SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Shin matsin lamba na injin ɗaukar kaya zai iya rama rashin ingancin haɗin gwiwar SOIC da gubar?

Sai dai a ɗan gyara kaɗan a cikin ±0.05mm. Ana buƙatar mayar da sassan da suka wuce gona da iri ga mai samar da kayayyaki don guje wa karyewar fil sakamakon sanyawa da aka yi.
2. Ta yaya za a guji karkacewa a ƙarshen ɓangarorin SOIC na jiki guda biyu yayin sanyawa?

Yi amfani da yanayin "tallafin tsakiya + ƙulle-ƙulle biyu". Bututun injin da za a zaɓa da sanyawa yana buƙatar ya taɓa tsakiya da ƙarshen ɓangaren a lokaci guda don tabbatar da daidaiton matsin lamba.
3. Yadda ake daidaita kauri na buga manna mai solder don sanya QFP mai kyau (ƙananan ramukan gubar ≤0.4mm)?

Ya kamata a rage kauri zuwa 60–90μm domin gujewa taruwar man da ke sa a haɗa shi. Ana ba da shawarar a yi amfani da stencil mai siffar lantarki.
4. Shin an yarda da gyaran hannu ga abubuwan da aka canza na QFP bayan an sanya su?

Ana ba da damar ɗan gyara (canji ≤0.1mm) kafin a sake haɗa shi da ruwa, amma yana buƙatar a taimaka masa da wani abu mai kama da tweezer da aka tsoma a cikin ruwa don guje wa gurɓata kushin.
5. Za a iya gyara man shafawa mai narkewa da ya ɓace a kan faifan zafi na QFN ta hanyar haɗa shi da sandar bayan gida?

Ba a ba da shawarar yin solder a bayan gida ba saboda ba za a iya duba haɗin solder na ƙasa da ido ba. Ana buƙatar cire kayan aikin kuma a sake buga manna solder ɗin.
6. Ta yaya za a guji "jefa kabari" da "abin da ke faruwa a Manhattan" a cikin wurin da aka sanya QFN?

Tabbatar cewa bambancin adadin manna na solder a ƙarshen duka sassan shine ≤3%, kuma rage yawan dumama na solder zuwa ≤1.5℃/s don rage matsin lamba mara daidaituwa na zafi.
7. Za a iya amfani da tsaftacewar ultrasonic kafin a sanya ƙwallan solder na BGA da aka yi oxidized?

Ba a ba da shawarar yin amfani da shi ba domin yana iya lalata saman murfin ƙwallon solder. Ana buƙatar amfani da kwararar ruwa ta musamman (kamar nau'in da ba shi da tsafta) don inganta danshi.
8. Yadda za a rage rugujewar ƙwallon solder ta hanyar saita sigogin injin da aka zaɓa da kuma sanyawa?

Rage matsin lamba zuwa 0.05–0.1N, kuma jinkirta lokacin sakin bututun (0.2–0.5s) don guje wa lalacewar ƙwallon solder a ƙarƙashin matsin lamba.
9. Wane matakin injin tsotsa ake buƙata don sanya uBGA (diamita na ƙwallon solder ≤0.3mm)?

Matakan injin yana buƙatar zama ≥ - 80kPa don tabbatar da isasshen shaƙar ƙananan abubuwa. A lokaci guda, ya kamata a saita na'urar gano ɓuɓɓuga.
10. Shin ana buƙatar cikakken tarkacen allo idan an sami abubuwan uBGA tare da ƙwallan solder da suka ɓace bayan an sanya su?

Idan adadin ƙwallon solder da suka ɓace ya kai ≤5% kuma ba su da mahimmanci, ana iya amfani da gyaran laser da ball - cikewa; in ba haka ba, ana buƙatar a goge allon.
11. Me yasa ake buƙatar "maganin tsufa kafin tsufa" ga abubuwan da ke cikin CGA kafin a sanya su?

