Taro na PCB

1. Menene PCBA?

PCBA takaitaccen bayani ne na Taro na Hukumar Kula da Da'ira ta Buga, wanda ke nufin tsarin haɗa sassan lantarki a kan PCB don samar da cikakken tsarin da'ira. Wannan muhimmin mataki ne a cikin kera kayayyakin lantarki.
2. Menene manyan fasahar taron PCB?

Galibi Fasaha Ta Hanyar-Rami (THT), Fasaha Ta Sama (SMT), da fasahar haɗakarwa. Abubuwan haɗakarwa na THT tare da jakunkuna da aka saka ta cikin ramuka, abubuwan haɗakarwa na SMT kai tsaye akan saman PCB, kuma fasahar haɗakarwa ta haɗu duka biyun.
3. Menene muhimman matakai a cikin taron PCB?

Matakan sun haɗa da shirya kayan aiki, duba PCB, SMT (buga manna mai solder, sanya sassan, sake haɗa manne), THT (aikin sarrafa gubar, haɗa manne da raƙuman ruwa), walda, gwajin inganci, tsaftacewa & rufewa, da kuma haɗawa ta ƙarshe.
4. Me yasa haɗa PCB yake da mahimmanci ga kayayyakin lantarki?

Yana haɗa sassa daban-daban bisa ga ƙira, yana ba da damar ayyuka kamar sarrafa sigina da canza makamashi. Wannan shine babban matakin da za a ɗauka don canza ƙira zuwa samfuran zahiri.
5. Shin tsarin haɗa PCB ɗin an gyara shi?

Tsarin aiki na asali iri ɗaya ne, amma ana daidaita shi gwargwadon sarkakiyar samfura, nau'ikan kayan aiki, sikelin samarwa, da sauransu. Misali, ƙananan samfuran da aka tsara sosai na iya ƙara duba hannu, yayin da yawan samarwa ke mai da hankali kan sarrafa kansa.
6. Menene fasahar THT da halayenta?

THT Fasaha ce ta Rami, inda ake saka sassan da ke da leads a cikin ramuka don yin solder. Ribobi: ƙarfin injina mai yawa, ya dace da sassan da ke da wutar lantarki mai yawa; Rashin amfani: babban wurin zama a sararin samaniya, ƙarancin inganci.
7. Menene fasahar SMT da fa'idodinta?

Fasahar SMT ita ce ta Surface Mount, tare da fa'idodin yawan taro mai yawa, ƙaramin girman kayan aiki, dacewa da samarwa ta atomatik, ingantaccen aiki, da ƙarancin farashi.
8. Yaushe ake amfani da fasahar haɗaka?

Ana amfani da fasahar haɗaka lokacin da samfura ke buƙatar amfani da ƙarfin THT mai girma/na inji da kuma girman SMT mai girma/ƙaramin girma, kamar na'urorin wutar lantarki tare da inductors na rami da kuma guntu-guntu masu hawa saman.
9. Waɗanne abubuwa ne ke shafar farashin haɗa PCB?

Tasirin farashin kayan aiki, adadin/girman/rikitar tsari na PCB, wahalar haɗawa, yawan samarwa, buƙatun gwaji, da sauransu. Manyan rukuni suna rage farashin na'urar, yayin da ayyuka masu rikitarwa ke ƙara farashi.
10. Menene bambance-bambancen da ke cikin buƙatun taron PCB don samfuran lantarki daban-daban?

Kayan lantarki na masu amfani: ƙarancin farashi, yawan amfani, ƙarancin amfani; Kula da masana'antu: kwanciyar hankali, hana tsangwama; Na'urorin likitanci: babban daidaito da aminci, wanda ke buƙatar bin ƙa'idodi sosai.
11. Ta yaya kayan PCB ke shafar haɗuwa?

Kayan da aka saba amfani da su kamar FR-4 (kyawawan halayen lantarki/na inji ga samfuran gabaɗaya) da CEM-1 (ƙarancin farashi amma ƙarancin aiki). Faɗaɗawar zafi yana shafar amincin haɗin haɗin solder; manyan bambance-bambance na iya haifar da matsalolin damuwa.
12. Yadda ake zaɓar adadin Layer na PCB da tasirinsa?

Zaɓi bisa ga sarkakiyar da'ira: Layer biyu don da'irori masu sauƙi, Layer da yawa don waɗanda suka yi rikitarwa. Ƙarin yadudduka suna ba da ƙarin sararin hanya amma farashi mai girma, tare da ƙa'idodi masu tsauri don daidaita layuka.
13. Menene iyakokin haɗakar girman PCB?

