PCB mai ƙarfi

1. Menene PCB mai tsauri?

Allon da'ira da aka buga da aka yi da madaidaitan abubuwa (misali, fiberglass na FR4), mai karko kuma wanda ba ya lalacewa, wanda ake amfani da shi a cikin na'urori masu buƙatar da'irori masu kauri (misali, motherboards na kwamfuta).
2. Menene bambanci tsakanin PCBs masu tauri da masu sassauƙa?

Kayan aiki: Mai ƙarfi yana amfani da fiberglass, mai sassauci yana amfani da polyimide. Tsarin: Mai ƙarfi ba zai iya lanƙwasa ba, mai sassauci yana iya lanƙwasawa. Aikace-aikace: Mai ƙarfi don haɗin da ke da ƙarfi, mai sassauci ga ƙananan wurare.
3. Waɗanne nau'ikan tsarin gini ne?

Layi ɗaya, mai layi biyu, mai layi da yawa. Layi ɗaya yana da da'irori a gefe ɗaya; layi biyu a duka biyun; layi da yawa yana haɗa layi mai sarrafawa ta hanyar vias (misali, motherboards).
4. Menene manyan fannonin aikace-aikace?

Kwamfutocin tebur, talabijin, sarrafa masana'antu, na'urorin lantarki na mota (kwamfutocin cikin mota), kayan aikin da ba sa girgiza sararin samaniya, da sauransu.
5. Ta yaya farashin zai kwatanta da na'urorin PCB masu sassauƙa?

Rage farashi. PCBs masu ƙarfi suna da tsari mai kyau da kayan aiki masu arha; PCB masu sassauƙa suna da tsada saboda kayan aiki masu rikitarwa da tsare-tsare.
6. Menene yanayin zafin jiki?

Abubuwan da aka saba amfani da su na FR4: -55°C zuwa 125°C don amfani na yau da kullun, na ɗan gajeren lokaci 260°C don soldering ba tare da gubar ba. Kayayyaki na musamman na iya jure yanayin zafi mafi girma.
7. Menene girman da aka saba amfani da shi?

Daga ƴan cm² (ƙananan allon sarrafawa) zuwa wasu m² (manyan uwa na uwar garken).
8. Yaya game da nauyin?

Ya danganta da girma, yadudduka, da kayan aiki. Allon FR4 masu layuka da yawa: ~1-3 kg/m², sun fi nauyi fiye da PCB masu sassauƙa na yanki ɗaya.
9. Menene tsawon rayuwar sabis na yau da kullun?

Shekaru 10-20+ a cikin yanayi na yau da kullun; an rage shi zuwa shekaru a cikin yanayi mai wahala (zafin jiki/danshi mai yawa).
10. Wane irin matsin lamba na injiniya zai iya jurewa?

FR4 yana da tsarin lankwasawa na ~100-200MPa, ƙasa da PCBs masu lankwasa. Ƙara kauri yana ƙara juriya ga damuwa.
11. Menene kayan da aka saba amfani da su a cikin substrate?

FR4 (fiberglass epoxy), resin phenolic, resin epoxy; PTFE don aikace-aikacen mita na musamman.
12. Menene halayen FR4?

Kyakkyawan rufin lantarki, halayen injina, da kwanciyar hankali na girma. CTE: 13-17ppm/℃. Ƙananan farashi da kuma hanyoyin da suka tsufa.
13. Menene rashin amfanin sinadaran resin phenolic?

Ƙananan zafin ruɓewa (120-150°C), yana iya rage lalacewa yayin soldering, rashin kyawun yanayin lantarki/inji, yawan CTE, da kuma wari.
14. Menene rawar da foil ɗin jan ƙarfe ke takawa da kuma kauri da aka saba da shi?

Yana samar da alamun kwararar wutar lantarki. Kauri na yau da kullun: 0.5oz (17μm), 1oz (35μm), 2oz (70μm). Foils masu kauri don amfani da wutar lantarki mai ƙarfi.
15. Menene aikin Layer ɗin abin rufe fuska na solder?

