PCB mai rami mai zurfi

Allon da'ira da aka buga (PCB) wanda aka ƙera ta amfani da fasahar laser ko plasma etching tare da diamita na rami ƙasa da 0.15mm (masana'antar yawanci tana amfani da 0.1mm a matsayin mizani), wanda ake amfani da shi don haɗakar abubuwa masu yawa.

Girman ramin ya fi ƙasa da na PCBs na yau da kullun da kashi 50%, faɗin layin/tazara na iya kaiwa 30μm/30μm, yawan wayoyi yana ƙaruwa sau 2-3, kuma ya dace da watsa sigina mai yawan mita da sauri.

Bisa ga tsarin, an raba su zuwa hanyoyin sadarwa marasa ma'ana (gudanarwa mai gefe ɗaya), hanyoyin sadarwa na ciki (gudanarwa ta ciki), da kuma hanyoyin sadarwa (ta cikin dukkan allon). Matsakaicin kewayon hanyar sadarwa mara ma'ana shine 50-100μm.

Ana amfani da shi sosai a cikin yanayi masu yawan haɗaka kamar wayoyin komai da ruwanka (wanda ya kai fiye da 60%), tashoshin tushe na 5G, uwa-uba na uwar garken, da kuma marufi na guntu na AI.

Ya bayyana ne bayan da fasahar haƙa ramin laser ta girma a shekarun 1990. Tsarin da ake amfani da shi a yanzu zai iya kaiwa diamita na ramin 30μm, kuma mafi ƙarancin rikodin diamita na ramin shine 15μm.

Mafi ƙarancin diamita na ramin da za a iya samar da shi a masana'antu zai iya kaiwa 50μm, kuma iyakar dakin gwaje-gwaje shine 15μm, amma farashin yana ƙaruwa sosai tare da raguwar diamita na ramin.

Gabaɗaya, rabon al'amari bai wuce 1:1 ba, kuma matakai na musamman na iya kaiwa 1:0.8. Matsakaicin al'amari mai yawa yana iya haifar da rashin isasshen cikawa ta hanyar amfani da electroplating.

Mafi ƙarancin tazara da aka ba da shawarar shine ≥80μm don tabbatar da ingancin layin farantin jan ƙarfe mara amfani da wutar lantarki da kuma rage haɗarin gajerun da'irori.

Ana ba da shawarar yin amfani da tsarin daidaita allon tsakiya da prepregs, tare da kauri mai lanƙwasa tsakanin layukan dielectric a 50-75μm don tabbatar da ingancin watsa sigina.

Ya zama dole a kula da ƙarfin ramin (ƙimar da aka saba da ita

Ga masu amfani da fasahar BGA, an fi son a yi amfani da fasahar makafi ta hanyar ƙira. Kowace kushin ta yi daidai da microvia 1-2, kuma faɗin layin fan ɗin bai gaza 40μm ba.

A cimma haɗin maki da yawa tsakanin jiragen sama masu ƙarfi/ƙasa ta hanyar microvias, tare da tazara ≤5mm, don rage juriya tsakanin jiragen sama.

Ƙara yawan watsawar zafi (wanda aka ba da shawarar ≥10 vias/cm²), tare da diamita na rami ≥80μm, don inganta ingancin watsawar zafi.

Buɗewar abin rufe fuska na solder ya kamata ya fi girma 20-30μm fiye da diamita na ramin da ke kowane gefe domin hana tawada ta rufe ramin.

Ɗauki tsarin tattarawa don ƙara yawan layukan wayoyi, kuma yi amfani da hanyoyin sadarwa marasa ma'ana da aka binne maimakon hanyoyin sadarwa, wanda zai iya ƙara yawan wayoyi da fiye da kashi 30%.

Haɗa haƙoran laser (CO₂, laser UV), haƙoran plasma, da haƙoran injiniya (ya dace da manyan diamita na ramuka), tare da haƙoran laser ya kai sama da kashi 80%.

Laser CO₂ ya dace da diamita na ramuka na 0.075-0.15mm tare da ƙarancin farashi; Laser UV na iya sarrafa ƙananan ƙwayoyin cuta

Gudun haƙan laser na CO₂ yana da kusan ramuka 5,000-10,000 a minti ɗaya, kuma na laser na UV yana da kusan ramuka 2,000-5,000 a minti ɗaya.