PCBs masu girman gaske sun wuce iyakokin kayan aiki; waɗanda ba su da girman da ya dace suna haifar da wahalar sarrafawa/saka abubuwa, suna shafar tsarin sassan da kuma watsar da zafi.
14. Me yasa ƙirar kushin take da mahimmanci don haɗawa?

Girman faifan, siffarsa, da tazara suna shafar ingancin solder kai tsaye. Ƙananan faifan suna haifar da busassun haɗin gwiwa; tazara mai kusa da juna yana haifar da gajarta da'ira.
15. Ta yaya gamawar saman PCB ke shafar haɗuwa?

Daidaita solder mai zafi (HASL): ƙarancin farashi amma rashin daidaito, yana shafar solder mai kyau; Zinare mai nutsewa da nickel mara amfani da lantarki (ENIG): ingantaccen solder, babban daidaito, babban farashi; Mai kiyaye soldering na halitta (OSP): yana kare jan ƙarfe, matsakaicin farashi, da buƙatun ajiya mai tsauri.
16. Yadda ake duba ingancin PCB?

Duba gani (ƙarce-ƙarce, nakasa), gwajin binciken tashi/ICT (haɗi), nazarin ƙarfe (tsarin ciki/rufewa).
17. Waɗanne magunguna ake buƙata kafin a haɗa PCB?

Tsaftacewa don cire ƙazanta; PCBs da aka yi wa magani da OSP suna buƙatar yin burodi don cire danshi da kuma hana kumfa na solder.
18. Menene rawar da fayilolin ƙirar PCB ke takawa a cikin haɗa su?

Fayilolin ƙira kamar Gerber sun ƙayyade tsarin sassan da matsayin faifan, suna aiki a matsayin tushen haɗuwa don tabbatar da bin ƙa'idodin ƙira.
19. Menene alamun kurakuran ƙirar PCB a cikin haɗuwa?

Ba za a iya shigar da sassan ba, gajerun da'irori/buɗe-da'irori na lantarki, tsangwama ga sigina, rashin isasshen watsa zafi, wanda ke haifar da gazawar aiki ko matsalolin aiki.
20. Yadda ake la'akari da masana'antu a cikin ƙirar PCB?

Tsarin sassa masu dacewa (guji wurare masu yawa/masu wahalar isa), ingantaccen tsarin kushin, dacewa da SMT/THT, sanya ramuka, da kuma hanyar sadarwa don guje wa kusurwoyi masu kaifi da dogayen alamomi.
21. Yadda ake zaɓar abubuwan da suka dace da haɗa PCB?

Yi la'akari da aikin lantarki (daidaitawa da sigogi), dacewa da fakitin da fakiti, aminci, farashi, da kuma daidaiton wadata.
22. Menene nau'ikan fakitin kayan aiki da tasirinsu?

Fakitin ramin da aka ratsa (misali, DIP) don THT, babban wurin zama na sararin samaniya; fakitin da aka ɗora saman (misali, SOP/BGA) don SMT, yawan yawa mai yawa amma wahalar haɗa shi da ƙarfi (misali, BGA yana buƙatar daidaitaccen sarrafa zafin jiki).
23. Ta yaya ƙarfin haɗa gubar ke shafar haɗakarwa?

Rashin iya haɗa haɗin gwiwa yana haifar da bushewar haɗin gwiwa da kuma yin amfani da na'urar da ba ta dace ba. Gilashin da aka yi da oxidized/mai suna buƙatar a yi musu magani kafin a fara amfani da su (tsaftacewa, yin tinning).
24. Ta yaya za a tantance ko sassan sun dace da sake haɗa ruwa/raƙuman ruwa?

Sake haɗa solder ɗin ya dace da sassan SMT; solder ɗin ya dace da ramuka da manyan sassan SMT. Bayani dalla-dalla yawanci yana nuna hanyoyin da suka dace.
25. Ta yaya za a tabbatar da ingancin kayan aiki a cikin sarrafa kaya?

Farkon shiga-da-farko (FIFO), zafin jiki/danshi mai sarrafawa (20-25℃, 40%-60%RH), ɗaukar samfur akai-akai, da kuma gwada/gurɓatar da abubuwan da suka ƙare/wanda ake zargi.
26. Menene sakamakon amfani da kayan da ba daidai ba?

