Gudanar da kayan walda

1. Menene rabon kayan aiki da fa'idodin aiki na solder SAC305 mara gubar da aka saba amfani da shi?

Abun da ke ciki: Sn96.5Ag3.0Cu0.5, wurin narkewa 217℃. Fa'idodi: 30% ya inganta juriya ga iskar shaka, ya bi umarnin muhalli na RoHS, ingantaccen aminci mai zafi, da riƙe ƙarfin injina fiye da 85% bayan tsufa a 150℃ na tsawon awanni 1000.
2. Ta yaya ma'aunin eutectic na ƙarfen solder ke shafar tsarin walda?

Masu haɗakar Eutectic (kamar Sn63Pb37) ba su da yankin zama tare da ruwa mai ƙarfi lokacin narkewa, tare da taga mai kunkuntar zafin walda, wanda ke buƙatar zafin jiki na sake haɗawa ya zama 50-70℃ sama da wurin narkewa; masu haɗakar da ba su da eutectic suna da yankin zama tare da ruwa mai ƙarfi, suna buƙatar daidaitaccen sarrafa zafin jiki don guje wa rashin isasshen haɗawa.
3. Ta yaya za a bambanta yanayin aikace-aikacen kwararar aiki tare da matakan aiki daban-daban?

Matsayin R (ƙarancin aiki): Yanayi masu tsafta kamar sararin samaniya da na likitanci, tare da juriyar rufin da ya rage ≥10¹²Ω;

Matsayin RA (matsakaicin aiki): Kayan lantarki na masu amfani, waɗanda ke da ikon sarrafa ƙimar lahani na walda ≤0.5%;

Matsayin SA (ƙarfin aiki): An yi wa saman da aka yi wa oxidizing sosai, wanda ke buƙatar tsaftacewa mai tsauri don hana tsatsa.
4. Menene ƙa'idodin abubuwan da ke cikin kwararar ruwa don wayar solder da tasirinsu akan walda?

Matsakaicin abun ciki: 1.0%-3.0%. Ƙarancin abun ciki yana haifar da rashin isasshen cire fim ɗin oxide, yana ƙara yawan lahani da 20%-30%; yawan abun ciki yana haifar da raguwar da ke shafar rufin, inda aka saba amfani da kashi 1.8%-2.2% a cikin haɗakar lantarki.
5. Ta yaya rarraba girman barbashi na foda na ƙarfe a cikin manna solder ke shafar aikin bugawa?

Nau'i na 3 (25-45μm): Ya dace da faifan da ke da tazara sama da 0.5mm, ƙimar lalacewar bugawa
Nau'i na 4 (20-38μm): Ya dace da tazara mai kyau na 0.3mm, wanda ke iya toshe stencil tare da sigogi marasa dacewa (yiwuwar + 15%).
6. Menene yanayin da aka yarda da shi na canjin yanayin zafi da danshi a cikin yanayin ajiya don manna solder?

Zafin jiki: 0-10℃ (cikin ±2℃ canjin yanayi), danshi: RH≤60%. Yawan canjin yanayi yana ƙaruwa da 5%-8% a kowace rana idan canjin yanayi ya wuce ±2℃, kuma yawan danshi yana hanzarta iskar shaka.
7. Menene matsakaicin lokacin ajiya na wayar solder da ba a buɗe ba?

Wayar solder mai ɗauke da gubar: Shekaru 3-5 (15-25℃, RH≤60%);

Wayar da ba ta da gubar: Shekaru 2-3. Iskar oxygen tana ƙaruwa bayan lokacin, tare da yiwuwar porosity ya tashi zuwa 10%-15%.
8. Me yasa ya kamata a adana kwararar ruwa daga haske?

Abubuwan da ke aiki na kwararar ruwa (kamar acid na halitta) suna ruɓewa da sauri lokacin da aka fallasa su ga haske, inda ayyukan ke raguwa da kashi 40% bayan wata 1 na fallasa haske, yayin da kashi 10%-15% kawai ke raguwa a cikin watanni 6 na ajiya ba tare da haske ba.
9. Me yasa aka haramta juyawa yayin dawo da zafin jiki na man shafawa mai laushi daga wurin ajiya mai sanyi?

