PCB mai yawan mita

Yana amfani da kayan da ba su da asara sosai (kamar Rogers 4350B), tare da haƙurin faɗin layi ±0.01mm, daidaiton sarrafa tazara tsakanin layukan sigina ±5%, da daidaiton sarrafa impedance ±5Ω.

Tashoshin tushe na 5G (24.25-52.6GHz), sadarwa ta tauraron dan adam (Ka band 26.5-40GHz), radar mai raƙuman milimita (77GHz), cibiyoyin bayanai masu sauri (100Gbps+).

An kimanta shi ta hanyar adadi kamar asarar sakawa (＜-3dB@10GHz), asarar dawowa (＞-20dB@10GHz), da kuma magana ta hanyar giciye (＜-30dB).

Yana da alaƙa da tsarin kwayoyin halitta, zafin jiki (Df yana ƙaruwa da kashi 3%-5% ga kowane ƙaruwar ℃ 10), da kuma mitar (Df yana ƙaruwa da murabba'in mita).

Rogers 4350B (Dk=3.48, Df=0.0037), Taconic TLY-5 (Dk=2.2, Df=0.0009), Isola 370HR (Dk=3.6, Df=0.004).

Ƙananan kayan Dk suna rage jinkirin watsawa (misali, kayan Dk = 2.2 suna da jinkiri mafi sauri da kashi 25% fiye da FR-4), kuma ƙarancin Df yana rage raguwar sigina (asarar ta fi ƙasa da FR-4 da kashi 70% idan Df = 0.001).

Shakar ruwa fiye da kashi 0.5% yana haifar da canjin Dk fiye da kashi 5%. Ana ba da shawarar amfani da kayan da shan ruwa ya kai kashi

Sanya kayan aiki a matsayin fifiko ta amfani da Dk＜2.5 da Df＜0.001 (kamar Arlon AD255, Dk=2.5, Df=0.0008) don biyan buƙatun 24-100GHz.

Ƙara yumburan aluminum oxide na iya ƙara yawan kayan Tg zuwa 280℃+ da kuma rage yawan faɗaɗa zafi (CTE) zuwa 2-3ppm/℃, yana inganta kwanciyar hankali mai zafi.

A cikin hanyoyin gargajiya, faɗin layi/tazara ≥50μm; hanyoyin ci gaba na iya kaiwa 30μm, wanda ke buƙatar daidaita ikon sarrafawa.

Yi amfani da tarawa mai daidaito, tare da tazara ≤0.1mm tsakanin layukan wuta da ƙasa da kuma ≤0.05mm tsakanin layukan sigina da na tunani don rage tsangwama ta hanyar lantarki.

Tashoshin sadarwa na yau da kullun suna haifar da asarar -3dB a 10GHz. Amfani da haƙa baya (cire tsawon stub mai yawa) na iya rage asara da sama da 60%.

A guji hanyar kusurwar dama (nunawa yana ƙaruwa da 15%), fifita kusurwar 45°; yankin madaurin siginar sarrafawa

Yi amfani da haƙa laser CO₂ (daidaiton budewa ±5μm) don guje wa raguwa daga haƙa injina, tare da ƙaiƙayin bangon rami Ra≤1.2μm.

Yi amfani da faranti na jan ƙarfe mara amfani da wutar lantarki + jan ƙarfe mai amfani da wutar lantarki, sarrafa ƙaiƙayin layin jan ƙarfe Rz≤2μm don rage asarar saman (asarar tana ƙaruwa da 10% ga kowane ƙaruwar ƙaiƙayi na 1μm).

Zinare mai nutsewa da nickel mara amfani da lantarki (ENIG) mai kauri na 1-3μm da juriyar hulɗa

Ya kamata a sarrafa zafin lamination a kayan Tg+30℃ (misali, yanayin lamination na Rogers 4350B 210-230℃), tare da matsin lamba 5-8MPa don guje wa wargajewa.

Yi amfani da TDR (mai auna yanayin lokaci) don gano ci gaban impedance, X-ray don gano ta hanyar karkacewar matsayi (wanda aka yarda ± 0.05mm), da kuma AOI don gano haƙurin faɗin layi.

Yi amfani da kayan Df marasa ƙarfi, inganta ƙaiƙayin foil ɗin jan ƙarfe (foil ɗin jan ƙarfe na RTF yana da ƙarancin asara fiye da foil ɗin jan ƙarfe na RA da kashi 30%), kuma rage tsawon alamar.

Duba katsewar impedance (kamar vias, masu haɗawa), tabbatar da karkacewar impedance

Tsawon layin layi daya da ya wuce kima yana haifar da magana ta hanyar sadarwa. Ƙara tazara tsakanin layi zuwa ƙa'idar 3W (W shine faɗin layi) da kuma ƙara warewar ƙasa na iya rage magana ta hanyar sadarwa da 20dB.

Kare da masu daidaita juriya (resistance = transmission line impedance) kuma yi amfani da sauyi a hankali na faɗin layi don rage ma'aunin haske a ƙasa da 0.1.