Aikin da'ira mara kyau (sigogi marasa daidai, gazawar guntu), gajerun da'irori/wuce gona da iri, da lalacewar PCB da sauran sassan.
27. Yadda ake duba abubuwan da ke shigowa?

Duba gani (lalacewa, iskar gubar), gwajin sigogin lantarki (mita mai yawa/LCR), da gwajin aiki na muhimman abubuwan da suka shafi (misali, tabbatar da shirye-shiryen guntu).
28. Ta yaya matsin lamba na zafi ke shafar abubuwan da ke cikin kayan yayin haɗa kayan?

Yawan damuwa a yanayin zafi na iya haifar da fashewar haɗin haɗin solder na ciki a cikin guntu ko lalacewar dielectric a cikin capacitors, wanda ke haifar da raguwar sigogi ko gazawar sigogi. Dole ne a sarrafa yanayin zafin jiki da lokaci.
29. Ta yaya za a tabbatar da daidaiton yanayin abubuwan da aka haɗa da juna?

Alamomin da aka raba (misali, capacitor ±, kibiyoyi masu diode) an yi musu alama a kan faifan PCB. Shigar da hannu yana buƙatar tabbatar da gani; kayan aiki na atomatik suna buƙatar sigogin polarity da aka tsara.
30. Waɗanne buƙatun muhalli ne sassan da suka dace da muhalli ke da su?

Yana buƙatar yanayin zafi/danshi mai sarrafawa (±2℃, 40%-60%RH) da kariyar ESD (bene mai hana tsayawa, madaurin wuyan hannu, tufafin aiki) don guje wa karkatar da sigogi da lalacewar ESD.
31. Menene ƙa'idar sake haɗa solder da yanayin zafi?

Ka'ida: Buga manna mai solder → sanya kayan aiki → dumama don narke manna → sanyaya zuwa solder. Bayanin zafin jiki: A kunna (1-3℃/s zuwa 150-180℃), a jiƙa (180-200℃, 60-120s), a sake kwarara (kololuwar 217-235℃, 30-90s), a sanyaya (3-6℃/s).
32. Menene ƙa'idar haɗa raƙuman ruwa da abubuwan da suka dace?

Ka'ida: Ruwan solder yana samar da raƙuman ruwa, kuma ana haɗa PCB yayin da ake ratsawa. Ya dace da manyan sassan SMT da ramuka.
33. Yaushe ake amfani da solder da hannu da kuma matakan kariya?

Aikace-aikace: Tsarin samfuri, gyarawa, da wuraren da ba za a iya isa ba don sarrafa kansa. Gargaɗi: Ƙarfe mai laushi 20-60W, wayar mai laushi 0.5-1.0mm, zafin jiki 300-350℃, lokaci 3-5s, tsaftacewa kafin lokaci, da kuma bayan dubawa.
34. Menene buƙatun zaɓin solder?

Zaɓi ta hanyar tsari: Manna mai solder mara gubar (Sn-Ag-Cu, 217-227℃) don sake kwarara; sandunan solder mara gubar/gubar (Sn-Pb, 183℃ don solder) don solder mai raƙuman ruwa; wayar solder don solder da hannu, idan aka yi la'akari da yadda ruwa ke shiga da farashi.
35. Ta yaya za a tabbatar da ingancin soldering?

Sarrafa sigogin tsari (bayanin yanayin zafi, lokacin soldering), daidaita kayan aiki, horar da ma'aikata, amfani da kayan aiki masu ƙwarewa, duba AOI/X-Ray, da kuma sake fasalin lahani akan lokaci.
36. Menene lahani da mafita na solder da aka saba gani?

Busasshen haɗin gwiwa: Daidaita zafin jiki, tsawaita lokaci, tsaftace saman; Gajeren da'ira: Rage solder, inganta ƙira; Haɗawa: Daidaita ƙarar manna, yanayin zafin jiki; Rashin isasshen solder: Ƙara manna, inganta tsari; Mai tauri solder: Ƙara kwarara, daidaita zafin jiki.
37. Menene rawar da kwararar ruwa ke takawa kuma ta yaya za a zaɓa?

Ayyukan: Cire oxides, rage tashin hankali a saman, inganta danshi. Nau'i: Inorganic (babban aiki, lalata, yana buƙatar tsaftacewa), organic (matsakaicin aiki, ƙarancin tsatsa, yana buƙatar tsaftacewa), rosin-based (na gama gari, ba mai lalata ba, babu mai tsafta). Zaɓi ta hanyar tsari da samfur.
38. Ta yaya ƙimar Tg na substrate PCB ke shafar hanyoyin haɗa abubuwa?

