikhala sokufakwa kanye nesakhiwo semishini. Ubukhulu bendawo eguquguqukayo kufanele bucabangele ukuguqulwa kokugoba ukuze kugwenywe ukucindezelwa ngokweqile.

Qinisekisa ukuthi ushintshashintsha kahle phakathi kwama-pad nama-trace; gwema ama-engeli angakwesokudla. Beka izinzwane ze-solder ukuze kube nama-pad azimele ukuze uthuthukise ukwesekwa nokuqina kwe-soldering.

Izimbobo zamathuluzi ezisemabhodini aguquguqukayo akumelwe zabelwane ngazo. Ukubeka izimbobo ezindaweni eziqinile kufanele kucabangele ukucubungula nokunemba kokuhlanganiswa.

Hlukanisa izindiza ngendlela efanele ukuze unciphise umsindo. Xhuma izindiza ngemigodi/imigodi eyenziwe ngensimbi, unake ukuthembeka kanye nomthamo wokuthwala ugesi.

Gwema ama-via ezindaweni ezigobile. Engeza ama-trace ethusi avikelayo noma ama-trace afana ne-arc uma isikhala sivuma. Khulisa indawo yokugobile ngangokunokwenzeka.

Gwema imikhondo emide ehambisanayo. Sebenzisa isignali yokuhlukanisa. Khulisa isikhala phakathi kwesignali nezendlalelo zomhlabathi ukuze unciphise ukuhlangana.

Beka amaphuzu okuhlola ngokufanele ezindaweni eziqinile ukuze kube lula ukuhlola ukukhiqiza. Izindawo kufanele zifinyeleleke kalula futhi zingathinti imisebenzi yesekethe.

Ama-coefficient okwandisa ukushisa kwezendlalelo eziqinile neziguquguqukayo kufanele afaniswe. Isendlalelo sokunamathela kufanele sibe nokunamathela okuhle kokubili (isb., i-PI kanye ne-FR-4).

Hlela ukuhleleka kokuqoqwa kwempahla ngohlobo lwesignali (amasignali esivinini esikhulu asondele ezingqimbeni zomhlabathi). Linganisa ubukhulu kanye nezindleko.

Sebenzisa izimpawu ezicacile nombhalo emidwebweni ukuze ubonise ububanzi bokugoba, izikhombisi-ndlela, kanye nezidingo zerediyasi.

Setha amamodeli omkhiqizo, izinombolo zenguqulo, izinsuku zokukhiqiza, njll., ezindaweni eziqinile. Ukuhlonza kufanele kucace, kungagugi, futhi kulandeleke.

Gcina imikhondo imifushane futhi iqondile ngama-via ambalwa. Sebenzisa izakhiwo ze-microstrip/stripline. Vikela ukuvimbela imisebe nokuphazamiseka.

Umklamo ukuze uhlangabezane namakhono enqubo yabakhiqizi (ububanzi/isikhala esincane somugqa, ngosayizi, njll.). Lungiselela ukuhlanganiswa okuzenzakalelayo/ngesandla.

Qinisekisa ukuthi izinguquko zibushelelezi ukuze ugweme ukugxilisa ingqondo ekucindezelekeni. Sebenzisa izinguquko zobubanzi bomugqa kancane kancane noma izakhiwo ezikhethekile zokuguquka.

Ukumbozwa ngethusi ezindaweni eziqinile kusiza ekushabalaleni kokushisa futhi kunciphisa ukuvinjelwa komhlabathi. Ezindaweni eziguquguqukayo, cabanga ngokuthembeka kokugoba kokumbozwa ngethusi.

Zungeza umhlabathi bese wengeza izendlalelo zokuvikela. Gcina kude nemithombo yokuphazamiseka (izingxenye ezinamandla amakhulu, imikhondo yewashi, njll.).

Hlela kahle ukuze unciphise imithombo yemisebe. Vikela izifunda ezivame ukuphazamiseka. Lungiselela isisekelo ukuze unciphise ukumelana.

Khetha ama-via (afihliwe/afihliwe/angena) njengoba kudingeka. Ama-via afihliwe/angena anciphisa izendlalelo kodwa ayabiza. Sebenzisa ama-via ngokucophelela ezindaweni eziguquguqukayo.

Yenza izimbobo zibe zinkulu kancane kunalokho okwenzelwe ukuvumela ukugeleza kweglue. Sebenzisa amadayi akhethekile ezimbobo ezincane eziqinile.