Juyawa yana haifar da rashin daidaiton zafin ciki, wanda ke haifar da wargajewar gida da wuri ko kuma raguwar narkewar abubuwa marasa kyau. Bambancin danko ≤5% bayan ingantaccen murmurewa na tsawon awanni 4-6 na zafin jiki, yayin da juyawar 违规搅拌 (ragewar da ba ta dace ba) na iya haifar da karkacewa har zuwa 20%.
10. Menene zagayowar daidaitawa don masu rikodin zafin jiki da danshi a wuraren adana solder?

A daidaita duk bayan watanni 6 domin tabbatar da cewa akwai kuskuren zafin jiki ±1℃ da kuma kuskuren danshi ±3%RH, a guji yanayin ajiya da ba a iya sarrafawa ba.
11. Menene matsakaicin lokacin amfani da manna mai walƙiya da aka buɗe a kan injin bugawa?

Ci gaba da amfani bai kamata ya wuce awanni 8 a zafin ɗaki 20-25℃ da RH≤60%. Danko yana ƙaruwa da kashi 30%-50% idan aka wuce shi, tare da ƙimar lahani a bugu yana ƙaruwa zuwa kashi 15%-20%.
12. Ta yaya za a tantance zagayowar maye gurbin ruwan solder a cikin tankin solder na raƙuman ruwa?

Ƙayyade ta hanyar nauyin samarwa da adadin dattin solder, maye gurbin kowace PCB 500-1000㎡ da aka samar; maye gurbin a gaba idan abun ciki na jan ƙarfe ya fi 0.8%, in ba haka ba ƙimar lahani ta ƙaru da 25%-35%.
13. Menene alaƙar da ke tsakanin amfani da wayar solder da girman haɗin solder a cikin walda mai zaɓi?

Yawan amfani yana ƙaruwa da kashi 15%-20% ga kowace ƙaruwa ta 0.1mm a cikin diamita na haɗin haɗin da aka yi da ƙarfe. Ana iya amfani da shi ta hanyar ƙididdige girman haɗin da aka yi da ƙarfe (yawan SAC305 7.4g/cm³).
14. Menene mafi kyawun haɗin zafin ƙarfen da aka haɗa da lokacin da aka haɗa a cikin walda da hannu?

Zafin jiki: 350-380℃, lokaci: daƙiƙa 2-3. Fiye da daƙiƙa 400℃ ko fiye da daƙiƙa 5 yana lalata sassan jiki cikin sauƙi, ƙasa da 350℃ yana iya haifar da rashin isasshen soldering, tare da yuwuwar ƙaruwar lahani da kashi 40%.
15. Ta yaya kusurwar squeegee ke shafar ingancin bugawa yayin buga manna na solder?

Kusurwar 45°-60° ita ce mafi kyau. 60° mai yuwuwar fashewa da ƙanƙara, tare da ƙimar lahani yana ƙaruwa da 8%-10% ga kowane karkacewa na 5°.
16. Yadda ake gano ramukan ciki a cikin gidajen haɗin solder ta hanyar X-Ray?

X-Ray na iya gano ramuka masu diamita ≥0.1mm. Ma'aunin IPC-A-610: yankin ramuka ≤25% ga samfuran aji B, ≤15% ga aji C, tare da gurɓatattun ramuka masu yawa waɗanda ke shafar watsawar zafi da ƙarfi.
17. Menene sharuɗɗan da aka yarda da su da kuma jeri na karkacewa don gwajin danko na solder manna?

Yanayi: 25±0.5℃, saurin juyawa 5rpm, gwaji na daƙiƙa 60. Tsarin danko na SAC305: 80-120Pa·s, ana buƙatar daidaitawa idan karkacewa ta wuce ±15%.
18. Menene hanyoyin gwajin ƙarfin tensile da kuma sharuɗɗan cancantar haɗin solder?

Gwada da na'urar gwada ƙarfi a gudun 5mm/min. ≥0.5N don fakitin 0603, ≥1.5N don na'urorin QFP, ƙarancin ƙarfi da ke iya lalacewa yayin girgiza.
19. Yadda ake nazarin tsarin haɗin solder ta hanyar rarraba ƙarfe?

A duba a ƙarƙashin na'urar hangen nesa bayan niƙa da gogewa, a mai da hankali kan kauri na layin IMC (1-3μm ga SAC305), sama da 5μm yana sa haɗin haɗin solder ya yi rauni kuma ya rage tsawon rai da sama da 50%.
20. Menene ma'aunin gwajin tsaftar ion ga ragowar kwararar ruwa?