Ƙimar Tg tana ƙayyade juriyar zafi na substrate. Daidaitaccen FR-4 yana da Tg ~130-140℃, yayin da kayan Tg mai girma (≥170℃) suna jure wa kololuwar sake kwarara na 250℃, wanda ke rage haɗarin wargajewa. Tsarin da ba ya ɗauke da gubar yana buƙatar Tg≥150℃.
39. Menene iyakar tsarin da za a bi don mafi ƙarancin faɗin/tazara tsakanin layuka?

Tsarin SMT na yau da kullun: 4/4mil (0.1/0.1mm); Tsarin HDI yana kaiwa 2/2mil (0.05/0.05mm) tare da ingantaccen fallasa da kuma rufin jan ƙarfe mara amfani da wutar lantarki.
40. Yadda ake tsara girman faifan don fakitin kayan aiki?

Bi IPC-7351: Faɗin faifan QFP +0.1-0.2mm idan aka kwatanta da faɗin gubar; faifan 0603 suna ba da shawarar 0.65×0.65mm don manna solder 0.04-0.06mg a kowace faifan.
41. Menene abubuwan da aka saba amfani da su wajen haɗa ƙarfe da kuma wuraren narkewar manna mai ɗauke da gubar?

Dominant SAC305 (96.5Sn/3.0Ag/0.5Cu) yana narkewa a zafin jiki na 217℃, 34℃ sama da Sn-Pb eutectic (183℃), yana buƙatar ƙarin yanayin zafi mai sake kwarara.
42. Yadda ake zaɓar kauri na stencil don buga manna mai solder?

Abubuwan da aka haɗa na 0402: stencil na 0.12mm; BGA mai girman 0.5mm: stencil na 0.1mm tare da buɗewar faifan 85% don hana ƙwallon da aka haɗa.
43. Menene matsakaicin haƙurin bugawa da aka yarda da shi?

IPC-A-610: Manne mai laushi ≤25% na faɗin faifan; ≤0.1mm don girman QFP na 0.4mm.
44. Ta yaya aka bayyana daidaiton sanya na'urorin ɗaukar kaya da sanya su?

Injinan zamani masu inganci (misali, Fuji NXT) suna da Cpk≥1.33, XY repeatability ±25μm, θ daidaito ±0.5°, ya dace da sassan 0201 da kuma 0.3mm pitch BGA.
45. Ta yaya matsin lamba na sanyawa ke shafar abubuwan da ke ciki?

Matsi a sanya MLCC: 0.3-0.5N (haɗarin fashewa a matsin lamba mafi girma); QFP leads: 0.8-1.2N don haɗin gwiwa.
46. Ta yaya za a guji jifan sassan kabari yayin sanya su?

Inganta daidaiton sanyawa (±0.05mm), tabbatar da ƙarar manna mai siffa mai daidaito, ƙimar sake kwararar ≤3℃/s don rage saurin zafin jiki.
47. Menene ma'aunin yankin zafin jiki na yau da kullun don sake haɗa sinadarai ba tare da gubar ba?

Zafafawa kafin lokaci (150-180℃): 1-2℃/s; jiƙa (180-210℃): 60-90s; kololuwar sake kwarara 245-255℃, ≥217℃ na 60-90s; sanyi 2-4℃/s.
48. Menene fa'idodi da kuɗaɗen sake haɗa sinadarin nitrogen?

Nitrogen (O₂＜500ppm) yana rage iskar shaka kuma yana inganta danshi, amma yana ƙara 15-20% ga farashin sarrafawa, wanda ya dace da aikace-aikacen aminci mai ƙarfi.
49. Menene ma'aunin karɓuwa ga rashin amincewa da BGA?

IPC-A-610 Aji na 3: Yankin da babu komai ≤10% na yankin ƙwallon solder; aikace-aikace masu mahimmanci (misali, na mota) suna buƙatar ≤5%.
50. Yadda ake daidaita tsayin raƙuman ruwa a cikin haɗa raƙuman ruwa?

Na'urar soɗa mai igiyoyi biyu: Raƙuman ruwa masu ƙarfi suna nutsewa da kauri na PCB 1/3-1/2; tsayin raƙuman ruwa mai santsi 0.5-1mm ƙasa da ƙasan PCB.
51. Ta yaya abun ciki mai ƙarfi na flux yake shafar soldering?

