Tsarin gyaran PCBA

Tsarin sake fasalin PCBA (Bugawa da Hukumar Zartar da Kewaya) hanya ce ta gano kurakurai a cikin haɗakar da ba su da kyau ko kuma gazawar aiki, cire abubuwan da suka lalace, da kuma sake haɗa kayan da suka cancanta. Kididdiga ta nuna cewa kusan kashi 5%-15% na PCBA suna buƙatar sake yin aiki yayin ƙera kayayyakin lantarki.

Sake yin aiki yana magance matsaloli kamar lalacewar soldering da gazawar sassan yayin samarwa, tare da buƙatar samfurin da aka gyara ya cika ƙa'idodin samarwa na asali; gyara yana magance kurakurai da tsufa, amfani mara kyau, da sauransu ke haifarwa a cikin samfuran da aka riga aka yi amfani da su. Kyakkyawan ƙa'idar masana'antu ita ce a sarrafa ƙimar lalacewar sake aiki cikin kashi 3%.

Tsarin da aka saba amfani da shi shine: gano lahani → wurin lahani → cire sassan → tsaftace kushin → sabon kayan haɗin → dubawa da tabbatarwa. Daga cikinsu, cire sassan da haɗin suna ɗaukar kashi 60%-70% na jimlar lokacin aiki.

Ko da a cikin layukan samar da SMT na zamani, har yanzu akwai ƙarancin lahani na soldering na 0.1%-1% (kamar soldering mai sanyi da gada). Sake yin aiki na iya inganta ƙimar cancantar samfura, rage farashin samarwa, da kuma guje wa rushe allon gaba ɗaya.

Zai iya inganta yawan amfanin da aka samu daga farko, rage farashin samarwa, tabbatar da ingancin samfura da aminci, da kuma rage farashin kulawa bayan an sayar da su. Bincike ya nuna cewa ingantattun hanyoyin sake yin aiki na iya ƙara ingancin samfura da kashi 20%-30%.

Ya ƙunshi tashoshin sake yin amfani da iska mai zafi, tashoshin sake yin amfani da infrared, tashoshin sake yin amfani da BGA, famfunan cire soldering, na'urorin microscope, da sauransu. Daga cikinsu, tashoshin sake yin amfani da BGA suna da daidaiton sarrafa zafin jiki na ±1℃, wanda ya dace da sake yin amfani da sassan BGA masu inganci.

Yana samar da iska mai zafi ta hanyar bututun dumama, sannan yana hura iska mai zafi a kan abubuwan da aka gyara don a sake yin aiki da su ta hanyar bututun, yana narkar da mai din don a cire ko a haɗa shi. Zafin iska mai zafi gabaɗaya ana iya daidaita shi daga 200-450℃, tare da saurin iska na 5-50L/min.

Tashoshin gyaran BGA suna da ayyukan sarrafa zafin jiki masu zaman kansu don yankuna daban-daban na zafin jiki, wanda ke ba da damar sarrafa lanƙwasa mai rikitarwa, wanda ya dace da na'urori masu kunshe kamar BGA da CSP; galibi ana amfani da tashoshin gyaran iska mai zafi don fakitin gargajiya kamar QFP da SOP. Farashin tashar gyaran BGA ya ninka sau 3-5 fiye da tashar gyaran iska mai zafi ta yau da kullun.

An raba su zuwa famfunan cire soldering da hannu, famfunan cire soldering na lantarki, da bindigogin cire soldering na injin tsotsar iska. famfunan cire soldering da hannu sun dace da cire ƙananan haɗin solder, famfunan cire soldering na lantarki sun fi inganci, kuma bindigogin cire soldering na injin tsotsar iska sun dace da sassan fil da yawa. famfunan cire soldering na lantarki sun fi saurin cire soldering sau 3-5 fiye da na hannu.

Ga ƙananan na'urori da aka naɗe kamar 0201 da 01005, ana buƙatar na'urar hangen nesa mai girman girma sau 50-100; ga na'urori da aka naɗe na gargajiya, girman girma sau 10-30 ya isa. Na'urorin hangen nesa masu girman girma sun fi tsada sau 2-3 fiye da na'urori masu ƙarancin girman girma.