Khulisa ithusi ezindaweni eziqinile (beka izindawo zokuhlala zethusi eziqinile ezindaweni ezilahliwe). Khetha ukujiya kwezinto ngokufanele.

Qinisekisa ububanzi bomugqa obanele bemisinga ephezulu. Sebenzisa i-foil yethusi enezingqimba eziningi noma engeza ama-trace. Cabanga ngokushabalalisa ukushisa kanye nokwehla kwamandla kagesi.

Hlela ukwakheka kwamaphaneli ngokwemishini yokukhiqiza nezinqubo. Thuthukisa ukusebenza kahle kanye nokusetshenziswa kwezinto; qaphela usayizi wesimo kanye nendawo.

Setha amaphuzu okuhlola kanye nezixhumi zokulungisa. Izingxenye zokubeka ukuze kube lula ukuzihlukanisa. Nikeza imiyalelo yokulungisa enemininingwane.

Beka izingxenye ezimbobo ezidlulayo ezindaweni eziqinile ukuze kube lula ukuzilungisa. Sabalalisa ngokufanele izingxenye ze-SMD ezindaweni eziqinile/eziguquguqukayo ukuqinisekisa ukuxhumana okuthembekile.

Beka amamaki amaningi okuqinisekisa ezindaweni eziqinile ukuze kubekwe kahle umkhiqizo futhi kulinganiswe. Izimo/osayizi kufanele bahlangabezane nezidingo zemishini.

Khetha izinto ezifanele amazinga okushisa/omswakama. Qinisa ukuqina nokusekela ezindaweni zokudlidliza; lungisa ukwakheka ukuze unciphise imiphumela.

Sebenzisa ukuhlukaniswa okungokoqobo (ukubeka/ukuvikela) noma ukuhlukaniswa kukagesi (ama-opto-couplers/ama-transformer) ukuze uhlukanise amasignali e-analog/digital, njll.

Namathisela i-PI/insimbi/i-FR4 kanye nezinye izinto zokuqinisa endaweni/ngokuphelele. Khetha izindlela nobukhulu njengoba kudingeka.

Yenza kube lula ukuklama ukuze unciphise izendlalelo nezakhiwo eziyinkimbinkimbi. Khetha izinto/izinqubo ezingabizi kakhulu. Lungiselela ukwakheka kwamaphaneli nezinqubo.

Gcina isikhala esanele ukuvimbela ukuphuka. Sebenzisa izinto zokuvikela/izendlalelo ezihlukanisayo. I-标识 ekhethekile futhi uvikele ama-trace ane-voltage ephezulu.

Ukushisela kufanelekile ezimweni eziningi; qinisekisa ikhwalithi. Ukubopha ngemicu kusetshenziselwa ukuxhuma njalo; khetha izixhumi nezinqubo ezifanele.

Inqubo: Ukwenziwa kwebhodi eqinile → ukwenziwa kwebhodi eguquguqukayo → ukubopha okuqinile nokuguquguquka → ukucubungula ukuma → ukwelashwa kwendawo → ukuhlolwa.

Izendlalelo eziqinile: FR-4; izendlalelo eziguquguqukayo: i-polyimide (PI).

Lawula izinga lokushisa le-lamination, ingcindezi, isikhathi. Lungiselela ukulandelana ukuze unciphise ukucindezeleka. Vimbela amabhamuza nemibimbi.

Sebenzisa i-ductile copper foil. Lawula amapharamitha okuqopha. Sebenzisa i-grid routing ezindaweni ezigobile ukuze usakaze ukucindezeleka.

Ukubhoboza nge-laser + ngokugcwalisa/ukufaka i-electroplating. Lawula amapharamitha ukuze ugweme ukubhoboza. Hlola ngokuqinile ukuhanjiswa kukagesi.

Sebenzisa imishini yokugaya/yokunyathela enembayo ephezulu. Lungisa izindawo eziguquguqukayo ngama-spacer ngesikhathi sokucubungula. Faka isitembu ezindaweni eziguquguqukayo ngaphambi kweziqinile ekunyatheleni nge-die.

Igolide elicwilisiwe, i-plating yegolide, i-HASL, i-OSP (i-organic solderability preservative), njll., ekhethiwe njengoba kudingeka.

