Fasahar saka rami ta hanyar THT

1. Manufofi da ƙa'idodi na asali

1. Menene Fasahar Rami ta Hanyar Rami (THT)?

THT wata fasaha ce da ke saka abubuwan lantarki a cikin ramukan PCBs kuma tana cimma haɗin lantarki da gyarawa ta hanyar haɗa su. Yana ɗaya daga cikin hanyoyin haɗa kayan lantarki na gargajiya.
2. Menene manyan bambance-bambance tsakanin THT da Surface Mount Technology (SMT)?

- Jagororin sassan THT suna buƙatar haɗa ramuka ta hanyar solder, yayin da sassan SMT ana ɗora su kai tsaye akan saman PCB.

- THT yana da ƙarancin ingancin samarwa da kuma yawan aiki a sararin samaniya; SMT yana ba da inganci da yawa mafi girma (bayanan IPC: Yawan SMT shine sau 3-5 na THT).

- THT ya dace da kayan aiki masu ƙarfi/girma; SMT ya dace da ƙananan kayan aiki masu yawa/girma.
3. Menene ainihin tsarin THT?

Shirye-shiryen sassan → Shigarwa → Soldering (soldering na raƙuman ruwa don amfani gabaɗaya, soldering da hannu/tsoma don sassan musamman) → Gyaran gubar → Dubawa
4. Waɗanne nau'ikan kayan lantarki ne suka dace da THT?

- Abubuwan da ke da ƙarfin iko sosai (misali, transistors na wutar lantarki, transformers, manyan capacitors na lantarki)

- Abubuwan da ke buƙatar ƙarfin injina mai ƙarfi (misali, masu haɗawa)

- Abubuwan da ke da babban tazara tsakanin gubar da ƙarancin buƙatun daidaito
5. Menene mafi ƙarancin diamita ta hanyar PCB a cikin tsarin THT?

Tsarin aiki na yau da kullun: 0.8mm; Tsarin aiki na musamman: 0.4mm (tare da ƙarin farashi da wahala sosai)

2. Sarrafa Kayan Aiki da Fil

6. Menene siffofi na yau da kullun na jagororin sassan THT?

- Jagorori madaidaiciya (ya dace da injunan saka ta atomatik)

- Jagororin da aka lanƙwasa (misali, nau'in J, nau'in L, yana haɓaka kwanciyar hankali na injiniya bayan an haɗa shi)
7. Menene buƙatun sassaucin soldering don raka'o'in sassan?

Ga IPC-J-STD-001: A zafin jiki na 235℃±5℃, a nutsar da shi a cikin tukunyar solder na tsawon daƙiƙa 2-3, murfin solder ≥95%
8. Yadda ake inganta yadda ake haɗa sinadaran da ke cikin kwamfutocin?

- Rufin ƙarfe (misali, Sn, Ag plating)

- Aiwatar da ruwa kafin a soka don cire yadudduka na oxide da kuma inganta danshi
9. Menene tsawon gubar da ta dace da sassan THT?

Fitowar gubar daga saman silinda na PCB: 2-3mm (gajere yana haifar da rashin kyawun silinda; tsayi da yawa yana haifar da gajerun da'irori kuma yana buƙatar ƙarin gyarawa)
10. Ta yaya kayan gubar daban-daban ke shafar haɗakar sinadarai?

- Tagulla: Kyakkyawan iya soldering, mafi yawan amfani

- Iron: Mai saurin kamuwa da iskar shaka, rashin iya soldering, yana buƙatar magani na musamman

- Gami (misali, ƙarfen jan ƙarfe): Yana daidaita ƙarfi da ƙarfin soldering

3. Allon Da'ira Mai Bugawa (PCB) Mai Alaƙa

11. Menene buƙatun kayan PCB a cikin tsarin THT?

Ana amfani da substrate na FR-4 mai Tg ≥130℃, wanda ke nuna kyakkyawan rufin lantarki, ƙarfin injina, da juriyar zafi.
12. Menene ƙa'idodin haƙuri ga hanyoyin PCB?

- Juriyar diamita ta hanyar diamita: ±0.05mm

- Juriyar matsayi na rami: ±0.1mm
13. Yadda za a hana lalacewar PCB yayin haɗa THT?

- Zaɓi kauri mai dacewa na substrate (daidaitaccen 1.6mm)

- Inganta tsarin PCB (guji manyan wuraren jan ƙarfe masu yawa)

- Yi amfani da gefuna na tsari da kayan tallafi
14. Ta yaya ta hanyar rashin ƙarfi na bango ke shafar haɗakar solder?