Gwaji ta hanyar amfani da ion chromatography, ragowar ion a kowace yanki ≤1.5μg/cm² (a daidai da NaCl), wuce gona da iri yana haifar da ƙarancin ƙaura ta hanyar lantarki.
21. Ta yaya saurin dumamawa a matakin kafin dumamawa na sake haɗawa da soldering ke shafar walda?

Yawan zafin jiki na 1-3℃/s ya dace. >5℃/s yana iya haifar da fashewar zafi a cikin sassan,
22. A cikin tsarin haɗa igiyoyi biyu, menene ayyuka da saitunan sigogi na igiyoyin gaba da igiyoyin baya?

Raƙuman gaba (raƙuman ruwa masu ƙarfi): Tsawon raƙuman ruwa 30-50mm, gudu 2-3m/min, kwararar ruwa da iska;

Raƙuman baya (raƙuman ruwa masu santsi): Tsawon raƙuman ruwa 20-30mm, gudu 1.5-2.5m/min, yana siffanta haɗin da aka haɗa da solder.
23. Yadda ake rage rugujewar manna mai laushi ta hanyar inganta ƙirar buɗe stencil?

Yi amfani da ƙofofi masu matakai da kusurwoyi masu zagaye da aka yanke ta hanyar laser. Rage buɗewar QFP mai girman 0.3mm da 10%-15% kuma ƙara kusurwoyi masu zagaye 0.05mm, rage ƙimar rugujewa daga 12% zuwa 3%-5%.
24. Menene tasirin kariyar nitrogen akan ingancin walda a cikin walda mai zaɓi?

Yanayin Nitrogen (abin da ke cikin iskar oxygen ƙasa da 1000ppm) yana rage iskar shaka, yana inganta danshi da daidaiton IMC, yana rage ƙimar lahani daga 5% zuwa 1%-2%, tare da ƙaruwar farashi da kashi 30%.
25. Yadda ake daidaita saurin sanyaya na sake haɗawa da solder bisa ga kauri na PCB?

Ga kowace ƙaruwar kauri ta PCB mai girman 0.5mm, rage saurin sanyaya da 1-2℃/s. Sanyaya da sauri (>5℃/s) ga allon da ke da kauri da ke iya fashewa, jinkirin da ya yi yawa yana shafar inganci kuma yana haifar da iskar shaka.
26. Menene ƙa'idar daidaitawa tsakanin saurin rushewar injin buga takardu da kuma dankowar manna mai solder?

Mafi girman danko, haka nan saurin rage gudu. Babban danko (>150Pa·s): 1-2mm/s, ƙarancin danko (
27. Menene alaƙar da ke tsakanin adadin yankunan zafin da ake sake haɗa su da kuma walda mai rikitarwa ta allon da'ira?

Kayan aiki masu yankuna 8 na zafin jiki ko fiye sun fi dacewa da allunan da'ira masu yawan yawa, suna inganta ƙimar cancanta daga 85% zuwa sama da 95% idan aka kwatanta da kayan aiki na yankuna 6, tare da ingantaccen sarrafa zafin jiki.
28. Menene tasirin na'urar juyawa a cikin tankin solder na raƙuman ruwa akan daidaiton ruwan solder?

Saurin juyawa na 20-40rpm yana ba da mafi kyawun daidaiton ruwa mai laushi. Bayan daina juyawa, bambancin zafin jiki tsakanin saman da ƙasan yadudduka yana ƙaruwa da 3-5℃ a kowace awa, tare da ƙaruwar karkacewar abun da ke ciki da ƙimar lahani da 10%-15%.
29. Menene tasirin ingancin feshi na bututun walda na zaɓi akan ƙananan haɗin solder?

Ya kamata a sarrafa daidaito a cikin ±0.01mg. Ga fakitin 0201, karkacewa daga >±0.02mg yana ƙara gajeren da'ira/rashin isasshen yuwuwar haɗakarwa da kashi 40%-50%, wanda hakan ke shafar yawan amfanin ƙasa sosai.
30. Menene kewayon sarrafa matsin lamba na tsarin ciyar da wayar solder?

Tashin hankali na 0.8-1
31. Menene tsari na yau da kullun da kuma matakan kariya don sake amfani da solder mara gubar?