Kariya tare da cikakken matakin ƙasa (rata

Juyawa ta hanyar foil ɗin jan ƙarfe (mai juyar da zafi 398W/mK) ya kai kashi 70%, watsawar abu 20%, da kuma watsawar iska/haskoki 10%.

Ƙara zafi ta hanyar yawan (≥200/cm²), yi amfani da foil ɗin jan ƙarfe mai kauri (≥3oz), sannan a haɗa shi da wurin wankin zafi don rage juriyar zafi da kashi 40%.

Substrate na aluminum (170W/mK) > substrate na jan ƙarfe (398W/mK) > FR-4 na yau da kullun (0.35W/mK).

Ga kowace ƙaruwar ℃ 10, Dk yana ƙaruwa da 0.5%-1%, kuma Df yana ƙaruwa da 3%-5%. Yanayin aiki da aka ba da shawarar shine

Ta hanyar diamita 0.3-0.5mm, tazara ≤1mm don tabbatar da ingantaccen hanyoyin isar da zafi da kuma rage juriyar zafi da kashi 30%.

Gwajin siga na S (S11, S21, da sauransu), gwajin impedance, gwajin asarar dielectric, gwajin zagayowar zafin jiki (-40℃~125℃, zagayowar 500).

S11 (asarar dawowa), S21 (asarar sakawa). Jadawalin mitar gwajin ya rufe madaurin aiki tare da daidaiton ±0.5dB.

Yi gwajin zafi mai danshi (85℃/85% RH, 1000h) da gwajin feshi na gishiri (5% NaCl, 24h) don tabbatar da juriyar abu ga yanayi.

Yana auna siffar motsin haske ta hanyar fitar da siginar mataki don gano rashin daidaituwar impedance, tare da ƙuduri har zuwa 0.1mm.

Yi amfani da ɗakunan da ba su da ƙarfin lantarki don gwada fitar da hayaki mai ƙarfi (≤-40dBμV/m@1GHz) da kuma gwajin ingancin kariya (>60dB).

Yi amfani da sinadarin nitrogen reflow solder (adadin iskar oxygen ƙasa da 50ppm) tare da zafin jiki mafi girma na 230-250℃ don guje wa lalata kayan.

Zaɓi masu haɗin mita masu yawa kamar SMA, 2.92mm, 1.85mm, da sauransu, tare da mitoci masu aiki waɗanda ke rufe madaurin da ake buƙata da asarar saka

Tabbatar da daidaiton impedance tsakanin masu haɗawa da PCBs, kuma tsaftace tashoshin bayan an haɗa su don rage asara da kashi 15%.

Ana buƙatar cika buƙatun madaurin 24-52GHz da kuma magance matsalar watsa zafi (yawan wutar lantarki >10W/cm²) da kuma rage matsalolin.

Cika takardar shaidar AEC-Q200, tare da zafin aiki na -40℃~125

IPC-4101 (ƙayyade kayan tushe), IPC-6012 (ƙayyadadden yarda da allon), IEEE 802.3 (ƙayyadadden siginar sauri).

Ya yi daidai da MIL-PRF-55110 (da'irar microwave), zafin aiki -55℃~125℃, ya wuce gwajin feshin gishiri da mold.

Ya cika buƙatun AEC-Q200 (takardar shaidar sassan da ba sa aiki) da kuma ISO 26262 (amincin aiki).

Ya haɗu da 3GPP TR 38.810 (kayan aikin tashar tushe), asarar shigarwa -15dB.

Yana bin NASA-STD-8739.3 (kayayyakin lantarki), ya ci gwajin zafi mai danshi na awanni 1000, canjin Dk sama da kashi 2%.

Kayan asara mai ƙarancin ƙarfi (Df

An rage CTE zuwa 1ppm/℃, ƙarfin wutar lantarki ya karu zuwa 100W/mK, yayin da yake riƙe da ƙarancin Dk (2.8).

Kayan da ke da sassauƙa suna da ɗan ƙaramin Dk (3.0-3.5) da kuma Df mai girman 20%-30%, amma suna ba da damar yin amfani da hanyar 3D.

Kayan da suka dace da muhalli (kamar su zare mai laushi) waɗanda aka yi da Dk=3.2 da Df=0.004, waɗanda suka dace da kayan lantarki na masu amfani.

Al₂O₃ yumbu mai siffar Dk=9.8 da kuma ƙarfin lantarki mai zafi 24W/mK, wanda ya dace da haɗakar na'urorin wutar lantarki.

Mai Zane na Altium, Cadence Allegro, ANSYS HFSS (kwaikwayon lantarki), Keysight ADS (kwaikwayon da'ira).

Gina samfurin 3D, saita sigogin kayan aiki da yanayin iyaka, kwaikwayon sigogin S da rarraba filin tare da kuskure

Yana yin kwaikwayon matakin da'ira, yana inganta hanyoyin sadarwa masu daidaitawa, yana annabta asarar shigarwa da asarar dawowa, kuma yana goyan bayan nazarin sigogin S-ports da yawa.