Ruwan da ba shi da tsafta: sinadarin da ke cikin tauri＜5%; ruwan da ke da ƙarfi sosai (＞10%) yana inganta danshi amma yana ƙara haɗarin ragowar da ke cikin tauri, wanda ke buƙatar tsaftacewa mai dacewa.
52. Yadda ake daidaita zafin solder na raƙuman ruwa da saurin jigilar kaya?

A zafin tukunyar solder mai digiri 245-255, saurin shine mita 1.2-1.8/min; PCBs masu kauri na jan ƙarfe suna buƙatar mita 1/min don cikawa ta hanyar cikawa.
53. Ta yaya zafin ƙarfen da aka haɗa ke shafar inganci?

Soda ba tare da gubar ba: Zafin tip ɗin 350-380℃, lokacin hulɗa ≤3s. Zafi mai yawa yana haifar da ɗaga kushin ko iskar gubar.
54. Yadda ake daidaita da kuma sake daidaita BGAs yayin sake aiki?

Tsarin daidaitawa na gani (±25μm daidai) tare da kayan sake yin ball suna tabbatar da ~ 0.1mm karkacewa tsakanin ƙwallan solder da kushin.
55. Waɗanne saitunan zafin jiki da saurin iska don sake yin aiki da bindigogin iska mai zafi na QFP?

A kunna wuta 150-180℃, a sake kunna zafin jiki 320-350℃, a kuma kunna iska 4-6 (20-30L/min) don guje wa gurɓacewar gubar.
56. Menene fa'idodi da rashin amfani na tsaftace ruwa da ruwa da kuma ruwan da ke narkewa?

Ruwa: Yana da kyau ga muhalli amma yana buƙatar zafi mai yawa (60-80℃), haɗarin tsatsa; Maganin narkewa (misali, NMP): yana da inganci amma yana buƙatar kayan aiki masu hana fashewa, da ƙuntatawa na VOC.
57. Menene ma'aunin ragowar ionic bayan tsaftacewa?

IPC-TM-650: Ragowar Ionic＜1.5μg/cm² Daidai da NaCl, juriya ga rufin saman＞10⁹Ω.
58. Menene ƙimar rufe lahani na duba AOI?

AOI mai sauri yana rufe ≥95% na lahani na sassan 0402, ⼞98% don haɗin gwiwa/rashin jagora na QFP, amma yana fama da gurɓatattun abubuwa na ciki na BGA.
59. Menene mafi ƙarancin ƙudurin duba X-Ray?

Micro-focus X-Ray yana cimma ƙudurin 5μm, yana gano haɗin BGA mai girman 0.3mm da kuma cikin PCB mai matakai 20.
60. Menene fahimtar gano hanyoyin sadarwa na bude-da'ira na ICT?

Binciken ICT mai inganci yana buɗewa ƙasa da 0.1Ω, tare da juriyar hulɗar ƙusoshi＜100mΩ.
61. Menene iyakokin sha danshi ga PCBs a ƙarƙashin yanayi daban-daban?

IPC-J-STD-033: Matakan MSL 3 ≤ awanni 168 a 30℃/60%RH; gasa a 125℃ na tsawon awanni 4-8 idan ya wuce haka.
62. Yadda ake kimanta ƙarfin injin haɗin haɗin solder?

Haɗawa 0603: mafi ƙarancin ƙarfin ja ≥1.5N; Jagororin QFP: ƙarfin yankewa ≥5N, bisa ga IPC-9701.
63. Menene kewayon da aka yarda da shi don warpage na PCB?

IPC-A-600: ≤1.5%; PCBs ɗin da aka haɗa da BGA ≤0.7% don hana busassun haɗin gwiwa.
64. Menene ƙayyadadden lalacewar ESD ga sassan?

Na'urorin CMOS suna da ƙarfin HBM＜2000V. Dole ne yanayin samarwa ya kasance mai dorewa＜100V tare da madaurin wuyan hannu da na'urorin ionizer.
65. Menene tsarin farashi na PCBA mai ƙarancin girma?

Kudin kayan aiki 40-50%, sarrafawa (gami da raguwar farashi) 30-40%, dubawa 10-20%. Kudin naúrar ya fi 30-50% girma fiye da yawan samarwa.