Lungiselela amapharamitha e-lamination ukuze abe yisicaba. Khulisa usayizi wendawo eguquguqukayo ekwakhiweni. Sebenzisa ukwesekwa okufanele kanye nokulungiswa ngesikhathi sokucubungula.

Lawula ngokuqinile ukugoba ukuze kube nobubanzi bomugqa. Khetha izinto ze-dielectric ezizinzile nezinembile kakhulu. Qapha futhi ulungise ukuvimba ngesikhathi sangempela ngesikhathi sokukhiqiza.

Lungiselela izinqubo ukuze unciphise izinyathelo. Sebenzisa imishini ezenzakalelayo. Hlela ukukhiqiza ngokufanele ukuze uthuthukise ukusetshenziswa kwemishini.

Khulisa ukwakheka kwethusi okusele. Lungisa izinga lokushisa elingu-≥3.0℃/min. Khetha izinto zeglue ezifanele zokugcwalisa okufanayo.

Khetha inhlaka enamathelayo kakhulu. Hlanza izindawo zokubopha. Lawula izinga lokushisa lokubopha, ingcindezi, nesikhathi.

Lungisa amakhona amane ngensimbi yokusongelwa ngaphambi kokusonga. Lungisa amapharamitha okusonga ngokwezakhiwo zokumboza. Gwema imibimbi namabhamuza.

Yenza izivivinyo zikagesi eziqinile (i-AOI, ukuhlolwa kwe-flying probe) ngesikhathi sokukhiqiza. Lawula ngokuqinile izinqubo ukuze ugweme amaphutha okulandelela.

Sebenzisa amabhodi okudonsa ukuze udlule emigqeni evundlile futhi uvimbele ukuminyana. Sebenzisa ukulungiswa okukhethekile kanye nokusekelwa ngesikhathi sokucubungula ukuze uqine.

Sebenzisa izinhlelo zokubeka ezinembile kakhulu (i-laser/iphini). Hlola ngokucophelela futhi ulungise ukuhambisana ngaphambi kokufaka i-lamination.

Sebenzisa i-ductile electrolytic copper foil. Yakha i-gonding radius ≥10x board thickness. Routing ekhethekile yokuthuthukisa ukumelana nokukhathala.

Lungiselela umklamo wokulandelela ukuze kube lula ukushibilika. Khetha izinqubo ezifanele zokushibilika (ukushibilika kabusha/ukushibilika kwamagagasi). Lawula izinga lokushisa nesikhathi.

Sebenzisa imishini yokunyathelisa isikrini enembayo kanye nama-stencil. Hlanza futhi ubeke amabhodi ngaphambi kokunyathelisa, futhi ulawule ngokuqinile amapharamitha afana nokucindezela kwe-squeegee, isivinini, kanye ne-engeli.

Khetha uyinki nezinqubo ezifanele ukuqinisekisa ukuthi izinhlamvu zicacile futhi azigugi. Naka indawo yokuphrinta kanye nesiqondiso, bese uhlola ikhwalithi ukuze uvimbele ukufiphala noma ukuqhekeka.

Misa uhlelo oluphelele lokuphatha ikhwalithi. Lawula ngokuqinile izinto zokusetshenziswa, izinqubo, kanye nemingcele yemishini. Lungisa futhi ulinganise imishini njalo, futhi wenze ukuhlolwa kwamasampula.

Hlela futhi uvuselele imfucuza efana nensimbi nepulasitiki. Hlanza imfucuza yensimbi bese uphinda usebenzise noma ushise imfucuza yepulasitiki endaweni ezungezile.

Faka phansi okungashukumi, amabhentshi okusebenzela, izintambo zesandla, njll., eshabhu. Gcwalisa imishini bese usebenzisa ukupakisha okungashukumi kwezinto zokusetshenziswa kanye nemikhiqizo eqediwe ngokuphelele.

Thuthukisa imininingwane eningiliziwe yenqubo yokuvuselela, uqeqeshe abasebenzi bokuvuselela, usebenzise amathuluzi nemishini efanele, futhi uvikele amasekethe nezingxenye ezizungezile.

Gcina indawo yokusebenzela ihlanzekile ngokuhlanza njalo amagciwane. Sebenzisa amaphakheji angangeni uthuli futhi angangeni umswakama ezintweni zokusetshenziswa kanye nemikhiqizo engaqediwe ngokuphelele, bese usebenzisa izinqubo zokukhiqiza ezihlanzekile.