An saita shi bisa ga marufi da nau'in solder. Ga solder Sn63Pb37, zafin cirewa gabaɗaya shine 350-380℃, kuma zafin solder shine 320-350℃; ga solder mara gubar (kamar SAC305), zafin cirewa shine 380-420℃, kuma zafin solder shine 350-380℃. Zafin jiki mai yawa yana lalata sassan cikin sauƙi, yayin da ƙarancin zafin jiki yana hana solder narkewa.

Yawanci ya haɗa da yankin dumama (ƙarfin dumama 1-3℃/s, zafin jiki 120-150℃), yankin jiƙa (150-180℃, 60-120s), yankin sake kwarara (zafin zafi 217-235℃, ana kiyaye shi na tsawon 30-60s), da yankin sanyaya (ƙarfin sanyaya 2-4℃/s). Daidaita yanayin zafin jiki mara kyau na iya haifar da matsaloli kamar haɗa BGA da fashewar ƙwallon solder.

Saurin iska mai yawa zai iya hura ƙananan sassa ko kuma ya haifar da fesawar solder; ƙarancin saurin iska mai yawa yana haifar da rashin isasshen canja wurin zafi. Gabaɗaya, saurin iska na fakitin 0402 da sama an saita shi a 10-20L/min, kuma ga 0201 da ƙasa, shine 5-10L/min.

Ana ba da shawarar cewa lokacin da ake soya haɗin solder ɗaya bai wuce daƙiƙa 3 ba, kuma ci gaba da soya ba zai wuce daƙiƙa 10 ba. Tsawon lokacin soya yana ƙara haɗarin ɓallewar foil ɗin jan ƙarfe na PCB da kashi 30% da kuma yiwuwar lalacewar sassan da kashi 25%.

Daidaita bisa ga girman PCBA da yawan sassan, gabaɗaya tare da yawan ƙarfin 1-3W/cm². Ƙarfin da ya wuce kima na iya haifar da zafi fiye da kima da nakasa na PCB, yayin da ƙarancin ƙarfi yana haifar da ƙarancin ingancin dumama.

Yi amfani da wurin gyaran iska mai zafi, ka nuna bututun a kan fil ɗin, ka dumama a 350-380℃ tare da saurin iska na 15-20L/min, sannan ka cire kayan da abin ya shafa da tweezers bayan da abin ya narke. Bayan cirewa, ka tsaftace faifan da laƙa mai cire siliki.

Da farko, saita lanƙwasa mai dacewa da yanayin zafi. Bayan ƙwallon solder sun narke gaba ɗaya, a hankali cire BGA da alkalami mai tsotsa; tsaftace ragowar solder ɗin da ke kan faifan sannan a sake yin ball ta amfani da manna solder. Nasarar cire BGA shine kashi 85% saboda daidaita lanƙwasa zafin.

Yi rikodin alkiblar polarity na ɓangaren don guje wa shigarwar baya; kula da dumama iri ɗaya yayin cirewa don hana fashewar sassan saboda yawan zafi na gida. Shigar da polarity mara daidai yana ƙara yawan gazawar samfur da kashi 40%.

A irin waɗannan yanayi, ana buƙatar duba X-ray don tantance matsayin haɗin haɗin solder, kuma ana amfani da hanyoyin dumama na gida (kamar dumama laser) don cirewa. Yana da matuƙar wahala, tare da nasarar kashi 60%-70% kawai.

Kula da zafin dumama da lokaci, kuma a guji maimaita dumama a wuri ɗaya; yi amfani da kayan aiki masu dacewa, kamar amfani da sandar pry don taimakawa wajen cire manyan kayan aiki don rage jan PCB. Aiki mai kyau na iya rage yawan lalacewar PCB da kashi 50%.