Yana rufewa don hana gajerun da'irori, yana kare jan ƙarfe daga iskar shaka da lalacewar jiki, kuma yana bambanta wurare ta launi (misali, kore, shuɗi).
16. Menene rawar da layin siliki da launuka na gama gari ke takawa?

Yana buga haruffa/alamomi don gano sassan yayin samarwa da gyara kurakurai. Launin gama gari: fari; da launin toka, ja, baƙi, rawaya, da sauransu.
17. Ta yaya nau'ikan substrates daban-daban ke shafar aiki?

FR4: Ƙarancin farashi don amfani gabaɗaya. Kayan aiki masu yawan mita (misali, PTFE): Ƙarancin asarar sigina don 5G. Abubuwan yumbu: Babban ƙarfin lantarki na zafi don aikace-aikacen zafi mai yawa.
18. Yadda ake zaɓar kayan da aka yi da substrate?

Yi la'akari da wutar lantarki (ƙarfin lantarki mai yawa/ƙarfin lantarki mai yawa), injina (girgiza), zafin jiki, da farashi. Yi amfani da FR4 don kayan lantarki na masu amfani, PTFE don yawan mita, da kuma yumbu don yawan zafi.
19. Menene ƙa'idodin muhalli?

RoHS: Yana takaita abubuwa masu haɗari (guba, mercury, da sauransu). Babu halogen: Br/Cl
20. Ta yaya sabbin kayayyaki ke shafar ci gaba?

Kayan da ba su da ƙarancin CTE suna inganta daidaiton girma. Babban ƙarfin lantarki na zafi yana ƙara yawan watsa zafi. Masu hana zafi masu aiki sosai suna rage asarar sigina, suna ba da damar rage aiki da kuma babban aiki.
21. Waɗanne abubuwa ne ya kamata a yi la'akari da su a cikin ƙira?

Ingancin sigina (daidaitawa tsakanin sigina, hana tunani/tattaunawar haɗin gwiwa), rarraba wutar lantarki, grounding, da ƙarfin ɗaukar wutar lantarki.
22. Yadda ake yin ƙirar hanya?

Rage alamun sigina, rage hanyoyin sadarwa. Yi amfani da nau'ikan bambance-bambance don sigina masu sauri da juriyar sarrafawa. Jiragen wuta/ƙasa tare da tagulla mai ƙarfi. Modules na rabuwa don guje wa tsangwama. Faɗin layi bisa ga halin yanzu.
23. Menene muhimman abubuwan da aka yi amfani da su ta hanyar ƙira?

Girman ya dogara da kauri/hawa (allon da suka fi kauri suna buƙatar manyan hanyoyin sadarwa). Rage ta hanyar ƙidaya. Haƙa baya don siginar sauri don cire ƙusoshin.
24. Menene daidaita impedance kuma ta yaya ake cimma hakan?

Daidaita tushen, layin watsawa, da kuma tasirin kaya don rage haske. An cimma hakan ta hanyar sarrafa faɗin layi, tazara, kauri na dielectric, da kuma izinin aiki (misali, faɗin 0.33mm don microstrip 50Ω akan FR4).
25. Yadda za a rage tsangwama ta hanyar lantarki (EMI)?

Abubuwan rabawa; kiyaye sassa masu mahimmanci daga tushen hayaniya. Jiragen wuta/ƙasa a cikin allunan yadudduka da yawa don kariya. Jiragen ƙasa a kusa da sigina masu sauri. Haɗa capacitors; ingantaccen tsarin ƙasa.
26. Menene ƙa'idodin tsarin sassan?

Rarraba abubuwa masu aiki, raba abubuwan da ke da saurin zafi, sanya abubuwan da ke da saurin mitoci a kusa, fifita manyan abubuwan da ke da muhimmanci, da kuma tabbatar da sauƙin shigarwa/gyara su.
27. Yadda ake tsara layin wutar lantarki?