Ya kamata a sarrafa ƙimar Ra a 1.6-3.2μm: Yawan kauri yana haifar da rashin cika solder; santsi sosai yana rage danshi.
15. Menene buƙatun musamman na PCBs masu layuka da yawa a cikin THT?

- Yana buƙatar daidaitaccen daidaitawa tsakanin layukan (yawanci ana sarrafa shi ta hanyar hakowa na CNC)

- Kula da rufin interlayer yayin solder don guje wa gajerun da'irori

4. Tsarin Walda - Walda Mai Rage Rage

16. Menene babban ƙa'idar haɗa igiyoyi?

Famfon solder yana fitar da narkakken solder zuwa cikin raƙuman ruwa, kuma ana haɗa PCB/leads lokacin da suke ratsawa ta cikin raƙuman ruwa. Solder mai raƙuman ruwa biyu yana rage gadawa da haɗin sanyi.
17. Menene yanayin zafin solder na yau da kullun don soldering na raƙuman ruwa?

- Sn63Pb37 (wanda aka jagoranta): 245℃-255℃

- Sn96.5Ag3.0Cu0.5 (ba tare da gubar ba): 255℃-265℃
18. Menene lokacin da ake amfani da shi wajen haɗa igiyoyi?

Lokacin hulɗa da raƙuman gubar: daƙiƙa 2-4 (gajere yana haifar da ƙarancin haɗakar sinadarai; haɗarin lalacewar sassan ko lalacewar PCB)
19. Yadda ake daidaita tsayin raƙuman ruwa a cikin haɗa raƙuman ruwa?

Tsawon raƙuman ruwa: 1/2-2/3 na kauri na PCB (an daidaita shi ta hanyar kwararar famfon solder da matsin lamba; tsayi da yawa yana haifar da gada, ƙarancin da ya haifar da rashin isasshen solder)
20. Waɗanne hanyoyi ne ake amfani da su wajen haɗa ruwan da kuma halayensu?

- Feshi: Ƙarancin amfani, iri ɗaya, ya dace da manyan
- daidaiton soldering

- Kumfa: Babban maida hankali, ya dace da kauri
- da'irar fim

- Wave: Babban inganci, babban sharar gida

5. Tsarin Walda - Walda da hannu da sauransu

21. Yadda ake sarrafa zafin jiki da lokacin da za a haɗa sassan THT da hannu?

Zafin ƙarfe mai laushi: 300℃-350℃; a kowace haɗin gwiwa: daƙiƙa 2-3 (guji lalacewar zafin jiki mai yawa)
22. Menene halaye da aikace-aikacen soldering na dip?

Halaye: Ingantaccen aiki amma yana da sauƙin haɗawa; Aikace-aikace: Samar da PCBs masu sauƙi tare da babban tazara mai yawa
23. Menene fa'idodin yin solder na zaɓi?

An yi niyya ga takamaiman yankuna, don guje wa tasirin solder a wasu yankuna. Ya dace da allunan THT/SMT masu gauraye don rage tasirin solder a kan sassan SMT.
24. Za a iya amfani da sake haɗa solder don abubuwan THT?

Ana amfani da sake haɗa solder ɗin SMT musamman don amfani da shi. Ana iya amfani da shi don wasu nau'ikan THT na musamman (misali, ƙananan sassa/ƙananan kayan haɗin gubar tare da kayan aiki na musamman), amma ba na yau da kullun ba.
25. Menene buƙatun solder don hanyoyin solder daban-daban?

- Rage yawan ruwa: Babban ruwa, juriya ga iskar shaka

- Na'urar solder da hannu: Matsakaicin wurin narkewa, mai kyau da danshi

- Soldering na tsoma: Ƙarfin rufewa

- Siffofi gama gari: Yin amfani da igiyar ruwa/tsoma yana amfani da sandunan solder; yin amfani da hannu yana amfani da wayar solder

6. Solder da Flux

26. Menene abubuwan da aka fi amfani da su wajen haɗa solders na THT?

Abubuwan da aka fi amfani da su wajen haɗa ƙarfe sun haɗa da ƙarfe mai-tin (Sn63Pb37, ma'aunin eutectic 183℃) da kuma ƙarfe mai-gilashi (misali, Sn96.5Ag3.0Cu0.5, ma'aunin narkewa 217℃). Ana ƙara amfani da ƙarfe mai-gilashi mara-gilashi saboda dalilai na muhalli.
27. Menene bambance-bambancen aikin solder tsakanin solders marasa gubar da kuma solders marasa gubar?