Tsaftace ragowar mai naɗewa a kan kushin ta amfani da layar cire mai naɗewa da ƙarfe mai naɗewa: jiƙa layar a cikin ruwa, sanya ta a kan kushin, sannan a dumama da ƙarfen don shanye mai naɗewa. Haɗa faɗin layar da kushin don guje wa tsaftacewa mai yawa ko rashin isasshen tsaftacewa.

A hankali a shafa yashi a saman da aka yi oxidized da takarda mai laushi, a shafa ruwa mai yawa, sannan a yi zafi don dawo da ƙarfin solder. Famfon da ba a yi musu magani ba na iya haifar da lahani na solder da kashi 80%.

Don cirewa daga wani ɓangare, yi amfani da wayoyi masu jumper; don cirewa gaba ɗaya, sake yin faifan (rufe jan ƙarfe, rufin abin rufe fuska na solder) kuma gwada aikin lantarki bayan gyara.

Yi amfani da ƙarshen ƙarfe mai siffar ƙwanƙwasa don daidaita yawan ƙwanƙwasa, sannan ka yi yashi idan ya cancanta. Dole ne kuskuren lanƙwasa ya kasance cikin ±0.05mm don guje wa matsalolin ƙwanƙwasa.

Eh. Yi amfani da ethanol mai ruwa ko kuma kayan tsaftacewa na musamman don cire ragowar kwararar ruwa da ƙazanta, don guje wa ƙaruwar lahani na soldering da kuma lalata PCB da kashi 20%.

Duba ƙayyadaddun kayan aikin, a naɗe faifan, sannan a shirya kayan aiki masu dacewa da kuma kwararar ruwa. Rashin isasshen shiri na iya haifar da raguwar aikin da kashi 30%.

Yi amfani da na'urar hangen nesa da kuma wurin gyaran iska mai zafi ko kuma ƙarfe mai nuna ƙarfi. Da farko gyara fil ɗaya, sannan a haɗa sauran don tabbatar da daidaiton wurin.

Yi amfani da X-ray don duba haɗin ƙwallon solder (rage rashin aiki ≤5%) da kuma multimeter don ci gaba da amfani da wutar lantarki. X-ray yana gano sama da kashi 90% na lahani.

A gyara sassan da manne ko flux kafin a haɗa su, sannan a yi zafi daidai gwargwado don guje wa matsin zafi. Canja wurin aiki yana haifar da 15%-20% na lahani na haɗa su.

Gilashin tagulla suna da sauƙin haɗawa; gilashin ƙarfe suna buƙatar yin tin kafin a fara yin tin; gilashin ƙarfe suna buƙatar daidaitawa. Gilashin ƙarfe marasa magani suna da ƙimar lahani na yin tin da kashi 70%.

Ya haɗa da duba gani, gwaje-gwajen aikin lantarki (ci gaba, juriya ga rufin), da gwajin aiki. Duba gani ya gano kashi 70%-80% na lahani bayyanannu.

Duba ko akwai cikakkun haɗin solder masu santsi ba tare da solder mai sanyi, gadoji, ko kankara ba; tabbatar da cewa an solder da dukkan abubuwan da ke cikinsa ba tare da lalacewa ba. Ana buƙatar bin ƙa'idodin IPC-A-610.

Yana gano ingancin haɗin haɗin solder na ciki na abubuwan BGA/CSP, yana gano soldering mai sanyi, ƙwallan solder da suka fashe, da kuma voids, tare da ƙimar gano lahani sama da kashi 95% ga matsalolin ciki.

Yana gwada aikin lantarki ta hanyar amfani da kayan haɗin ƙusa, gano matsalolin gajerun wando, buɗewa, da kuma sigogin kayan aiki, wanda ya shafi kashi 80%-90% na haɗin lantarki.

Haɗa PCBA cikin tsarin da zai yi kwaikwayon yanayin aiki na gaske da kuma gwada aikin, yana gano kashi 90% na gazawar aiki da walda ke haifarwa.