Makamai masu ƙarfi da na ƙasa da ke kusa da su don rage inductance. Wutar lantarki tare da haɗin kai. Tagulla mai ƙarfi don jiragen wutar lantarki; kauri hanyoyin wutar lantarki masu ƙarfi.
28. Yadda za a magance matsalar fitar da zafi?

Tashoshin zafi da jiragen jan ƙarfe a ƙarƙashin abubuwan zafi. Abubuwan da ke haifar da yawan zafin jiki. Tsarin kwararar iska; ƙara matattarar zafi/fanka idan ana buƙata.
29. Menene kewayon jure wa ƙira gabaɗaya?

Matsayin rami: ±0.1mm. Tayoyin da aka yi wa fenti: ±0.076mm. Tayoyin da ba a yi wa fenti ba: ±0.05mm. Faɗin layi: ±10%-20%.
30. Waɗanne zaɓuɓɓukan software ne na ƙira?

Mai Zane-zanen Altium (ya dace da ƙira-ƙira ...
31. Menene tsarin ƙera kayayyaki?

Fanelin → Hakowa → Ajiye jan ƙarfe → Hoto → Faranti → Saƙa → Abin rufe fuska na solder → Silkscreen → Kammala saman → Faɗakarwa.
32. Waɗanne matsaloli ne ake yawan samu a fannin haƙa rijiyoyi da kuma hanyoyin magance su?

Matsaloli: Bango masu kauri, burrs, da kuma raunin da suka yi. Magani: Sauya injinan motsa jiki, inganta saurin/abincin da aka ci, duba kayan aiki.
33. Menene rawar da ma'ajiyar jan ƙarfe da kuma manyan abubuwan sarrafawa ke takawa?

Aikin: Gudanar da bangon ramuka don haɗa layuka. Sarrafawa: Tsarin maganin, zafin jiki (25-35°C), pH (11-12), tsafta kafin a yi magani.
34. Menene hanyoyin ɗaukar hoto da kuma fa'idodinsu?

Photolithography: Babban daidaito ga HDI, tsada mai yawa da rikitarwa. Buga allo: Kayan aiki masu rahusa/sauƙi, ƙarancin daidaito.
35. Yadda ake sarrafa kauri na jan ƙarfe a cikin faranti?

Sarrafa ta hanyar yawan wutar lantarki, lokacin sanya plating, da kuma yawan ruwan da ke cikinta. Misali, 1oz (35μm) yana buƙatar mintuna 20-30 a 2-3A/dm².
36. Ta yaya za a tabbatar da daidaiton sassaka yayin aikin sassaka?

Kula da yawan fitar da iskar gas, zafin jiki, lokaci, da matsin lamba na feshi, kuma kula da kayan aiki akai-akai. Yawan fitar da iskar gas na iya haifar da yawan fitar da iskar gas, yayin da ƙarancin yawan fitar da iskar gas ke haifar da rashin cikakken aikin feshi. A kiyaye zafin jiki a 45-55℃, a ƙayyade lokaci bisa ga kauri na allo, da sauransu, kuma a tabbatar da matsin lamba iri ɗaya don cikakken hulɗa.
37. Menene buƙatun inganci don buga abin rufe fuska na solder?

A rufe da'irar gaba ɗaya ba tare da an rasa bugu, ramukan filaye, ko kumfa ba. Kauri mai a saman jan ƙarfe: 10-18μm, ta hanyar: 5-8μm. Tazara mai dacewa daga gefunan da'ira don hana rufewa da yawa ko haɗarin gajeren da'ira.
38. Menene matakan kariya don buga haruffa?

Ya kamata haruffa su kasance a sarari, cikakke, tare da kyakkyawan bambancin launi, a sanya su daidai ba tare da toshe manyan wurare ba, kuma suna da manne mai ƙarfi (zaɓi tawada masu dacewa da hanyoyin warkarwa).
39. Waɗanne hanyoyi ne gama gari ake amfani da su wajen kammala saman PCBs masu tauri? Menene halayensu?