Daidaiton wurin haƙo laser shine ±25μm, na haƙo na inji shine ±50μm, kuma laser na UV zai iya cimma babban daidaito na ±15μm.

Hakowar laser mai taimakon nitrogen zai iya sarrafa tsayin burr a cikin 5μm, ko kuma za a iya amfani da cirewar plasma.

Ana buƙatar tsarin yin amfani da wutar lantarki ta hanyar rami, tare da sarrafa kauri na jan ƙarfe a 25-35μm, da kuma daidaiton kauri na jan ƙarfe a cikin ramin ≥85%.

A saka wani Layer na tagulla mai girman 0.3-0.5μm a bangon ramin da ke rufewa don samar da tushe mai sarrafawa. Ya kamata a sarrafa yawan ions na palladium a cikin maganin kunnawa a 2-5ppm.

Zafin lamination shine 180-210℃, matsin lamba shine 300-500psi, kuma ƙimar dumama shine 1-2℃/minti don tabbatar da daidaiton layer na dielectric.

Dole ne matakin injin ya kasance ƙasa da -95kPa. A fara gyara shi kafin a fara amfani da shi zuwa matakin B kafin a fara amfani da shi, kuma za a iya rage yawan lahani na kumfa zuwa ƙasa da 0.5%.

Nau'ikan da aka fi sani sun haɗa da zinare mai nutsewa (kauri 0.05-0.1μm), OSP (kauri na fim 0.2-0.5μm), da azurfa mai nutsewa (0.1-0.3μm). Zinare mai nutsewa yana da aminci mafi girma.

Ya zama dole a sarrafa danko na tawada a 80-120Pa・s sannan a yi amfani da tsarin toshewa na injin don hana ragowar tawada a cikin ramukan, tare da saurin toshe ramin ≤1%.

Ana amfani da yanke laser idan buƙatar daidaiton siffar ta kasance

Ya haɗa da bangon ramuka masu kauri (rashin ƙarfi Ra > 1.5μm), gurɓatattun ramuka a cikin ramuka (rabo mara amfani > 5%), karkacewar ramuka (> ± 30μm), da sauransu.

Ana amfani da tsaftace plasma don cire ragowar haƙa rami, ta yadda ƙaiƙayin saman Ra na bangon ramin ya kai ≤1.0μm.

Jimillar yawan amfanin ƙasa a ƙarƙashin manyan matakai shine kusan kashi 85-92%. Mafi ƙarancin diamita na ramin, shine ƙarancin yawan amfanin ƙasa. Yawan amfanin ƙasa na microvias 50μm shine kusan kashi 80%.

Ya haɗa da FR-4 (dielectric constant 4.2-4.5), allon sauri (kamar Rogers 4350B, Dk = 3.66), BT resin, da sauransu.

Allon masu saurin gudu suna da ƙarancin asarar tangent (Df

Ana amfani da shi don haɗa layukan da ke tsakanin layuka, tare da sarrafa abun ciki na manne a kashi 40-50% da kuma ruwa a kashi 20-30% don tabbatar da daidaiton dielectric bayan lamination.

Ga layin ciki, ana ba da shawarar foil ɗin jan ƙarfe mai girman 18μm ko 35μm. Ga layin waje, ana iya amfani da 18μm don rage asarar sigina. Allunan HDI galibi suna amfani da foil ɗin jan ƙarfe mai girman 9μm mai siriri sosai.

Yana buƙatar ya dace da juriyar zafin jiki (babu barewa a 260℃/10s), juriyar rufi (>10^12Ω), da mannewa (matakin gwaji mai yanke giciye 0).

Ana ba da shawarar a yi amfani da takardar jan ƙarfe ta RTF (reverse treatment) mai kauri Ra

Fi son kayan da ke da ƙarancin dielectric constant (Dk

Suna buƙatar bin umarnin RoHS 2.0, tare da abun ciki na halogen (chlorine + bromine) ƙasa da 1500ppm da bromine ƙasa da 900ppm.

Kayan tushe na FR-4 yana da mafi ƙarancin farashi. Allon mai saurin gudu yana da tsada sau 3-5 fiye da na FR-4, kuma resin BT yana tsakanin.

Ana buƙatar adana kayan tushe a ƙasa da 25℃ da kuma zafi

Ya haɗa da duba gani, auna diamita na rami, gwajin kauri na jan ƙarfe a rami, gwajin juriya, da kuma nazarin sassan da aka haɗa.