Dalilai: kushin da ba su da tsabta, rashin isasshen zafin jiki, da kuma kwararar da ba ta da inganci. Magani: sake tsaftace kushin, daidaita zafin jiki/lokaci, da kuma maye gurbin kwararar da wasu hanyoyin da suka dace.

Cire sinadarin solder mai yawa da wick/iron da ke cire solder, daidaita zafin solder da saurin iska don hana fesawa. Kulawa mai kyau yana cimma kashi 95% na gyaran.

Dalilan da ka iya haifarwa: lalacewar sassan, zafi fiye da kima yayin soldering, da kuma juyewar polarity. Kididdiga ta nuna cewa lalacewar sassan ta kai kashi 40%, zafi fiye da kima kuma kashi 30%.

Gyara ƙananan nakasa ta hanyar dumamawa; maye gurbin PCBs don mummunan nakasa. Sarrafa zafin jiki/lokaci yana rage ƙimar nakasa da kashi 60%.

Yi amfani da benci mai aminci ga ESD, madaurin wuyan hannu, da kuma tweezers; kula da danshi mai kyau na RH 40%-60% don rage lalacewar ESD da kashi 90%.

Dole ne masu aiki su sanya tabarau/safofin hannu masu kariya don hana ƙonewa; kayan aikin ƙasa don guje wa girgizar lantarki; sanya alama a kan kayan aikin da ke da zafin jiki mai zafi tare da alamun gargaɗi.

Abubuwan da ke cikin sharar gida, solder, da flux shara ne masu haɗari, waɗanda ke buƙatar zubar da su ta hanyar ƙwararrun na'urori; tsaftace ruwan shara dole ne ya cika ƙa'idodin fitar da shara na GB 8978.

Yawancin kwararar ruwa suna da sauƙin kamawa kuma ya kamata a adana su a wurare masu sanyi da iska nesa da inda wuta ke fitowa; a guji taɓa fata/ido kuma a wanke da ruwa nan da nan idan ya bayyana.

A riƙa tsaftace ragowar solder da kwararar ruwa daga kayan aiki akai-akai; shigar da kariyar zafi mai yawa don kashe wuta ta atomatik lokacin da aka wuce iyakokin zafin jiki.

Dole ne ya bi umarnin RoHS, ya takaita abubuwa masu haɗari kamar gubar/mercury/cadmium, ya rage yawan kwararar ruwa, da kuma amfani da magungunan tsaftacewa masu dacewa da muhalli.

Inganta hanyoyin aiki, rungumi kayan aiki na atomatik, da kuma horar da masu aiki. Kayan aiki na atomatik na iya ƙara inganci da kashi 30%-50%.

Rage sake yin aiki na biyu saboda rashin aiki yadda ya kamata, zaɓi kayan aiki/kayayyaki cikin hikima, sannan ka inganta hanyoyin aiki don rage yawan lahani na farko. Sake yin aiki na biyu ya kai kashi 25%-35% na jimillar kuɗaɗen da ake kashewa.

Inganta sigogin tsari, zaɓi kwarara/mai siyarwa da ya dace, da kuma ƙarfafa dubawa na farko da kuma samfurin da ake amfani da shi a cikin tsari. Inganta tsari na iya rage ƙimar lahani da kashi 40%-60%.

Yana inganta daidaiton inganci, yana rage kuskuren ɗan adam, yana sauƙaƙa horar da sabbin ma'aikata, kuma yana haɓaka inganci. Daidaita daidaito na iya rage canjin ƙimar lahani da kashi 50%.

Gudanar da gwaje-gwajen tsufa (awanni 24-100) da gwaje-gwajen muhalli (zafin jiki/danshi/girgiza) akan samfuran da aka sake yin aiki don tantance aminci na dogon lokaci.

Ya zama dole a yi la'akari da buƙatun sake fasalin sassan SMT da THT. Lokacin cire sassan THT, ya kamata a mai da hankali kan tasirin da ke kan na'urorin SMT. Wahalar sake fasalin ta fi ta allunan SMT tsantsa da kashi 30%-50%.