Fakitin yumbu suna da sauƙin sha danshi. Ana buƙatar a gasa su a zafin 150℃ na tsawon awanni 8 don kawar da damuwa ta ciki da kuma rage yawan danshi zuwa ƙasa da 0.1%.
12. Ta yaya bambancin CTE tsakanin CGA da PCB ke shafar daidaiton sanyawa?

Idan bambancin CTE ya fi 10×10⁻⁶/℃, ana buƙatar ƙara tsarin sanyaya a hankali (ƙimar ≤1℃/s) bayan an sake haɗa shi don rage tsagewar haɗin gwiwa na solder.
13. Za a iya amfani da bututun BGA na yau da kullun don sanya sassan LGA?

A'a. Tunda faifan LGA ba su da ƙwallan solder, ana buƙatar bututun feshi mai firikwensin matsi don tabbatar da matsin lamba iri ɗaya.
14. Menene tasirin kauri na saman faifan LGA akan amincin wurin da aka sanya shi?

Ya kamata layin da aka yi da zinare ya zama ≥3μm, kuma layin da aka yi da nickel ya kamata ya zama ≥5μm. In ba haka ba, yawan juriyar hulɗa na iya haifar da raguwar sigina ko gazawar zafi cikin sauƙi.
15. Ta yaya za a guji lahani na "jingina" a cikin sanya sassan CSP?

Ya kamata a daidaita tsakiyar bututun bututun da tsakiyar nauyi na kayan (ɓacewa ≤0.01mm), kuma a kunna aikin gano yanayin kayan aikin injin ɗaukar kaya da wuri.
16. Waɗanne halaye ya kamata na'urar tallafawa PCB ta kasance don sanya CSP mai sassauƙa?

Ana buƙatar fil ɗin tallafi mai laushi (ƙarfin bakin teku 60-70) don guje wa matsewar sassan da ke haifar da lanƙwasawar substrate.
17. Menene tasirin gurɓatar ruwan tabarau na kyamara akan gano gubar QFP?

Tabon ruwan tabarau zai haifar da kuskuren gane gubar fiye da 0.02mm. Yana buƙatar tsaftace shi da cikakken ethanol sau ɗaya a mako.
18. Ta yaya za a tabbatar da ingancin haɗin haɗin solder na ƙasa bayan sake yin aikin sassan QFN?

Ana amfani da SAM (Scanning Acoustic Microscopy) don gano ɓarna a mahaɗin haɗin solder. Yankin ɓarna ya kamata ya zama ≤10% na yankin faifan.
19. Menene babban bambanci tsakanin tsarin jujjuya guntu da tsarin sanya CSP?

Juyawan juye-juye yana buƙatar cikakken iko na daidaita ƙwallan solder da ƙusoshi (daidaitawa ≤±0.002mm), kuma ana buƙatar amfani da tsarin cika ƙasa.
20. Menene fa'idodin amfani da haɗin eutectic na injin tsotsa a cikin wurin sanya LGA?

Zai iya cimma walda mara walda, tare da ƙimar rashin aikin haɗin gwiwa na solder
21. Menene sabuwar fasahar sanya photon don sanya BGA?

Yana amfani da hasken laser don sarrafa sassan kai tsaye (daidai ≤±0.001mm), ba tare da buƙatar bututun ƙarfe na injiniya ba, kuma ya dace da marufi na nanoscale.
22. Menene ƙimar aikace-aikacen tagwayen dijital a cikin tsarin sanyawa?

Yana iya kwaikwayon tsarin sanyawa a ainihin lokaci, yana annabta rarrabawar damuwa na abubuwan haɗin, da kuma inganta sigogi a gaba don rage haɗarin gazawar haɗin gwiwa na solder.
23. Waɗanne matakai na wucin gadi ya kamata a ɗauka yayin sanya abubuwan CGA a cikin yanayin zafi mai yawa (>30℃)?

Ƙara na'urorin sanyaya iska na gida (ana sarrafa zafin jiki a 23±2℃), kuma a lokaci guda, rage lokacin fallasa abubuwan haɗin bayan buɗewa (≤ mintuna 30) don guje wa ƙara yawan iskar shaka ta ƙwallon solder.
24. Waɗanne hanyoyin hana danshi ne ake da su don sanya sassan QFN a wuraren da ke da zafi sosai (RH>70%)?