HASL: Ƙaramin farashi, ingantaccen solder, ƙarancin lanƙwasa. ENIG: Santsi, mai kyau wajen solder da juriya ga tsatsa, farashi mai yawa. Tin na nutsewa: Kyakkyawan solder, santsi a saman, tsawon lokacin shiryawa. OSP: Ƙaramin farashi, tsari mai sauƙi, riƙewa na ɗan gajeren lokaci.
40. Menene hanyoyin ƙera kayan gini? Yadda ake zaɓa?

Yanke injina (daidaitaccen aiki, ya dace da manyan girma masu rikitarwa). Huda (ingantaccen aiki, ya dace da samar da taro na yau da kullun). Yanke Laser (daidaitaccen aiki, farashi mai yawa, ya dace da ƙananan rukuni). Zaɓi bisa ga siffa, daidaito, girman rukuni, da farashi.
41. Waɗanne bincike ake buƙata yayin ƙera PCB mai tsauri?

Duba girma/kauri bayan yankewa. Duba matsayin rami, girma, da bango bayan haƙa ramin. Gwada kauri/daidaiton tagulla bayan an yi masa fenti. Duba ingancin da'irar bayan an yi masa fenti. Duba ingancin bugu na abin rufe fuska/haruffa na solder. Gwada kauri/mannewa bayan an gama saman. Duba siffa/gefe bayan an yi masa gyaggyara.
42. Yadda ake gwada aikin wutar lantarki na PCBs masu tsauri?

Yi amfani da na'urorin gwajin jirgin sama ko kayan aikin ICT. Na'urar gwajin jirgin sama ta dace da ƙananan rukuni/nau'i, gano buɗewa/gajere, da sauransu. ICT an yi ta ne don samar da kayayyaki da yawa, gwada cikakken aikin lantarki ta amfani da kayan aiki na musamman.
43. Menene rawar da binciken X-ray ke takawa a gwajin PCB mai tsauri?

Gano ta hanyar haɗin kai, voids, da kuma ingancin jan ƙarfe a cikin allunan layuka da yawa. Duba haɗin haɗin solder na BGA da lahani na ciki (baƙi, ɓarna) ba tare da lalata su ba.
44. Menene ƙa'ida da yanayin amfani na AOI (Dubawar gani ta atomatik)?

Tattara hotuna ta hanyar kyamarorin gani kuma a kwatanta su da mizani don gano lahani kamar abubuwan da suka ɓace, rashin daidaito, gajeren wando. Ana amfani da shi a lokacin dubawa na ainihi bayan bugawa, sanyawa, da sake haɗa kayan aiki don inganta inganci da inganci.
45. Yadda ake gwada halayen injiniya na PCBs masu tsauri?

Gwajin lanƙwasa (duba fasa a kusurwoyi/zagaye da aka ƙayyade). Gwajin faɗuwa (kwaikwayi tasirin). Gwajin girgiza (kwaikwayi girgiza don duba haɗakar da siffa).
46. Yadda ake zaɓar hanyoyin kammala saman don PCBs masu tauri?

Dangane da IPC-4552, ENIG ya dace da yawan mita/aminci mai yawa (Ni: 3-5μm, Au: 0.05-0.1μm). OSP yana da ƙarancin kuɗi (kauri fim: 0.2-0.5μm, ya dace da ajiya na ɗan gajeren lokaci). HASL ya girma (Kauri Sn > 2.5μm, rashin lanƙwasa).
47. Yadda ake magance matsalolin etching a cikin masana'antar PCB mai tsauri?

Daidaita yawan ruwan da aka yi amfani da shi (mai narkewar acid: CuCl₂ 180-220g/L, HCl 1.0-1.5mol/L), zafin jiki 50-55℃. Don rage yawan fitar da ruwa, rage gudu kuma ƙara matsin lamba na feshi zuwa 2-3bar.
48. Menene buƙatar daidaitawa tsakanin layukan biyu don PCBs masu tauri masu layi da yawa?

Dangane da IPC-6012, allon layi mai yawa na gabaɗaya ≤75μm, allon HDI ≤50μm. Daidaiton wurin haƙa laser ±25μm, wanda aka sarrafa shi da injunan fallasa masu inganci.
49. Menene ƙa'idar ƙarfin lanƙwasawa ga PCBs masu tauri?