Kayan yana da laushi kuma yana da sauƙin lalacewa, don haka ana buƙatar kayan gyara na musamman don gyarawa; zafin dumama ya kamata ya zama ƙasa da 10-20℃ fiye da na PCB mai tauri don guje wa lalata substrate.

Da'irar ciki tana da sarkakiya, kuma canja wurin zafi ba shi da daidaito yayin dumama, wanda ke iya haifar da gajeren da'ira ko buɗewar da'irar Layer na ciki; gyaran da'irar yana da wahala, kuma nasarar sake yin aiki shine kashi 50%-60% kawai.

Cire murfin kariya da farko kuma ka kare sassan ciki. Sake shigar da shi bayan an sake yin aiki don tabbatar da tasirin kariya. Aiki mara kyau zai shafi dacewar lantarki.

Yana da kyakkyawan juriyar zafi da kuma karyewar iska mai yawa. Yana buƙatar dumamawa cikin sauri don guje wa tsagewa sakamakon yawan damuwa na gida, kuma ana iya sarrafa saurin dumama a 5-10℃/s.

Suna buƙatar ƙwarewa a fannoni kamar gano sassan, fasahar walda, sarrafa kayan aiki, da kuma nazarin kurakurai, kuma su saba da ƙa'idodi kamar IPC-A-61. Yawan lahani na ma'aikatan da aka horar da su a ƙwararru ya yi ƙasa da kashi 40% idan aka kwatanta da na waɗanda suka fara aiki.

Ya haɗa da horon nazari (ilimin tsari, ƙayyadaddun bayanai) da horon aiki (aikin kayan aiki, aikin walda), tare da kimantawa bayan horo, kuma zagayowar gabaɗaya makonni 1-2 ne.

Ya haɗa da umarnin tsarin sake yin aiki, littattafan aiki na kayan aiki, ƙa'idodin duba inganci, bayanan sake yin aiki, da sauransu, waɗanda zasu iya inganta bin diddigin matsaloli da kuma ingancin nazarin su.

Saita wuraren sarrafa maɓallan (kamar cire kayan aiki, tsaftace kushin, walda, da sauransu), sannan a gudanar da bincike na farko, duba sintiri da kuma duba kayan da aka gama, wanda zai iya rage yawan lahani da kashi 30%-40%.

Tattara bayanan sake aiki don nazarin matsaloli, gudanar da gwaje-gwajen tsari don inganta sigogi, da kuma gabatar da sabbin fasahohi da kayan aiki, waɗanda zasu iya ƙara inganci da kashi 10%-15% kowace shekara.

Zaɓi bisa ga nau'in solder na PCBA na asali, ba da fifiko ga samfuran da ke da irin wannan abun da ke ciki, kuma la'akari da aiki kamar wurin narkewa, danshi, da aminci.

An raba su zuwa kwararar da ba ta da tsabta, kwararar da ke narkewa cikin ruwa da kuma kwararar da ta dogara da rosin. Ruwan da ba ya da tsabta ya dace da lokutan da ba su da ƙarancin tsafta, kuma ruwan da ke narkewa cikin ruwa ya dace da tsaftacewa amma ya kamata a lura da ragowar.

Ana amfani da shi don gyara ƙananan sassa ko hana ƙaura yayin walda, kuma yana buƙatar samun ƙarfin haɗin gwiwa mai kyau (≥5N/mm²) da juriya ga zafin jiki.

Zaɓi bisa ga nau'in flux (kamar isopropyl alcohol don rosin-based), kuma yi la'akari da kariyar muhalli, tsatsa da kuma canjin yanayi.

Ya zama dole a duba samfurin, ƙayyadaddun bayanai, kamanni, aikin lantarki, da sauransu don tabbatar da daidaito da abubuwan asali. Rashin kyawun kayan da ke shigowa zai ƙara yawan gazawar sake aiki da kashi 20%.

Tsaftace dattin da ke cikin bututun iska don hana toshewa, duba yanayin bututun dumama kuma daidaita zafin jiki akai-akai, sannan a shafa mai ga sassan injina. Toshewar bututun iska zai ƙara yawan lahani na walda da kusan kashi 15%.