Yi amfani da na'urar auna hoto mai girma biyu (daidai ±1μm) ko na'urar duba na'urar hangen nesa ta lantarki (SEM). Ana iya amfani da na'urar duba gani ta atomatik (AOI) don gano rukuni.

Ka'idojin IPC suna buƙatar kauri na jan ƙarfe a cikin ramin ya zama ≥20μm, kuma rabon matsakaicin kauri na jan ƙarfe zuwa mafi ƙarancin kauri na jan ƙarfe ya zama ≤1.5, wanda aka gano ta hanyar hanyar giciye-sashe na ƙarfe.

Yi amfani da na'urar nazarin hanyar sadarwa mai kewayon mitar gwaji na 1-10GHz, kuma ya kamata a sarrafa karkacewar impedance a cikin ±10%.

Zai iya lura da ingancin bangon ramin da ido, kauri na layin jan ƙarfe, da yanayin haɗin layukan da ke tsakanin layukan, tare da daidaiton yankewa na ±5μm.

Ya haɗa da gwajin damuwa na zafi (260℃/sau 10), gwajin juriya na ƙarfin lantarki (500V DC/minti 1), da gwajin zagayowar zafin jiki-danshi (-40℃~85℃).

Lura ko bangon ramin ya fashe bayan gwajin girgizar zafi (288℃/sau 10), kuma tsawon tsagewa

Yi amfani da SEM don lura da ƙananan tsarin, nazarin hasken wutar lantarki (EDS) don gano abubuwan da ke cikin jiki, da kuma X-ray don gano lahani na ciki.

Inganta tsarin electroplating don rage gurɓatattun ramuka, ƙarfafa mannewar Layer na abin rufe fuska na solder, da kuma guje wa ƙaura ta hanyar lantarki da abubuwan muhalli ke haifarwa.

A ƙarƙashin yanayin amfani na yau da kullun, yana iya kaiwa shekaru 5-10, kuma yanayi mai tsauri (zafin jiki mai yawa, danshi mai yawa) zai rage shi zuwa shekaru 2-3.

Ya haɗa da manna SMT, walda BGA, da saka sassan, tare da buƙatar daidaiton manna SMT na ±50μm.

Ya zama dole a sarrafa matsin lamba na mannewa a 0.5-1.0kg/cm² domin hana sassan su ruguje, kuma zafin zafin da ke kan lanƙwasa tanda mai sake kwarara shine 230-245℃.

Ya zama dole a daidaita daidaiton haɗin gwiwar ƙwallon solder (

Inganta kauri na buga manna mai laushi (100-120μm), yi amfani da sake haɗa sinadarin nitrogen, kuma yawan iskar oxygen ɗin ya kai

Ya kamata a sarrafa zafin aikin sake aiki a ƙasa da 260℃, kuma lokacin ya kamata ya zama

Ya dace da ƙananan ƙwayoyin cuta masu diamita na rami ≥0.3mm, waɗanda ke buƙatar haɗakar ƙwayoyin cuta biyu ko haɗakar ƙwayoyin cuta masu zaɓi, tare da tsayin raƙuman ƙwayoyin cuta na 25-35mm.

A ba da fifiko ga man shafawa mara gubar (SnAgCu gami) tare da wurin narkewa na 217℃, matakin aikin kwararar ruwa RMA, da juriyar rufin da ya wuce 10^10Ω.

Rage abun da ke cikin ƙarfe na manna mai solder zuwa 90-92%, inganta ƙirar buɗewar stencil, kuma ƙimar lahani na bead mai solder za a iya rage ta zuwa ƙasa da 0.1%.

Yi amfani da maganin tsaftacewa mai amfani da ruwa a zafin jiki na 50-60℃ na tsawon mintuna 3-5 don tabbatar da cewa yawan sinadarin ion da ke cikinsa ya kai

Saita daidaiton ganowa zuwa ±25μm da kuma iyakar bambanci zuwa 30-50%, wanda zai iya gano fiye da kashi 95% na lahani na haɗuwa.

Kuɗin kayan aiki ya kai kashi 40-50%, kuɗin sarrafawa 30-40%, kuma kuɗin dubawa da marufi 10-20%.

Diamita na rami, adadin yadudduka, tsarin gyaran saman, nau'in kayan. Kowace raguwar 10μm a cikin ƙaramin diamita na ramin yana ƙara farashi da 15-20%.