Kayan FR-4: tsayi ≥345MPa, mai karkata ≥276MPa (ASTM D790). Kauri 1.6mm ≥300MPa.
50. Yadda ake gwada kauri ta hanyar jan ƙarfe na PCBs masu tauri?

Sashen sassaka na ƙarfe (IPC-TM-650, ramin da ya ratsa ≥20μm, makaho/an binne shi ta hanyar ≥18μm). Gwajin XRF mara lalatawa (daidai ±0.5μm).
51. Menene mafi kyawun yanayin zafi don haɗa PCBs masu tauri?

Zafi kafin lokaci: 90-130℃ (60-120s). Yankin da ake yin soldering: 240-260℃ (lambar 2-4s). Yawan sanyaya: 3-6℃/s (J-STD-003).
52. Menene kauri gabaɗaya na abin rufe fuska na solder don PCBs masu tauri?

Na al'ada: 15-30μm (IPC-6012), wurare masu yawa ≥20μm. Buga allo: 20-25μm, haske mai laushi: 15-20μm.
53. Menene mafi ƙarancin faɗin/tazara tsakanin layukan PCB masu tauri?

Na al'ada: 6/6mil (0.1524mm). LDI + etching na sinadarai: 3/3mil (0.0762mm). Allon HDI: 1/1mil (0.0254mm).
54. Yadda ake zaɓar tsakanin ta hanyar rufewa da haɗawa da ƙirar PCB mai tsauri?

Don amfani da wutar lantarki, zaɓi toshewar resin (zurfin ≥80% ta hanyar zurfin, kuskuren lanƙwasa ≤10μm). Don amfani da rufin kawai, zaɓi murfin (faɗin murfin ≥0.1mm).
55. Yadda ake magance danshi a cikin PCBs masu tauri?

Dangane da IPC-J-STD-033, a gasa a zafin 125℃ na tsawon awanni 4-8 (≤1.6mm: awanni 4, ＞1.6mm: awanni 8) don rage danshi ƙasa da 0.1%.
56. Ta yaya rashin kyawun foil na tagulla ke shafar watsa sigina a cikin PCBs masu tsauri?

Ƙarfin da ya fi girma yana ƙara tasirin fata da asarar sigina. RTF foil Ra＜0.5μm (ya dace da yawan mita mai yawa >10GHz). VLP foil Ra＜0.3μm (rage asara 15%-20%).
57. Yadda ake cire burrs daga ramukan da aka haƙa a cikin PCBs masu tauri?

Injin gogewa (matsi 0.3-0.5MPa, gudu 2-3m/min). Sinadarin micro-etching (sodium persulfate 100-150g/L, 40-50℃, minti 1-2).
58. Menene buƙatar daidaiton sarrafa impedance ga PCBs masu tauri?

Gabaɗaya: iyaka ɗaya ±10%, bambanci ±8%. Babban gudu (>1Gbps): iyaka ɗaya ±5%, bambanci ±3%, an daidaita ta hanyar faɗin layi, kauri dielectric, kauri jan ƙarfe.
59. Menene ma'aunin ƙarfin lantarki mai jurewa ga PCBs masu tauri?

Ga kowace UL 796, kayan FR-4 ≥1400V/mm a 25℃/50% RH. Nisa mai rarrafe 1mm ya yi daidai da 100-200V.
60. Menene ƙirar masana'anta (DFM) na PCBs masu tauri ke dubawa?

Mafi ƙarancin faɗin layi/tazara, diamita/tazara rami (kushin ≥ rami +0.4mm lokacin da ramin ≥0.3mm), rabon yanki na jan ƙarfe (30%-70%), rabon ɓangaren haƙa rami (≤8:1), faɗin gadar abin rufe fuska na solder (≥0.1mm).
61. Menene dalilai da mafita ga nakasa yayin sake haɗa PCBs masu ƙarfi?