Masu solders marasa gubar suna da wurin narkewa mafi girma na 30-40℃ da ƙarancin danshi, suna buƙatar yanayin zafi mafi girma da daidaiton tsari, amma suna bin ƙa'idodin RoHS.
28. Menene babban aikin kwararar ruwa?

Yana cire oxides daga saman soldering, yana rage tashin hankali a saman soldering, yana ƙara yawan danshi, kuma yana hana sake yin oxidation yayin soldering.
29. Ta yaya ake rarraba matakan ayyukan kwarara?

An rarraba su bisa ga IPC-J-STD-001 a matsayin R (mara aiki), RMA (matsakaicin aiki), da RA (mai aiki). Babban aiki yana inganta cire oxide amma yana iya ƙara haɗarin lalata ragowar.
30. Menene tasirin ragowar kwararar ruwa akan da'irori?

Zai iya haifar da gajerun da'irori, zubewa, ko tsatsa na sassan/PCBs ta hanyar ragowar da ke aiki sosai, wanda galibi yana buƙatar tsaftacewa bayan an haɗa shi da siminti.

7. Kayan aiki da Kayan aiki

31. Waɗanne manyan nau'ikan injinan sakawa ta atomatik ne?

Manyan nau'ikan: kwance (ya dace da sassan axial kamar resistor) da kuma tsaye (ya dace da sassan radial kamar electrolytic capacitors).
32. Menene daidaiton shigar da injinan sakawa ta atomatik?

Injinan zamani suna samun daidaiton ±0.1mm, wanda ya dace da yawancin abubuwan THT.
33. Menene gyaran injunan solder na yau da kullun ya ƙunsa?

Tsaftace tukunyar solder akai-akai, maye gurbin solder, daidaita tsayin zafin jiki/raƙuman ruwa, tsaftace tsarin kwararar ruwa, da kuma shafa man shafawa na inji.
34. Menene muhimman abubuwan da ake buƙata don zaɓar da amfani da kayan aikin solder da hannu?

Zaɓi ƙarfen solder mai ƙarfin 30W-60W masu siffofi daban-daban; a shafa a saman kafin amfani don hana iskar shaka.
35. Waɗanne nau'ikan kayan aiki ne ake amfani da su a cikin tsarin THT?

Ya haɗa da kayan aikin sanya PCB, masu riƙe da kayan haɗin, da tallafin solder don tabbatar da daidaiton matsayi da kwanciyar hankali.

8. Kula da inganci da nazarin lahani

36. Waɗanne lahani ne ake samu a cikin haɗakar THT?

Haɗin gwiwa masu sanyi, gada, rashin isasshen solder, ƙwallon solder, da sauransu. Haɗin gwiwa masu sanyi suna nufin rashin haɗin lantarki; gada yana haifar da gajeren da'ira tsakanin kusurwoyi.
37. Menene dalilai da mafita ga gidajen sanyi?

Dalilai: Ra'ayoyin da suka lalace, rashin isasshen solder, rashin kyawun yanayin zafi/lokaci, ƙarancin aikin kwarara. Magani: Tsaftace ra'ayoyin, daidaita sigogi, zaɓi kwararar da ta dace.
38. Menene dalilai da matakan kariya don haɗa hanyoyin haɗin gwiwa?

Dalilai: Yawan solder, tsayin raƙuman ruwa mai yawa, ƙaramin tazara tsakanin gubar, da kuma rashin daidaiton kwararar ruwa. Rigakafi: Inganta girman solder, tsayin raƙuman ruwa, ƙirar PCB, da kuma amfani da kwararar ruwa.
39. Yadda ake duba ingancin soldering na THT?

Dubawar gani (AOI), X-ray (AXI), gwajin da'ira (ICT). Dubawar gani don lahani a saman fata; X-ray don gidajen sanyi na ciki.
40. Menene ƙa'idodin inganci don haɗa THT?

Dangane da IPC-A-610, haɗin da ke haɗa solder ya kamata ya kasance mai santsi, ba tare da tsagewa ba, tare da murfin gubar ≥95% da haɗin lantarki mai inganci.

9. Kare Muhalli da Tsaro

41. Menene buƙatun muhalli don hanyoyin THT?

Bi umarnin RoHS don takaita abubuwa masu haɗari; tsaftace iskar shaye-shaye; sake amfani da sharar da aka tace da kuma kwararar da ta dace.
42. Waɗanne buƙatu na musamman ne masu aikin solder ba tare da gubar ba ke da su?

Sanya safar hannu da tabarau masu jure zafi; a duba lafiyar jiki akai-akai don hana ƙonewa da shaƙar iskar gas mai cutarwa.
43. Yadda ake zubar da sharar da aka yi da kuma ruwa a cikin hanyoyin THT?