Tsarin aiki: Tarin da aka rarraba → narkewa da cire ƙazanta → daidaita abun da ke ciki. Zafin narkewa 280-320℃, abun da ke cikin kwano ≥99.5% bayan cire ƙazanta. Hana gurɓatar ƙarfe mai nauyi; dole ne a rage ruwan shara kuma a haƙa shi don ya cika ƙa'idodin fitarwa na GB 8978-1996.
32. Menene manyan abubuwan da ke cikin iskar gas mai canzawa da kuma iyakokin da suke da su a wurin aiki?

Ya ƙunshi abietic acid da isopropanol. Iyakokin fallasa ga aiki: abietic acid 5mg/m³ (matsakaicin nauyin lokaci), isopropanol 980mg/m³. Sanya iska mai inganci don hana ƙaiƙayi a numfashi da jijiyoyi.
33. Menene ƙa'idar rarrabuwar shara mai haɗari da buƙatun zubar da shara ga kayan da aka yi amfani da su wajen tace shara?

An rarraba shi a matsayin HW49 (lambar 900-041-49), dole ne a zubar da shi ta hannun ƙwararrun ma'aikata, a bi ƙa'idodin Gudanar da Takardun Canja wurin Sharar Gida Mai Haɗari, kuma a hana haɗa shi da sharar gida.
34. Menene buƙatun matakin kariya daga fashewa ga wuraren adana solder?

Ana buƙatar matakin kariya daga fashewa Ex dⅡBT4 don adana kwararar mai ƙonewa. Yi amfani da hasken wuta/maɓallan wuta masu hana fashewa kuma a hana kayan aikin da ke samar da walƙiya. Rashin bin ƙa'ida yana ƙara haɗarin wuta/fashewa da kashi 30%-50%.
35. Ta yaya za a hana iskar shaka ta biyu daga dattin solder yayin ajiya?

A adana a cikin kwantena busasshe da aka rufe da sinadarin antioxidant mai 0.5%-1.0%BHT. Iskar oxygen tana ƙaruwa da kashi 50% cikin awanni 24 idan aka fallasa ta; ajiyar da aka rufe tana ƙara lokacin sake amfani da ita zuwa watanni 3-6.
36. Ta yaya za a rage farashi ta hanyar inganta kauri bugu na manna mai laushi?

Rage kauri daga 0.15mm zuwa 0.12mm a ƙarƙashin bin ƙa'idar inganci, rage amfani da kashi 20%-25%. Inganta DOE yana rage farashi ga kowace PCB da 0.3-0.5 RMB.
37. Menene matsakaicin asarar da masana'antu ke yi na ma'aunin ragewa da kuma rage wayoyi?

Matsakaicin masana'antu: 8%-12%. Matakai: Ciyar da waya ta atomatik (rage asara da 3-5%), ingantattun hanyoyin (rage simintin da babu komai da 15%-20%), sake amfani da waya mai sharar gida (ƙimar murmurewa 70%-80%), zai iya raguwa zuwa 5%-8%.
38. Menene tsarin kimantawa da kimantawa na aikin farashi don manna solder daga nau'ikan samfura daban-daban?

Alamomi: Farashin raka'a, abun da ke cikin ƙarfe (+5% farashin kowace +1%), ƙimar lahani na bugawa (-0.5 RMB/PCB kowace -1%), tsawon lokacin shiryayye (-3% farashin ajiya kowace +1 wata), wanda aka ƙididdige ta hanyar ma'aunin nauyi.
39. Yadda za a rage dattin da ke haɗa raƙuman ruwa ta hanyar inganta tsari?

Matakai: Kariyar Nitrogen (yana rage datti da kashi 40%-60%), man hana iskar shaka (yana rage yawan iskar shaka da kashi 50%-70%), sarrafa zafin jiki ±2℃, na iya rage datti daga kilogiram 5/kits zuwa kilogiram 2-3/kits.
40. Menene alaƙar da ke tsakanin jujjuyawar kayan da aka sayar da su da kuma mallakar jari?

Ƙara yawan jari daga sau 4 zuwa 6 a shekara yana rage farashin aikin jari da kashi 33%. Inganta inganci ta hanyar siyan JIT, inganta kayan aiki (rage kashi 20%-30%), da kuma rage tsawon lokacin aiki (rage kwanaki 15-20).
41. Waɗanne muhimman matakai ya kamata a mayar da hankali a kansu yayin binciken takaddun shaida na ISO 9001 na masu samar da solder?