Kuskure a cikin ±3Ω, yana buƙatar daidaitawa tare da ainihin sigogin tsari (kamar ƙaiƙayin foil na jan ƙarfe, kauri na dielectric).

Daidaita tsarin bin diddigi bisa ga rarrabawar filin, inganta daidaiton impedance ta hanyar duba sigogi, kuma tsara shi akai-akai don rage asara.

Injin haƙa Laser (daidai ±5μm), injin cire iska, injin cire iska mai inganci (juriyar faɗin layi ±0.01mm).

Laser CO₂ ya dace da allon kauri (>1mm) masu manyan ramuka (≥0.3mm); Laser UV ya dace da allon siriri (

Digiri na injin tsotsa

Ma'aunin etch ≥3:1, yana tabbatar da cewa adadin etch na gefe

Zai iya gano faɗin layi/ɓangaren tazara (±0.005mm), gajerun da'irori/buɗewa, girman lahani mafi ƙaranci 0.01mm.

Ya yi daidai da RoHS 2.0 (yana iyakance abubuwa 6 masu haɗari kamar gubar da mercury), yawan halogen ƙasa da 900ppm.

Yi amfani da na'urar solder mara gubar, sinadarin ƙarfe mai nauyi 95%).

A dawo da jan ƙarfe ta hanyar niƙawa ta zahiri + narkar da sinadarai (ƙimar murmurewa> 98%), sannan a yi maganin sharar resin ba tare da lahani ba.

Kayan da aka yi da polylactic acid tare da Dk = 3.3 da Df = 0.005, ƙimar lalacewa sama da 80% cikin kwanaki 180 bayan amfani.

Tsarin muhalli yana ƙara farashi da kashi 10%-15%, amma bin ƙa'ida yana guje wa haɗarin hukunci.

Algorithms na AI suna inganta yanayin hanyoyin sadarwa, suna rage lokacin ƙira da hannu da kashi 50% da asarar sigina da kashi 15%.

Yana ba da damar tsarin 3D mai rikitarwa tare da daidaiton daidaitawa tsakanin layukan ±0.05mm, amma asarar kayan a halin yanzu tana da yawa (Df=0.01).

Yana buƙatar kayan asara masu ƙarancin ƙarfi (Df

Yana buƙatar kayan da ke da Dk

Yana ɗaukar fasahar marufi ta 2.5D/3D don rage hanyoyin sigina da rage asarar tsarin da kashi 30%.

A guji yanayin zafi mai yawa da zafi mai yawa (zafin jiki

Yi amfani da haƙa baya don cire ƙarin ta hanyar stubs, tare da tsawon stub ≤1/8λ; yi amfani da soldering mai sake kwarara ta cikin rami don rage ƙarfin parasitic.

A fifita kayan Dk masu ƙarancin Dk (

Gwada sigogin S tare da na'urar nazarin hanyar sadarwa, wacce ke buƙatar S11 ≤ -15dB da kuskuren impedance na halaye ±5Ω; yi amfani da TDR don lura da ma'aunin haske

Kauri na layin Dielectric 0.05-0.2mm, ƙaiƙayin foil na jan ƙarfe Ra≤0.5μm; layin da ke kusa yana nuna orthogonal, tazara tsakanin layin wutar lantarki/ƙasa

Yi amfani da gwangwanin kariya na ƙarfe (tasirin kariya ≥80dB) tare da faɗin rata

Tazarar layi ≥3× faɗin layi, kuskuren tsayi

ENIG yana samar da santsi da ƙarancin asara; siririn kauri na OSP ya dace da aikace-aikacen mita mai yawa, yana guje wa asarar maganadisu daga yadudduka na nickel.

Yi amfani da HFSS/CST don kwaikwayon lantarki mai cikakken zango don tabbatar da SI/PI; yi nazarin S-parameter a maki ≥10 na mita.

Zaɓi kayan da ke da CTE ≤15ppm/℃, ƙara zafi ta hanyar yawa (≥20/cm²), kuma yi amfani da allon da aka lulluɓe da tagulla mai ƙarfe.

Yi amfani da kayan Df masu ƙarancin ƙarfi waɗanda aka yi da PTFE; inganta kauri na layin dielectric don biyan yanayin amsawar λ/4 da rage asarar kuzari.

Juriyar faɗin layi ±0.02mm yana haifar da juriya ±3Ω; juriyar kauri mai ƙarfi ±0.01mm yana haifar da karkacewar Dk ±0.1, wanda ke buƙatar kulawa mai ƙarfi.

Sanya haɗakar MLCC (10nF/100nF/1μF) a wurin shigar wutar lantarki; raba layin wutar lantarki da tazarar ≥mil 50 tsakanin yankunan wutar lantarki.

Rashin ƙarfin hulɗar kayan aiki