Kamfanoni masu ƙwarewa ya kamata su sake yin amfani da na'urar tace sharar gida; dole ne a rufe kwararar sharar gida (sinadaran haɗari) kuma a sarrafa su ta ƙwararrun kamfanonin sharar gida masu haɗari.
44. Menene buƙatun iska don bita na soldering?

A kula da iska mai kyau domin tabbatar da cewa yawan iskar gas mai cutarwa ya kai ƙasa da iyakokin da ake iya fallasawa ga ma'aikata, tare da canjin iskar ≥12 a kowace awa.
45. Waɗanne matakan kariya ne ake ɗauka don sinadarai da ake amfani da su a cikin hanyoyin THT?

Flux da sauran sinadarai suna iya kamawa da wuta; a kiyaye su daga inda gobara ke tashi. Don sinadarai masu lalata, a wanke nan da nan bayan an taɓa su sannan a adana su/a yi amfani da su kamar yadda aka umarta.

10. Inganta tsari da kuma kula da farashi

46. Yadda za a inganta ingancin tsarin THT?

Inganta tsarin sakawa, yi amfani da injunan atomatik masu sauri, daidaita yadda tsarin yake gudana, da kuma inganta daidaiton kayan aiki.
47. Menene manyan abubuwan da ke cikin tsarin THT?

Kayan aiki, PCB, solder/flux, raguwar kayan aiki/gyara, aiki, da kuɗin dubawa.
48. Ta yaya za a rage farashin samar da THT?

Sayen kayayyaki da yawa don rage farashin kayan aiki, inganta ƙirar PCB don rage ɓarna, inganta yawan amfanin ƙasa don rage sake aiki, da kuma daidaita rabon albarkatu.
49. Ta yaya farashin THT yake idan aka kwatanta da SMT?

THT yana da ƙarancin jarin kayan aiki amma yana da ƙarin kuɗin aiki/kayan aiki. SMT yana da ƙarin farashin kayan aiki amma yana da inganci/yawan aiki, wanda ke haifar da ƙarancin farashin na'urar na dogon lokaci.
50. Ta yaya za a inganta yawan amfani da THT ta hanyar inganta tsarin aiki?

Daidaita yanayin zafi, lokaci, da kuma yawan kwararar ruwa; ƙarfafa dubawa mai shigowa; kula da kayan aiki akai-akai; horar da masu aiki.

11. Aikace-aikace na musamman da hanyoyin gauraya

51. Menene fa'idodin haɗa THT/SMT gauraye?

Yana haɗa dacewar THT ga kayan aiki masu ƙarfi da ƙarancin yawan SMT, wanda ke biyan buƙatun ƙira da'ira masu rikitarwa.
52. Menene tsarin da ake bi wajen haɗa THT/SMT?

Sanya SMT da farko, sannan saka THT da solder (raƙuman ruwa ko zaɓi na solder). Tabbatar cewa sassan SMT na iya jure yanayin zafi na solder na THT.
53. Ta yaya za a hana rabuwar sassan SMT yayin haɗakar raƙuman ruwa a cikin hanyoyin gauraye?

Yi amfani da manne mai zafi sosai don gyara abubuwan SMT, daidaita sigogin haɗa raƙuman ruwa don rage tasirinsu, kuma yi amfani da raƙuman ruwa biyu don ingantaccen siffar raƙuman ruwa.
54. Waɗanne buƙatu na musamman THT ke da su don aikace-aikacen da suka fi aminci?

Abubuwan da suka fi inganci, PCBs, da solders; tsarin sarrafa solder mai tsauri; ƙarin matakan dubawa; yiwuwar amfani da hanyoyi na musamman kamar na'urar solder mai injin tsotsa.
55. Menene muhimman abubuwan kula da inganci ga THT a aikace-aikacen soja?

A bi ƙa'idodin soja sosai (misali, GJB), duba kayan da aka sarrafa 100%, hanyoyin yin soldering da za a iya gano su, da kuma gwaji na gaba (X-ray/ultrasonic).

12. Fasaha Mai Tasowa da Ci Gaban Nan Gaba

56. Menene yanayin ci gaban THT a nan gaba?

Ci gaba zuwa ga sarrafa kansa da hankali, haɗa sabbin kayayyaki da hanyoyin aiki don biyan buƙatun haɗuwa masu ƙarfi/masu yawa.
57. Menene tasirin buga 3D akan THT?

Yana ba da damar ƙera PCBs na musamman da kayan aiki cikin sauri, yana rage lokacin haɓakawa da ƙarancin farashin samarwa.
58. Menene fa'idodin amfani da AI a cikin THT?