Mayar da Hankali: Duba kayan da aka sarrafa (rufewa 100%), sarrafa samarwa (misali, lokacin haɗa man shafawa da aka yi da solder ≤5%), gwajin samfurin da aka gama (≥ abubuwa 10 a kowane tsari), sarrafa samfurin da ba ya dace da lokaci (lokaci ≥95%).
42. Ta yaya za a kimanta ƙwarewar bincike da ci gaban mai samar da kayayyaki ta hanyar binciken da ake yi a wurin?

Alamun kimantawa: Kayan aikin R&D (DSC, samuwar SEM), rabon ma'aikatan R&D (≥15%), adadin haƙƙin mallaka (≥3 sabo a kowace shekara), zagayowar haɓaka sabbin samfura (matsakaicin watanni ≤6).
43. Ta yaya za a tantance rabon ajiya mai inganci ga masu samar da solder?

Rabon: 5%-10% na adadin sayayya na shekara-shekara. Rage ƙimar lahani na rukuni fiye da 3%, dawo da shi bayan rukuni uku a jere don ƙarfafa ikon sarrafa inganci.
44. Waɗanne muhimman sigogin fasaha ne ya kamata a haɗa su cikin yarjejeniyar fasaha da masu samar da solder?

Ya haɗa da: Haɗin ƙarfe (misali, haƙurin SAC305 Sn±0.5%, Ag±0.2%, Cu±0.1%), wurin narkewa (217℃±3℃), danko (50-150Pa·s±10%), matakin aiki (misali, halide na RA ≤0.5%), buƙatun muhalli (RoHS 2.0), da sauransu.
45. Ta yaya ake sarrafa bayanan rukunin masu siyarwa ta hanyar tsarin bin diddigin inganci?

Bayanan tsarin: Lambar rukuni, ranar samarwa, abun da aka tsara, lokacin adanawa, da sauransu, waɗanda aka haɗa su da abubuwan ganowa na musamman na PCBA. Lokacin wurin matsala ya ragu daga awanni 24 zuwa ≤2.
46. Ta yaya nau'ikan manne na solder daban-daban ke shafar ingancin bugawa?

Matsewar Polyurethane: Mai sassauƙa, ya dace da ƙarancin ɗanko da kuma ƙaramin sautin (fina-fina
Matse ƙarfe: Babban tauri, ya dace da ɗanɗano mai yawa da kauri (kusurwa sama da 0.8mm, juriyar kauri ± 5μm).
47. Ta yaya za a kimanta ingancin hanyoyin sarrafa solder ta hanyar adadi?

Alamomi: Juya kaya (matakin da ya dace sau 8-10 a shekara), lokaci daga ɗaukar kaya zuwa layi (≤ awa 1), rabon lokacin aiki saboda matsalolin gudanarwa (
48. Yadda ake magance matsaloli daga mahangar kayan solder idan 大面积虚焊 (ƙarancin soldering) ya faru bayan walda PCBA?

Maudu'in magance matsala:

1. Duba idan sinadarin manne na solder ya kai kashi 90% (daidaitaccen sinadarin gubar), ƙarancin sa yana ƙara haɗarin yin solder da kashi 40%+;

2. Tabbatar da cewa aikin kwararar ruwa ya cika matakin RA, rashin isasshen aiki yana haifar da rashin danshi;

3. Tabbatar idan man shafawa mai laushi ya ƙare (rage danko/rage aiki).
49. Yadda ake zaɓar kayan solder masu dacewa don tabbatarwa yayin gwajin ƙananan rukuni na PCBA?

Dabaru:

1. Ba da fifiko ga tsarin solder iri ɗaya da samar da taro don tabbatar da ci gaba da aiwatarwa;

2. Ga samfuran da suka yi rikitarwa, zaɓi samfuran samfura 2-3 waɗanda ke da irin wannan aiki don kwatantawa;

3. Kimanta ta hanyar ƙimar lahani, bayanan ƙarfin tensile na haɗin gwiwa, da cikakken farashi.
50. Ta yaya za a tantance tasirin yanayin adana solder akan tsawon lokacin shiryayyensa?