Dalilai: Rashin daidaiton CTE, kauri mara daidaito, lanƙwasa yanayin zafi mara kyau. Magani: Zaɓi kayan CTE ≤15ppm/℃, sarrafa juriyar kauri ±0.05mm, inganta ƙimar dumama ≤3℃/s.
62. Menene buƙatar juriya ga rufin saman (SIR) ga PCBs masu tauri?

Ga IPC-TM-650, ≥10¹⁰Ω bayan awanni 168 a 85℃/85% RH, ≥10¹²Ω don aikace-aikacen da suka dace, waɗanda ke buƙatar kulawar tsaftar saman.
63. Menene bambanci tsakanin makafi da kuma binnewa ta hanyar ƙera abubuwa a cikin PCBs masu tsauri?

Tashoshin makafi: Hakowar Laser/inji + rufi, zurfin ≤0.5mm, don haɗa saman. Tashoshin da aka binne: Hakowar inji + lamination, wanda ke buƙatar daidaitawa, don siginar ciki don rage sigogin ƙwayoyin cuta.
64. Menene fa'idodi da rashin amfanin gwajin jirgin sama da na ƙusoshi ga PCB masu tauri?

Na'urar auna ƙusa: Rufewa daga sama zuwa ƙasa da kashi 98%, ya dace da ƙananan rukuni/yawan yawa, a hankali (3-5s/maki). Gado na ƙusoshi: Sauri (
65. Ta yaya kauri foil ɗin jan ƙarfe ke shafar watsar da zafi a cikin PCBs masu tauri?

Kowace ƙaruwar 1oz (35μm) tana ƙara yawan wutar lantarki da kashi 38%. Foil ɗin 3oz a cikin aikace-aikacen wutar lantarki mai ƙarfi yana rage hauhawar zafin jiki da kashi 15%-20% ta hanyar amfani da hanyoyin zafi.
66. Menene mafi ƙarancin faɗin gadar mai kore ga PCBs masu tauri?

Na al'ada: 0.1mm. Allunan da ke da yawan yawa tare da LDI: 0.075mm, suna hana haɗa kayan haɗin.
67. Waɗanne matsaloli ne ake yawan samu a HASL (matakin solder mai zafi) ga PCBs masu tauri?

Rashin daidaiton solder akan kushin, rashin isasshen ta hanyar solder, da kuma saman da bai daidaita ba.