Ana daidaita zafin jiki sau ɗaya a wata (kuskure ≤±1℃), kuma ana daidaita tsayin Z-axis sau ɗaya a kwata (daidaitawa ≤±0.05mm). Rashin daidaitawa na iya ƙara ƙimar gurɓataccen walda da kashi 20%.

Rashin isasshen tsotsa: maye gurbin zoben hatimi don famfon cire solder da hannu, duba famfon tsotsa ko tsaftace toshewar famfon cire solder na lantarki; ba za a iya cire solder ba: duba ko bututun ya lalace ko ya toshe, maye gurbin kuma tsaftace ragowar solder.

Gabaɗaya, ana maye gurbinsa duk bayan shekara 1-2 bisa ga yawan amfani. Bayan tsufa, daidaiton zafin jiki yana raguwa, kuma ƙimar lalacewar walda tana ƙaruwa da kusan kashi 12%.

A riƙa tsaftace ruwan tabarau akai-akai da takarda ta musamman ta ruwan tabarau, a guji karo don hana matsewar abubuwan gani, sannan a daidaita tsawon hasken kowace shekara don tabbatar da cewa an yi hoton sosai.

Da farko a yi amfani da sinadarai masu narkewa (kamar acetone) don narkar da kayan rufewa, a sake yin aiki bisa ga tsarin da aka saba yi bayan an cire su, sannan a sake narkar da su bayan an kammala su, a kula da yanayin ruwa da kuma yanayin warkar da kayan.

An fi ba da fifiko ga cire manyan sassan da ke samar da zafi mai yawa don guje wa shafar sassan da aka gyara; bi ƙa'idar daga sauƙi zuwa mai wahala don rage haɗari.

Ana buƙatar kayan aiki na musamman (kamar tashar gyaran guntu mai juyawa), kuma ana amfani da fasahar dumama laser ko walda ta ultrasonic. Ana ƙayyade ma'auni ta hanyar gwaji kafin a fara aiki, kuma ƙimar nasarar yawanci shine kashi 60%-70%.

Yi amfani da na'urar multimeter don gwajin ci gaba don gano wurin da'irar gajere, kuma duba da warware matsaloli kamar gadar ragowar solder, kuskuren daidaita fil ɗin sassan, da lalacewar da'irar PCB.

Duba ko tushen ƙasa yana da kyau kuma an sanya murfin kariya a wurinsa, duba ko layin siginar ya lalace yayin walda, yi amfani da na'urar nazarin bakan don gano tushen tsangwama, kuma ɗauki matakai kamar kariya da tacewa.

Yi nazarin bayanan sake aiki ta hanyar koyon injin don hango lahani, yi amfani da gane gani don gano abubuwan da ke da lahani ta atomatik, da kuma daidaita sigogin kayan aiki cikin hikima don inganta inganci da inganci.

Zai haɓaka zuwa ga haɗakar ayyuka masu inganci da ayyuka da yawa (kamar haɗa duba X-ray, dasa ƙwallo ta atomatik, walda, da sauransu), da kuma cimma haɗin kai da tsarin MES don inganta gudanarwa mai hankali.

Inganta hanyoyin tsaftacewa masu dacewa da muhalli, haɓaka kayan aiki masu ƙarancin amfani da makamashi, da kuma bincika fasahar sake fasalin da ba ta lalata ba don rage gurɓatawa da ɓarnar albarkatu.

Yana iya ƙera kayan aiki cikin sauri don sake yin aiki don rage farashi, kuma ana amfani da shi don gyara lalacewar PCB na gida (kamar buga layukan sarrafawa) don sauƙaƙe ayyuka masu rikitarwa.

Ci gaba da sarrafa dijital da kuma sa ido daga nesa na kayan aikin sake aiki, inganta hanyoyin aiki ta hanyar nazarin manyan bayanai, da kuma kafa tsarin bin diddigin samfura don inganta sarrafa inganci.