Muhimman abubuwan da ke haifar da hakan:

- Rayuwar shiryayye tana raguwa da kashi 20% ga kowane 5℃ fiye da misali (misali, manna >10℃);

- Yawan iskar oxygen yana ƙaruwa da kashi 15% ga kowace ƙaruwar zafi ta 10% RH;

Yi nazarin alaƙar bayanai ta hanyar amfani da na'urar rikodin zafin jiki/danshi don hango ainihin lokacin shiryawa.
51. Ta yaya za a tantance ko za a maye gurbin wanka na solder yayin kula da tankin solder na yau da kullun?

Sharuɗɗan maye gurbin:

1. Najasa ta wuce misali (misali, Cu >0.8%, IPC-J-STD-006B), ƙarfin haɗin da aka solder yana raguwa da 20%-30%;

2. Ƙwayar da aka yi da solder ta rufe fiye da kashi 20% na saman wanka, wanda ke shafar ingancinsa;

3. Yawan lalacewar walda yana ƙaruwa akai-akai saboda matsalolin wanka na solder.
52. Yadda ake inganta tsare-tsaren siye ta amfani da manyan bayanai a cikin sarrafa kayan solder?

Hanyoyi:

1. Yi nazarin yawan amfani da aka yi a tarihi, zagayowar sayayya, da kuma canjin farashi don annabta buƙata;

2. Yi amfani da odar yanayi kafin a fara haja domin rage haɗarin haja;

3. Bibiyar yanayin farashi don inganta lokacin siye. Bayanai sun nuna kashi 15%-20% na farashin kaya da kuma raguwar farashin siye daga kashi 8%-12%.
53. Menene tasirin amfani da nau'ikan solder daban-daban akan ingancin samfur yayin sake fasalin PCBA?

Tasirin:

- Na'urar solder mai tsari iri ɗaya: Ingantaccen aikin haɗin gwiwa, aminci iri ɗaya da na asali;

- Na'urar solder mai tsari daban-daban (misali, na'urar solder mai ƙarancin zafin jiki bisa bismuth): Babban rashin daidaiton CTE (na'urar solder mai tushen bismuth ≈2x SAC305), mai saurin fashewa a cikin zagayowar zafi, aminci ya ragu da kashi 50%+.