Sebenzisa amaphakheji okuvikela njengezikhwama ezingashukumi kanye nama-foam pad. Faka amamodeli omkhiqizo amalebula, inani, izinsuku zokukhiqiza, njll.

Sebenzisa izinto ezilwa nokungaguquguquki kanye nezingebukhali. Lungisa nge-vacuum suction noma ama-clamp akhethekile. Gwema ukuhudula noma ukugoqa, bese usebenzisa amathreyi akhethekile ukuze uphathe.

Umklamo wokubeka phansi ongafanele, ungqimba lokuvikela owonakele, isikhala esinganele somzila, kanye nokuvinjelwa okungenakuqhathaniswa kwezibonakaliso zesivinini esikhulu.

Izinto ze-polyimide zingamelana namazinga okushisa aphezulu esikhashana angu-260°C. Kunconywa ukulawula izinga lokushisa eliphakeme ku-245°C-255°C ngesikhathi sokushisa okuphezulu ≤ imizuzwana engama-60.

Lungiselela amapharamitha enqubo njengokucindezela kokubekwa kanye nama-curve okushisa. Sebenzisa imishini yokukhetha nokubeka enembayo kanye nezinhlelo zokubeka, futhi uqinise ukuhlolwa kwezinto ezingenayo.

Hlola irediyasi ye-fillet ye-transition zone (kunconywa ukuthi ibe ngu-≥0.5mm), gwema ukugxila kokucindezeleka kokuhlanganiswa, bese wengeza ama-reinforcement plate noma ulungise izinqubo zokugoba.

Beka izinto ezincane, ezincane, neziqinile (isb., ama-flip chips, i-0201 kanye namaphakheji amancane). Gwema izinto ezine-过长 noma izintambo ezisindayo.

Hlanganisa ukubhoboza nge-laser kanye nokwemishini, sebenzisa izimbobo zokubeka kanye nezinhloso ukuze uqondanise, bese uqapha ngesikhathi sangempela nge-AOI.

Sebenzisa i-X-ray ukuthola izikhala zangaphakathi kanye nokushiswa okubandayo. Yenza izivivinyo zokudonsa kanye nezivivinyo zomjikelezo wokushisa ukuze uhlole ukuthembeka kwemvelo.

Ngokwezindinganiso ze-IPC, ubukhulu be-substrate buphindwe ka-≥3 (isb., i-substrate ye-PI engu-0.1mm, enconyiwe engu-≥0.3mm). Bheka amapharamitha omhlinzeki wezinto ezibonakalayo.

Hlola ubude bomzila kanye nokuhleleka kokulandelana okujikelezayo. Qinisekisa ukuhambisana kwe-impedance kanye ne-dielectric constant yezinto ze-dielectric.

Khetha inhlaka enobukhulu obufanele, lawula ivolumu yokusetshenziswa kanye nendawo, bese ulungisa amapharamitha okukhipha kanye nezindlela ukuze ugweme ukugcwala.

Imibimbi ingabangela ukuguquka noma ukuphuka kwemikhondo, okuthinta ukusebenza kukagesi nokwemishini. Shintsha noma lungisa bese uhlola kabusha.

Sebenzisa ukuhlolwa kwe-flying probe, i-ICT, noma i-FCT. Lingisa ukugoba kwangempela kwezingxenye eziguquguqukayo kanye nobuqotho besignali yokuhlola, i-voltage/current, njll.

≥10¹⁰Ω ekushiseni/kumswakama ojwayelekile, ≥10⁸Ω ngemva kwamahora angu-168 ku-85℃/85%RH (izinga le-IPC-6012).

Faka i-voltage elinganisiwe izikhathi ezingu-1.5-2 imizuzu engu-1-5 ngaphandle kokuphazamiseka noma ukushaqeka (isb., 75-100V ye-voltage elinganisiwe engu-50V).

Yenza imijikelezo yokushisa ephansi kakhulu (-40℃→igumbi→85℃), bamba izinga lokushisa ngalinye imizuzu engama-30-60, imijikelezo engama-≥50, bese uhlola ukuthi akukho ukuqhekeka noma ukususwa kwe-trace.

Sebenzisa imishini ekhethekile ukusetha i-engeli (isb., ±90°) kanye nemvamisa (imijikelezo eyi-10/min), goba kuze kube yilapho yehluleka, bese uqopha imijikelezo (≥izikhathi eziyi-100,000).