Aikace-aikace a cikin inganta sigogin solder, gano lahani ta atomatik, da hasashen gazawar kayan aiki don haɓaka hankali.
59. Ta yaya sabbin kayan solder ke haifar da ci gaban THT?

Sabbin solders (misali, ƙarancin zafin jiki, yawan amfani da zafi mai yawa) suna biyan buƙatun aikace-aikace na musamman kuma suna faɗaɗa ikon THT.
60. Waɗanne ƙalubale da damammaki ne buƙatun kore ke kawo wa THT?

Kalubale: Bukatar kayan aiki/tsari masu dacewa da muhalli. Damammaki: Inganta haɓaka fasaha da sabbin buƙatun kasuwa.

13. Daidaita sigogin tsari

61. Yadda ake daidaita sigogin solder na raƙuman ruwa don gidajen sanyi akai-akai?

Gabobin sanyi galibi suna faruwa ne sakamakon rashin isasshen zafin jiki/lokaci. Ƙara zafin solder da 5-10℃ da lokacin hulɗa da 0.5-1s, ana inganta shi a hankali.
62. Ta yaya yawan kwararar ruwa ke shafar ingancin soldering? Ta yaya za a daidaita?

Ƙarancin yawan haɗuwa yana haifar da sanyin haɗin gwiwa; yawan haɗuwa yana haifar da ƙarin raguwa. Kula da takamaiman nauyi: ƙara yawan haɗuwa idan ƙasa ce, mai narkewa idan babba ce, don kiyaye kewayon aikin.
63. Ta yaya saurin sakawa ke shafar inganci a cikin injunan atomatik?

Gudu mai yawa yana haifar da rashin daidaito ko lalacewar gubar; jinkirin gudu yana rage inganci. Ƙayyade mafi kyawun gudu ta hanyar gwaji don daidaita inganci da inganci.
64. Menene rawar da zafin jiki kafin a fara dumamawa a cikin haɗakar THT? Yadda ake saita shi?

Zafi kafin lokaci yana cire danshi, yana rage damuwa ta zafi, kuma yana inganta danshi. Saita a 100-150℃, an daidaita shi don kayan PCB, kauri, da juriyar zafi na sassan.
65. Ta yaya zafin jiki na yanayi ke shafar haɗakar THT?

Ga kowace canjin 10℃ a yanayin zafi na yanayi, daidaita zafin da ake soya da 3-5℃. Ƙananan zafin jiki yana rage ruwan da ake soya; yanayin zafi mai yawa yana hanzarta fitar da ruwa. A kunna PCBs a ƙasa da 15℃.
66. Yadda za a hana rabuwar kushin PCB a cikin THT?

A iyakance lokacin yin solder zuwa 2-4s, a guji maimaita solder; yi amfani da PCBs masu Tg≥130℃; cire solder da bindigogin iska mai zafi mai ƙarancin zafi (≤350℃) da manna flux, rage cire pad da >80%.
67. Yadda ake kimanta juriyar gajiyar haɗin gwiwa na THT?

Gwajin zagayowar zafi (-40℃~125℃, zagayowar 500) don lura da yaɗuwar tsagewa; SEM don nazarin tsarin ƙananan ƙwayoyin cuta. Rayuwar gajiya ya kamata ta cika yanayin aminci na ƙira sau 3.
68. Menene rawar da kariyar nitrogen ke takawa a cikin haɗakar THT da aikace-aikacenta?

14. Cikakkun bayanai kan tsari da kuma magance matsaloli

69. Yadda ake sarrafa ragowar baƙi a kan haɗin haɗin solder na THT?

Baƙaƙen ragowar sau da yawa suna da sinadarin carbonization na flux. Yi amfani da ƙarancin aiki, ƙara zafin zafin da aka riga aka kunna da 10-15℃, ko kuma tsaftace shi da isopropyl alcohol idan akwai matsaloli masu tsanani.
70. Menene rawar da raƙuman ruwa biyu ke takawa a cikin haɗa raƙuman ruwa na THT?

Raƙuman ruwa masu tururi (A-wave) suna tsaftace gurɓatattun abubuwa kuma suna inganta shigar da solder; raƙuman ruwa masu santsi (B-wave) suna siffanta haɗin gwiwa kuma suna kawar da gada. An ba da shawarar rabon tsayi a 1:1.2-1:1.5.
71. Ta yaya canjin saurin jigilar kaya ke shafar ingancin haɗakar THT?