Gudanar da kayan walda

1. Menene rabon kayan aiki da fa'idodin aiki na solder SAC305 mara gubar da aka saba amfani da shi?

2. Ta yaya ma'aunin eutectic na ƙarfen solder ke shafar tsarin walda?

3. Ta yaya za a bambanta yanayin aikace-aikacen kwararar aiki tare da matakan aiki daban-daban?

4. Menene ƙa'idodin abubuwan da ke cikin kwararar ruwa don wayar solder da tasirinsu akan walda?

5. Ta yaya rarraba girman barbashi na foda na ƙarfe a cikin manna solder ke shafar aikin bugawa?

6. Menene yanayin da aka yarda da shi na canjin yanayin zafi da danshi a cikin yanayin ajiya don manna solder?

7. Menene matsakaicin lokacin ajiya na wayar solder da ba a buɗe ba?

8. Me yasa ya kamata a adana kwararar ruwa daga haske?

9. Me yasa aka haramta juyawa yayin dawo da zafin jiki na man shafawa mai laushi daga wurin ajiya mai sanyi?

10. Menene zagayowar daidaitawa don masu rikodin zafin jiki da danshi a wuraren adana solder?

11. Menene matsakaicin lokacin amfani da manna mai walƙiya da aka buɗe a kan injin bugawa?

12. Ta yaya za a tantance zagayowar maye gurbin ruwan solder a cikin tankin solder na raƙuman ruwa?

13. Menene alaƙar da ke tsakanin amfani da wayar solder da girman haɗin solder a cikin walda mai zaɓi?

14. Menene mafi kyawun haɗin zafin ƙarfen da aka haɗa da lokacin da aka haɗa a cikin walda da hannu?

15. Ta yaya kusurwar squeegee ke shafar ingancin bugawa yayin buga manna na solder?

16. Yadda ake gano ramukan ciki a cikin gidajen haɗin solder ta hanyar X-Ray?

17. Menene sharuɗɗan da aka yarda da su da kuma jeri na karkacewa don gwajin danko na solder manna?

18. Menene hanyoyin gwajin ƙarfin tensile da kuma sharuɗɗan cancantar haɗin solder?

19. Yadda ake nazarin tsarin haɗin solder ta hanyar rarraba ƙarfe?

20. Menene ma'aunin gwajin tsaftar ion ga ragowar kwararar ruwa?

21. Ta yaya saurin dumamawa a matakin kafin dumamawa na sake haɗawa da soldering ke shafar walda?

22. A cikin tsarin haɗa igiyoyi biyu, menene ayyuka da saitunan sigogi na igiyoyin gaba da igiyoyin baya?

23. Yadda ake rage rugujewar manna mai laushi ta hanyar inganta ƙirar buɗe stencil?

24. Menene tasirin kariyar nitrogen akan ingancin walda a cikin walda mai zaɓi?

25. Yadda ake daidaita saurin sanyaya na sake haɗawa da solder bisa ga kauri na PCB?

26. Menene ƙa'idar daidaitawa tsakanin saurin rushewar injin buga takardu da kuma dankowar manna mai solder?

27. Menene alaƙar da ke tsakanin adadin yankunan zafin da ake sake haɗa su da kuma walda mai rikitarwa ta allon da'ira?

28. Menene tasirin na'urar juyawa a cikin tankin solder na raƙuman ruwa akan daidaiton ruwan solder?

29. Menene tasirin ingancin feshi na bututun walda na zaɓi akan ƙananan haɗin solder?

30. Menene kewayon sarrafa matsin lamba na tsarin ciyar da wayar solder?

31. Menene tsari na yau da kullun da kuma matakan kariya don sake amfani da solder mara gubar?

32. Menene manyan abubuwan da ke cikin iskar gas mai canzawa da kuma iyakokin da suke da su a wurin aiki?

33. Menene ƙa'idar rarrabuwar shara mai haɗari da buƙatun zubar da shara ga kayan da aka yi amfani da su wajen tace shara?

34. Menene buƙatun matakin kariya daga fashewa ga wuraren adana solder?

35. Ta yaya za a hana iskar shaka ta biyu daga dattin solder yayin ajiya?

36. Ta yaya za a rage farashi ta hanyar inganta kauri bugu na manna mai laushi?

37. Menene matsakaicin asarar da masana'antu ke yi na ma'aunin ragewa da kuma rage wayoyi?

38. Menene tsarin kimantawa da kimantawa na aikin farashi don manna solder daga nau'ikan samfura daban-daban?

39. Yadda za a rage dattin da ke haɗa raƙuman ruwa ta hanyar inganta tsari?

40. Menene alaƙar da ke tsakanin jujjuyawar kayan da aka sayar da su da kuma mallakar jari?

41. Waɗanne muhimman matakai ya kamata a mayar da hankali a kansu yayin binciken takaddun shaida na ISO 9001 na masu samar da solder?

42. Ta yaya za a kimanta ƙwarewar bincike da ci gaban mai samar da kayayyaki ta hanyar binciken da ake yi a wurin?

43. Ta yaya za a tantance rabon ajiya mai inganci ga masu samar da solder?

44. Waɗanne muhimman sigogin fasaha ne ya kamata a haɗa su cikin yarjejeniyar fasaha da masu samar da solder?

45. Ta yaya ake sarrafa bayanan rukunin masu siyarwa ta hanyar tsarin bin diddigin inganci?

46. ​​Ta yaya nau'ikan manne na solder daban-daban ke shafar ingancin bugawa?

47. Ta yaya za a kimanta ingancin hanyoyin sarrafa solder ta hanyar adadi?

48. Yadda ake magance matsaloli daga mahangar kayan solder idan 大面积虚焊 (ƙarancin soldering) ya faru bayan walda PCBA?

49. Yadda ake zaɓar kayan solder masu dacewa don tabbatarwa yayin gwajin ƙananan rukuni na PCBA?

50. Ta yaya za a tantance tasirin yanayin adana solder akan tsawon lokacin shiryayyensa?

51. Ta yaya za a tantance ko za a maye gurbin wanka na solder yayin kula da tankin solder na yau da kullun?

52. Yadda ake inganta tsare-tsaren siye ta amfani da manyan bayanai a cikin sarrafa kayan solder?

53. Menene tasirin amfani da nau'ikan solder daban-daban akan ingancin samfur yayin sake fasalin PCBA?

46. Ta yaya nau'ikan manne na solder daban-daban ke shafar ingancin bugawa?