Sebenzisa abahloli be-flying probe noma ama-multimeter ukuze uxazulule inkinga ngephuzu. Hlanganisa ne-AOI ukuze uthole ukuvuleka kwendawo kanye ne-金相切片 ukuze kuhlolwe ngaphakathi uma kudingeka.

Gwema ukucindezela noma ukudonsa izingxenye ezigobekayo. Sebenzisa ama-probe anwebekayo, ukunemba kokubeka izinto ngendlela efanayo nebhodi, futhi uqinisekise ukuthi izinyathelo zokulwa nokuma.

Phinda uhlanganise amajoyinti okusoda abandayo/angenalutho ngesibhamu somoya oshisayo. Sebenzisa intambo yokususa ukusoda kuma-short circuits, bese ulawula izinga lokushisa nesikhathi.

Ezingxenyeni ezigobekayo, sebenzisa i-laser micromachining ukususa izindawo ezonakele bese ulungisa nge-electroplating ekhethiwe noma i-conductive adhesive. Ezingxenyeni eziqinile, sebenzisa izintambo ze-jumper noma ufake ezinye izingxenye esikhundleni sazo.

Phinda wenze izivivinyo zokumelana nokusebenza kanye nokushisa kanye nokuhlolwa okubonakalayo. Qinisa izindawo ezilungisiwe (faka i-conformal coating, engeza amapuleti okuqinisa) bese wenza izivivinyo zemvelo uma kudingeka.

Ukulungisa kubiza kakhulu uma kunomonakalo omncane; ukuphinda kukhiqizwe kungcono uma kunomonakalo onamaleya amaningi noma omkhulu. Izindleko zokulungisa zingaba ngu-30%-70% wezindleko zokukhiqiza.

Vikela izindawo ezingalungiswanga ngezinto zokuvikela ukushisa. Sebenzisa amathuluzi amancane, angabukhali ukuze ugweme ukuklwebha izingxenye ezigobekayo, bese uhlanza izinto ezisele ezingcolisayo.

Inani lezendlalelo, usayizi, ubunzima benqubo (isb., ama-vias angaboni/angcwatshwe, ukuvimbela okunembe kakhulu), ukukhethwa kwezinto, ubuningi be-oda. Izinqubo zibalelwa ku-30%-50%.

Lungiselela umklamo ukuze unciphise izendlalelo nezinqubo ezikhethekile. Khetha izinto zokwakha ezingabizi kakhulu, wandise usayizi weqoqo, bese uxoxisana ngezinhlelo ezikhethekile nabaphakeli.

Izinsuku eziyi-10-15 zemikhiqizo ejwayelekile, izinsuku ezingama-20-30 zemikhiqizo eyinkimbinkimbi, kanye nezinsuku ezi-5-7 zama-oda aphuthumayo (nezindleko ezikhuphukile).

Ukuhlanganiswa okuphezulu kobuningi, imiklamo emincane nelula (isb., i-Anylayer HDI), izinto eziguquguqukayo ezine-dielectric constant ephansi kanye nokuguquguquka okuphezulu, kanye nokuhlanganiswa nokupakishwa okuthuthukisiwe njenge-SiP.

Ukuhlangabezana nezidingo zokudlulisa isignali ezivame kakhulu nezisheshayo, ukuxazulula izinkinga zokunciphisa kanye nokukhuluma nge-crosstalk, kanye nokuthuthukisa ukumelana nokugoba kanye nokuthembeka kwezingxenye eziguquguqukayo.

I-AI ithuthukisa ukwakheka futhi ibikezela amaphutha. Ukufunda komshini kulungisa amapharamitha enqubo, kanti ukuhlolwa okubonakalayo kwe-AI kuthuthukisa ukusebenza kahle kokuqaphela amaphutha.

Ukuthobela i-RoHS, i-REACH, njll., imikhawulo ezintweni eziyingozi, ukunciphisa ukukhishwa kwamanzi amdaka/igesi, kanye nokusetshenziswa kwezinto/izinqubo ezinobungani nemvelo.

Ukuthembeka okuphezulu, ukuhambisana kwezinto eziphilayo, isitifiketi se-ISO 13485, izidingo eziqinile ze-EMC, kanye nokumelana nokuhlanza okushisa okuphezulu/ukucindezela.