Sauyin gudu >±5% yana haifar da rashin daidaituwar lokacin soda, wanda ke haifar da sanyi ko yawan soda. Yi amfani da na'urar sarrafa servo mai rufewa don iyakance sauyi a cikin ±1%.
72. Yadda ake auna juriyar hulɗar lantarki na gidajen haɗin THT masu solder?

Yi amfani da na'urar auna ƙarfin lantarki mai ƙarfin lantarki na 1A don auna raguwar ƙarfin lantarki. Ya kamata juriyar hulɗa ta kasance ≤5mΩ (≤1mΩ ga gidajen da ke da ƙarfin lantarki mai yawa).
73. Menene buƙatun musamman na THT a cikin tarin caji na EV?

Ana buƙatar kariyar IP67, juriya ga danshi mai zafi na 85℃/85%RH na tsawon awanni 1000; dole ne tashoshin wutar lantarki masu ƙarfi su kasance suna da juriyar hulɗa ≤0.5mΩ da ƙarfin juriya ≥50N.

15. Sigogi na tsari da kula da kayan aiki

74. Menene alaƙar da ke tsakanin abun ciki mai ƙarfi na flux da kuma haɗa THT?

Yawan sinadarin da ke cikin tauri yawanci 10%-25%. Babban sinadarin yana ƙara ragowar; ƙarancin sinadarin yana rage cire sinadarin oxide. Ana ba da shawarar 15%-20% don yin solder ba tare da gubar ba.
75. Yadda ake warware karkatar da sassan bayan saka THT?

Duba matsin lamba na bututun ƙarfe (0.4-0.6MPa), daidaita daidaiton wurin ciyarwa (kuskuren ≤0.1mm), kuma yi amfani da manne da aka riga aka gyara don manyan abubuwan haɗin.
76. Yadda ake tsara girman buɗewar abin rufe fuska na PCB don THT?

Buɗewar ya kamata ta fi girman 0.1-0.2mm fiye da kushin da ke kowane gefe domin hana gurɓatar abin rufe fuska da kuma inganta yawan amfanin ƙasa da ~15%.
77. Menene muhimman abubuwan dubawa na yau da kullun don kayan aikin THT?

Duba zafin tukunyar solder (±3℃), yawan kwararar ruwa (±5% canjin yanayi), tsayin raƙuman ruwa (1.5-2.5mm), tashin hankali na jigilar kaya (20-30N), da juriyar ƙasa (≤4Ω).
78. Yadda ake gano lahani na solder na THT ta hanyar AOI?

Saita sigogi don siffar haɗin gwiwa, launi, kusurwar jika (≤30°), kuma yi amfani da koyon injin don ≥95% ƙimar gano lahani.

16. Aikace-aikace na Musamman da Aminci

79. Menene buƙatun musamman don haɗa gubar transformer a cikin THT?

Yi amfani da haɗin gwiwa don haɗa abubuwa da yawa, ƙara lokacin haɗa abubuwa zuwa 4-6s; yi amfani da mai haɗa abubuwa masu ɗauke da azurfa (misali, Sn96.5Ag3.0Cu0.5) tare da juriyar zafi ≤3℃/W.
80. Ta yaya tsayin daka ke shafar haɗakar THT?

Ga kowace ƙaruwar tsayin mita 1000, matsin lamba a yanayi yana raguwa da kashi 10%, kuma wurin tafasa na solder yana raguwa da kashi 5-8℃. Rage zafin solder da kuma ƙara yawan aiki.
81. Yadda ake magance shigar da sassan da ba a saba gani ba a cikin THT?

Yi amfani da kayan aiki na musamman ko jagorar hangen nesa na robot don daidaiton ±0.02mm; yi amfani da jagororin da ba su dace ba kafin a daidaita su daidai.
82. Me yasa haɗin haɗin solder na THT ke yin fari kuma ta yaya ake gyara shi?

Farin tabo yana faruwa ne saboda ƙazanta (misali, zinc) ko kuma yawan zafi (>270℃). Sauya solder kuma a kula da zafinsa a 230-260℃.
83. Me ake amfani da shi wajen daidaita kayan aikin THT na shekara-shekara?

Daidaita yanayin zafin jiki (±5℃), tsayin raƙuman ruwa (±0.1mm), ƙarar kwarara (±10%), da lokaci (±0.1s) don sigogin asali.

17. Kula da Inganci da Ka'idojin Masana'antu

84. Yadda ake ƙididdige yawan kuɗin shiga na farko na THT?

Yawan shiga na farko = (Jimillar raka'a - raka'o'in gazawa na farko)/Jimillar raka'a × 100%. Matsayi mai kyau ≥98%.
85. Menene buƙatun takardar shaida na THT a cikin kayan aikin siginar layin dogo?