Inganta ƙirar don rage adadin yadudduka, amfani da kayan da aka daidaita, da kuma ƙara yawan samar da kayayyaki, wanda zai iya rage farashi da kashi 10-30%.

Zagayen samarwa na hanyoyin gargajiya yana ɗaukar kwanaki 7-10, kuma ana iya matse umarni na gaggawa zuwa kwanaki 3-5, amma farashin yana ƙaruwa da kashi 20-30%.

Dauki layukan samarwa ta atomatik, inganta kwararar tsari, da kuma ƙara yawan amfani da kayan haƙa laser zuwa fiye da kashi 80%.

Ikon samar da layin samarwa guda ɗaya na wata-wata shine kimanin 5,000-10,000㎡, ya danganta da tsarin kayan aiki da sarkakiyar tsari.

Kudin ƙananan rukuni (1000㎡) da kashi 40-60%, galibi saboda tsarin injin da kuma ƙayyadadden kuɗin da aka ware.

An ƙididdige shi sosai ta hanyar yanki (yuan/㎡), adadin yadudduka, diamita na rami, da sauransu. Kudin sarrafawa na allon microvia mai layi 8 mai 0.1mm shine kusan yuan 2000-3000/㎡.

Ta hanyar inganta ƙirar DFM, buƙatun haƙuri masu annashuwa a ƙarƙashin manufar haɗuwa da aiki na iya rage farashi da fiye da 15%.

Zuba jarin da aka yi a fannin cikakken kayan aikin samar da kayayyaki ya kai kimanin yuan miliyan 10-20, ciki har da injunan haƙa laser, layukan lantarki, laminators, da sauransu.

Yana tasowa zuwa ƙananan diamita na ramuka (20 yadudduka), ƙarancin asara, da kuma haɗakar marufi.

Ya zama dole a cimma diamita na ramin haɗin kai tsaye

Ana amfani da shi don inganta sigogin tsari da gano lahani mai hankali, wanda zai iya ƙara yawan amfanin ƙasa da kashi 5-10% da kuma ingancin ganowa da kashi 30%.

An cimma nasarar ƙera dakunan gwaje-gwaje na diamita rami 10μm, amma samar da kayayyaki da yawa yana fuskantar ƙalubalen kayayyaki, kayan aiki, da farashi.

Samu haɗin kai mara matsala tsakanin kwakwalwan kwamfuta da PCB ta hanyar haɗin kai mai yawa, rage hanyoyin watsa sigina, da inganta aikin tsarin.

Yi amfani da kayan aiki da hanyoyin da ba su da illa ga muhalli, tare da yawan ƙarfe mai nauyi a cikin fitar da ruwa daga ƙasa da 1ppm da kuma rage yawan amfani da makamashi da kashi 20%.

Ana buƙatar ƙarancin ma'aunin dielectric (Dk=3.0), ƙarancin asara (Df=0.001), da diamita na ramuka don inganta tsarin watsa sigina.

Ya zama dole a magance matsalolin fashewar bangon rami da kuma barewar saman jan karfe yayin lanƙwasawa, tare da radius mai lanƙwasa ≥3mm.

Samu cikakken sa ido kan tsari da kuma samar da kayayyaki ta atomatik ta hanyar masana'antun dijital, tare da ƙaruwar ingancin samarwa da fiye da kashi 50%.

Yana buƙatar ƙarancin asara da haɗin kai mai ƙarfi, tare da diamita na rami da faɗin layi da aka sarrafa a matakin submicron don tabbatar da watsa siginar quantum.

Yi amfani da allunan HDI masu matakai 6-10 tare da diamita na rami na 0.075mm don cimma haɗakar guntu, kyamarori, da sauransu mai yawa, wanda ya kai kashi 30-40% na farashin uwa ta wayar hannu.

Ana buƙatar allon da ba su da asara mai yawa (Df＜0.003), madaurin mita sama da 28GHz, da kuma watsar da zafi ta hanyar yawan ≥15 vias/cm².

Ana buƙatar haɗuwa mai sauri tsakanin na'urori masu sarrafawa da yawa, amfani da fasahar haƙa baya don kawar da tarkace, da kuma jinkirin watsa sigina

Cika takardar shaidar AEC-Q100, kewayon juriya ga zafin jiki -40℃~125℃, kuma ku wuce gwajin feshin gishiri na awanni 1000.