PCB mai ƙarfi

1. Menene PCB mai tsauri?

2. Menene bambanci tsakanin PCBs masu tauri da masu sassauƙa?

3. Waɗanne nau'ikan tsarin gini ne?

4. Menene manyan fannonin aikace-aikace?

5. Ta yaya farashin zai kwatanta da na'urorin PCB masu sassauƙa?

6. Menene yanayin zafin jiki?

7. Menene girman da aka saba amfani da shi?

8. Yaya game da nauyin?

9. Menene tsawon rayuwar sabis na yau da kullun?

10. Wane irin matsin lamba na injiniya zai iya jurewa?

11. Menene kayan da aka saba amfani da su a cikin substrate?

12. Menene halayen FR4?

13. Menene rashin amfanin sinadaran resin phenolic?

14. Menene rawar da foil ɗin jan ƙarfe ke takawa da kuma kauri da aka saba da shi?

15. Menene aikin Layer ɗin abin rufe fuska na solder?

16. Menene rawar da layin siliki da launuka na gama gari ke takawa?

17. Ta yaya nau'ikan substrates daban-daban ke shafar aiki?

18. Yadda ake zaɓar kayan da aka yi da substrate?

19. Menene ƙa'idodin muhalli?

20. Ta yaya sabbin kayayyaki ke shafar ci gaba?

21. Waɗanne abubuwa ne ya kamata a yi la'akari da su a cikin ƙira?

22. Yadda ake yin ƙirar hanya?

23. Menene muhimman abubuwan da aka yi amfani da su ta hanyar ƙira?

24. Menene daidaita impedance kuma ta yaya ake cimma hakan?

25. Yadda za a rage tsangwama ta hanyar lantarki (EMI)?

26. Menene ƙa'idodin tsarin sassan?

27. Yadda ake tsara layin wutar lantarki?

28. Yadda za a magance matsalar fitar da zafi?

29. Menene kewayon jure wa ƙira gabaɗaya?

30. Waɗanne zaɓuɓɓukan software ne na ƙira?

31. Menene tsarin ƙera kayayyaki?

32. Waɗanne matsaloli ne ake yawan samu a fannin haƙa rijiyoyi da kuma hanyoyin magance su?

33. Menene rawar da ma'ajiyar jan ƙarfe da kuma manyan abubuwan sarrafawa ke takawa?

34. Menene hanyoyin ɗaukar hoto da kuma fa'idodinsu?

35. Yadda ake sarrafa kauri na jan ƙarfe a cikin faranti?

36. Ta yaya za a tabbatar da daidaiton sassaka yayin aikin sassaka?

37. Menene buƙatun inganci don buga abin rufe fuska na solder?

38. Menene matakan kariya don buga haruffa?

39. Waɗanne hanyoyi ne gama gari ake amfani da su wajen kammala saman PCBs masu tauri? Menene halayensu?

40. Menene hanyoyin ƙera kayan gini? Yadda ake zaɓa?

41. Waɗanne bincike ake buƙata yayin ƙera PCB mai tsauri?

42. Yadda ake gwada aikin wutar lantarki na PCBs masu tsauri?

43. Menene rawar da binciken X-ray ke takawa a gwajin PCB mai tsauri?

44. Menene ƙa'ida da yanayin amfani na AOI (Dubawar gani ta atomatik)?

45. Yadda ake gwada halayen injiniya na PCBs masu tsauri?

46. ​​Yadda ake zaɓar hanyoyin kammala saman don PCBs masu tauri?

47. Yadda ake magance matsalolin etching a cikin masana'antar PCB mai tsauri?

48. Menene buƙatar daidaitawa tsakanin layukan biyu don PCBs masu tauri masu layi da yawa?

49. Menene ƙa'idar ƙarfin lanƙwasawa ga PCBs masu tauri?

50. Yadda ake gwada kauri ta hanyar jan ƙarfe na PCBs masu tauri?

51. Menene mafi kyawun yanayin zafi don haɗa PCBs masu tauri?

52. Menene kauri gabaɗaya na abin rufe fuska na solder don PCBs masu tauri?

53. Menene mafi ƙarancin faɗin/tazara tsakanin layukan PCB masu tauri?

54. Yadda ake zaɓar tsakanin ta hanyar rufewa da haɗawa da ƙirar PCB mai tsauri?

55. Yadda ake magance danshi a cikin PCBs masu tauri?

56. Ta yaya rashin kyawun foil na tagulla ke shafar watsa sigina a cikin PCBs masu tsauri?

57. Yadda ake cire burrs daga ramukan da aka haƙa a cikin PCBs masu tauri?

58. Menene buƙatar daidaiton sarrafa impedance ga PCBs masu tauri?

59. Menene ma'aunin ƙarfin lantarki mai jurewa ga PCBs masu tauri?

60. Menene ƙirar masana'anta (DFM) na PCBs masu tauri ke dubawa?

61. Menene dalilai da mafita ga nakasa yayin sake haɗa PCBs masu ƙarfi?

62. Menene buƙatar juriya ga rufin saman (SIR) ga PCBs masu tauri?

63. Menene bambanci tsakanin makafi da kuma binnewa ta hanyar ƙera abubuwa a cikin PCBs masu tsauri?

64. Menene fa'idodi da rashin amfanin gwajin jirgin sama da na ƙusoshi ga PCB masu tauri?

65. Ta yaya kauri foil ɗin jan ƙarfe ke shafar watsar da zafi a cikin PCBs masu tauri?

66. Menene mafi ƙarancin faɗin gadar mai kore ga PCBs masu tauri?

67. Waɗanne matsaloli ne ake yawan samu a HASL (matakin solder mai zafi) ga PCBs masu tauri?

46. Yadda ake zaɓar hanyoyin kammala saman don PCBs masu tauri?