Ana buƙatar takardar shaidar ingancin muhalli ta EN 50121 EMC da EN 50155. Haɗin haɗin da aka yi da solder dole ne ya wuce gwajin girgiza na 5-50Hz/2g na tsawon awanni 3.
86. Ta yaya gangaren zafin PCB ke shafar ingancin soldering na THT?

An ba da shawarar gangaren da za a kunna kafin a kunna a 1-3℃/s. Juyawa mai yawa yana haifar da damuwa ta zafi; rashin isasshen gangaren yana rage kunna kwararar ruwa. Juyawa mai kyau yana rage lahani da kashi 20%.
87. Yadda ake tantance ƙarfin solder na solders na THT?

Yi amfani da gwajin daidaiton jika: Mai solder na Sn-Pb ya kamata ya kai ga ƙarfin jika ≤2s a 235℃, ko kuma kusurwar jika ≤25° don ingantaccen aiki.
88. Ta yaya za a hana sassauta haɗin haɗin mai haɗawa a cikin THT?

A shafa makullin threadlocker (misali, Loctite 243) don ƙarfin juyi na 10-15N・m mai hana sassautawa, ko kuma a yi amfani da makullin injina don juriya ga girgiza.

18. Inganta tsari da fasahohin zamani

89. Ta yaya mitar solder ke shafar amincin haɗin gwiwa na THT?

Maimaita yin soldering fiye da sau 3 yana ƙara kauri tsakanin layukan ƙarfe da kashi 50% kuma yana rage tsawon lokacin gajiya da kashi 60%. Iyakance zuwa ≤2 ƙoƙarin yin soldering a kowace haɗin gwiwa.
90. Yadda ake ƙididdige ƙimar samar da dattin solder a cikin THT?

Yawan datti = (Jimillar da aka yi amfani da solder - Ingancin solder da aka yi amfani da shi)/Jimillar da aka yi amfani da solder × 100%. Ikon da aka saba sarrafawa ≤3%-5%.
91. Menene buƙatun tsafta ga THT a cikin kayayyakin soja?

Dole ne ya cika ƙa'idodin MIL-P-28809 tare da gurɓataccen ionic a saman ≤1.0μg/cm², an gwada shi ta hanyar ion chromatography don hana ƙaura ta lantarki.
92. Yadda ake inganta saurin sanyaya a cikin haɗakar raƙuman THT?

Ana ba da shawarar saurin sanyaya a 3-5℃/s. Da sauri yana haifar da tsagewa; jinkirin rage inganci. Yi amfani da sanyaya iska da ruwa da aka tilasta don sarrafa daidaito.
93. A ina ne THT zai iya haɗuwa da sabbin fasahohin solder (misali, soldering na laser)?

A cikin allunan gauraye masu yawan yawa, yi amfani da na'urar solder laser don SMT da na'urar solder wave don abubuwan THT masu ƙarfi; ko sake yin amfani da laser don gyara lahani na THT.