① Ana buƙatar a gasa PCB ɗin a zafin 120℃ na tsawon awanni 4 kafin a buga man shafawa da aka yi da solder; ② Ya kamata a saka kayan aiki nan da nan bayan buɗewa, kuma a saita na'urar cire danshi (RH≤40%) a cikin kayan aikin.
25. Wane tsari ake buƙata don gyaran kushin PCB lokacin sake sanya sassan BGA?

Ana buƙatar tsaftace ragowar solder da kirtani mai cire solder, kuma ana buƙatar cire oxides ta hanyar tsaftace plasma don tabbatar da cewa tsatsa ta saman Ra na kushin ya kai ≤1.6μm.

SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Shin matsin lamba na injin ɗaukar kaya zai iya rama rashin ingancin haɗin gwiwar SOIC da gubar?

2. Ta yaya za a guji karkacewa a ƙarshen ɓangarorin SOIC na jiki guda biyu yayin sanyawa?

3. Yadda ake daidaita kauri na buga manna mai solder don sanya QFP mai kyau (ƙananan ramukan gubar ≤0.4mm)?

4. Shin an yarda da gyaran hannu ga abubuwan da aka canza na QFP bayan an sanya su?

5. Za a iya gyara man shafawa mai narkewa da ya ɓace a kan faifan zafi na QFN ta hanyar haɗa shi da sandar bayan gida?

6. Ta yaya za a guji "jefa kabari" da "abin da ke faruwa a Manhattan" a cikin wurin da aka sanya QFN?

7. Za a iya amfani da tsaftacewar ultrasonic kafin a sanya ƙwallan solder na BGA da aka yi oxidized?

8. Yadda za a rage rugujewar ƙwallon solder ta hanyar saita sigogin injin da aka zaɓa da kuma sanyawa?

9. Wane matakin injin tsotsa ake buƙata don sanya uBGA (diamita na ƙwallon solder ≤0.3mm)?

10. Shin ana buƙatar cikakken tarkacen allo idan an sami abubuwan uBGA tare da ƙwallan solder da suka ɓace bayan an sanya su?

11. Me yasa ake buƙatar "maganin tsufa kafin tsufa" ga abubuwan da ke cikin CGA kafin a sanya su?

12. Ta yaya bambancin CTE tsakanin CGA da PCB ke shafar daidaiton sanyawa?

13. Za a iya amfani da bututun BGA na yau da kullun don sanya sassan LGA?

14. Menene tasirin kauri na saman faifan LGA akan amincin wurin da aka sanya shi?

15. Ta yaya za a guji lahani na "jingina" a cikin sanya sassan CSP?

16. Waɗanne halaye ya kamata na'urar tallafawa PCB ta kasance don sanya CSP mai sassauƙa?

17. Menene tasirin gurɓatar ruwan tabarau na kyamara akan gano gubar QFP?

18. Ta yaya za a tabbatar da ingancin haɗin haɗin solder na ƙasa bayan sake yin aikin sassan QFN?

19. Menene babban bambanci tsakanin tsarin jujjuya guntu da tsarin sanya CSP?

20. Menene fa'idodin amfani da haɗin eutectic na injin tsotsa a cikin wurin sanya LGA?

21. Menene sabuwar fasahar sanya photon don sanya BGA?

22. Menene ƙimar aikace-aikacen tagwayen dijital a cikin tsarin sanyawa?

23. Waɗanne matakai na wucin gadi ya kamata a ɗauka yayin sanya abubuwan CGA a cikin yanayin zafi mai yawa (>30℃)?

24. Waɗanne hanyoyin hana danshi ne ake da su don sanya sassan QFN a wuraren da ke da zafi sosai (RH>70%)?

25. Wane tsari ake buƙata don gyaran kushin PCB lokacin sake sanya sassan BGA?

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