Fasahar saka rami ta hanyar THT

1. Manufofi da ƙa'idodi na asali

1. Menene Fasahar Rami ta Hanyar Rami (THT)?

2. Menene manyan bambance-bambance tsakanin THT da Surface Mount Technology (SMT)?

3. Menene ainihin tsarin THT?

4. Waɗanne nau'ikan kayan lantarki ne suka dace da THT?

5. Menene mafi ƙarancin diamita ta hanyar PCB a cikin tsarin THT?

2. Sarrafa Kayan Aiki da Fil

6. Menene siffofi na yau da kullun na jagororin sassan THT?

7. Menene buƙatun sassaucin soldering don raka'o'in sassan?

8. Yadda ake inganta yadda ake haɗa sinadaran da ke cikin kwamfutocin?

9. Menene tsawon gubar da ta dace da sassan THT?

10. Ta yaya kayan gubar daban-daban ke shafar haɗakar sinadarai?

3. Allon Da'ira Mai Bugawa (PCB) Mai Alaƙa

11. Menene buƙatun kayan PCB a cikin tsarin THT?

12. Menene ƙa'idodin haƙuri ga hanyoyin PCB?

13. Yadda za a hana lalacewar PCB yayin haɗa THT?

14. Ta yaya ta hanyar rashin ƙarfi na bango ke shafar haɗakar solder?

15. Menene buƙatun musamman na PCBs masu layuka da yawa a cikin THT?

4. Tsarin Walda - Walda Mai Rage Rage

16. Menene babban ƙa'idar haɗa igiyoyi?

17. Menene yanayin zafin solder na yau da kullun don soldering na raƙuman ruwa?

18. Menene lokacin da ake amfani da shi wajen haɗa igiyoyi?

19. Yadda ake daidaita tsayin raƙuman ruwa a cikin haɗa raƙuman ruwa?

20. Waɗanne hanyoyi ne ake amfani da su wajen haɗa ruwan da kuma halayensu?

5. Tsarin Walda - Walda da hannu da sauransu

21. Yadda ake sarrafa zafin jiki da lokacin da za a haɗa sassan THT da hannu?

22. Menene halaye da aikace-aikacen soldering na dip?

23. Menene fa'idodin yin solder na zaɓi?

24. Za a iya amfani da sake haɗa solder don abubuwan THT?

25. Menene buƙatun solder don hanyoyin solder daban-daban?

6. Solder da Flux

26. Menene abubuwan da aka fi amfani da su wajen haɗa solders na THT?

27. Menene bambance-bambancen aikin solder tsakanin solders marasa gubar da kuma solders marasa gubar?

28. Menene babban aikin kwararar ruwa?

29. Ta yaya ake rarraba matakan ayyukan kwarara?

30. Menene tasirin ragowar kwararar ruwa akan da'irori?

7. Kayan aiki da Kayan aiki

31. Waɗanne manyan nau'ikan injinan sakawa ta atomatik ne?

32. Menene daidaiton shigar da injinan sakawa ta atomatik?

33. Menene gyaran injunan solder na yau da kullun ya ƙunsa?

34. Menene muhimman abubuwan da ake buƙata don zaɓar da amfani da kayan aikin solder da hannu?

35. Waɗanne nau'ikan kayan aiki ne ake amfani da su a cikin tsarin THT?

8. Kula da inganci da nazarin lahani

36. Waɗanne lahani ne ake samu a cikin haɗakar THT?

37. Menene dalilai da mafita ga gidajen sanyi?

38. Menene dalilai da matakan kariya don haɗa hanyoyin haɗin gwiwa?

39. Yadda ake duba ingancin soldering na THT?

40. Menene ƙa'idodin inganci don haɗa THT?

9. Kare Muhalli da Tsaro

41. Menene buƙatun muhalli don hanyoyin THT?

42. Waɗanne buƙatu na musamman ne masu aikin solder ba tare da gubar ba ke da su?

43. Yadda ake zubar da sharar da aka yi da kuma ruwa a cikin hanyoyin THT?

44. Menene buƙatun iska don bita na soldering?

45. Waɗanne matakan kariya ne ake ɗauka don sinadarai da ake amfani da su a cikin hanyoyin THT?

10. Inganta tsari da kuma kula da farashi

46. ​​Yadda za a inganta ingancin tsarin THT?

47. Menene manyan abubuwan da ke cikin tsarin THT?

48. Ta yaya za a rage farashin samar da THT?

49. Ta yaya farashin THT yake idan aka kwatanta da SMT?

50. Ta yaya za a inganta yawan amfani da THT ta hanyar inganta tsarin aiki?

11. Aikace-aikace na musamman da hanyoyin gauraya

51. Menene fa'idodin haɗa THT/SMT gauraye?

52. Menene tsarin da ake bi wajen haɗa THT/SMT?

53. Ta yaya za a hana rabuwar sassan SMT yayin haɗakar raƙuman ruwa a cikin hanyoyin gauraye?

54. Waɗanne buƙatu na musamman THT ke da su don aikace-aikacen da suka fi aminci?

55. Menene muhimman abubuwan kula da inganci ga THT a aikace-aikacen soja?

12. Fasaha Mai Tasowa da Ci Gaban Nan Gaba

56. Menene yanayin ci gaban THT a nan gaba?

57. Menene tasirin buga 3D akan THT?

58. Menene fa'idodin amfani da AI a cikin THT?

59. Ta yaya sabbin kayan solder ke haifar da ci gaban THT?

60. Waɗanne ƙalubale da damammaki ne buƙatun kore ke kawo wa THT?

13. Daidaita sigogin tsari

61. Yadda ake daidaita sigogin solder na raƙuman ruwa don gidajen sanyi akai-akai?

62. Ta yaya yawan kwararar ruwa ke shafar ingancin soldering? Ta yaya za a daidaita?

63. Ta yaya saurin sakawa ke shafar inganci a cikin injunan atomatik?

64. Menene rawar da zafin jiki kafin a fara dumamawa a cikin haɗakar THT? Yadda ake saita shi?

65. Ta yaya zafin jiki na yanayi ke shafar haɗakar THT?

66. Yadda za a hana rabuwar kushin PCB a cikin THT?

46. Yadda za a inganta ingancin tsarin THT?