Taro na PCB

1. Menene PCBA?

2. Menene manyan fasahar taron PCB?

3. Menene muhimman matakai a cikin taron PCB?

4. Me yasa haɗa PCB yake da mahimmanci ga kayayyakin lantarki?

5. Shin tsarin haɗa PCB ɗin an gyara shi?

6. Menene fasahar THT da halayenta?

7. Menene fasahar SMT da fa'idodinta?

8. Yaushe ake amfani da fasahar haɗaka?

9. Waɗanne abubuwa ne ke shafar farashin haɗa PCB?

10. Menene bambance-bambancen da ke cikin buƙatun taron PCB don samfuran lantarki daban-daban?

11. Ta yaya kayan PCB ke shafar haɗuwa?

12. Yadda ake zaɓar adadin Layer na PCB da tasirinsa?

13. Menene iyakokin haɗakar girman PCB?

14. Me yasa ƙirar kushin take da mahimmanci don haɗawa?

15. Ta yaya gamawar saman PCB ke shafar haɗuwa?

16. Yadda ake duba ingancin PCB?

17. Waɗanne magunguna ake buƙata kafin a haɗa PCB?

18. Menene rawar da fayilolin ƙirar PCB ke takawa a cikin haɗa su?

19. Menene alamun kurakuran ƙirar PCB a cikin haɗuwa?

20. Yadda ake la'akari da masana'antu a cikin ƙirar PCB?

21. Yadda ake zaɓar abubuwan da suka dace da haɗa PCB?

22. Menene nau'ikan fakitin kayan aiki da tasirinsu?

23. Ta yaya ƙarfin haɗa gubar ke shafar haɗakarwa?

24. Ta yaya za a tantance ko sassan sun dace da sake haɗa ruwa/raƙuman ruwa?

25. Ta yaya za a tabbatar da ingancin kayan aiki a cikin sarrafa kaya?

26. Menene sakamakon amfani da kayan da ba daidai ba?

27. Yadda ake duba abubuwan da ke shigowa?

28. Ta yaya matsin lamba na zafi ke shafar abubuwan da ke cikin kayan yayin haɗa kayan?

29. Ta yaya za a tabbatar da daidaiton yanayin abubuwan da aka haɗa da juna?

30. Waɗanne buƙatun muhalli ne sassan da suka dace da muhalli ke da su?

31. Menene ƙa'idar sake haɗa solder da yanayin zafi?

32. Menene ƙa'idar haɗa raƙuman ruwa da abubuwan da suka dace?

33. Yaushe ake amfani da solder da hannu da kuma matakan kariya?

34. Menene buƙatun zaɓin solder?

35. Ta yaya za a tabbatar da ingancin soldering?

36. Menene lahani da mafita na solder da aka saba gani?

37. Menene rawar da kwararar ruwa ke takawa kuma ta yaya za a zaɓa?

38. Ta yaya ƙimar Tg na substrate PCB ke shafar hanyoyin haɗa abubuwa?

39. Menene iyakar tsarin da za a bi don mafi ƙarancin faɗin/tazara tsakanin layuka?

40. Yadda ake tsara girman faifan don fakitin kayan aiki?

41. Menene abubuwan da aka saba amfani da su wajen haɗa ƙarfe da kuma wuraren narkewar manna mai ɗauke da gubar?

42. Yadda ake zaɓar kauri na stencil don buga manna mai solder?

43. Menene matsakaicin haƙurin bugawa da aka yarda da shi?

44. Ta yaya aka bayyana daidaiton sanya na'urorin ɗaukar kaya da sanya su?

45. Ta yaya matsin lamba na sanyawa ke shafar abubuwan da ke ciki?

46. ​​Ta yaya za a guji jifan sassan kabari yayin sanya su?

47. Menene ma'aunin yankin zafin jiki na yau da kullun don sake haɗa sinadarai ba tare da gubar ba?

48. Menene fa'idodi da kuɗaɗen sake haɗa sinadarin nitrogen?

49. Menene ma'aunin karɓuwa ga rashin amincewa da BGA?

50. Yadda ake daidaita tsayin raƙuman ruwa a cikin haɗa raƙuman ruwa?

51. Ta yaya abun ciki mai ƙarfi na flux yake shafar soldering?

52. Yadda ake daidaita zafin solder na raƙuman ruwa da saurin jigilar kaya?

53. Ta yaya zafin ƙarfen da aka haɗa ke shafar inganci?

54. Yadda ake daidaita da kuma sake daidaita BGAs yayin sake aiki?

55. Waɗanne saitunan zafin jiki da saurin iska don sake yin aiki da bindigogin iska mai zafi na QFP?

56. Menene fa'idodi da rashin amfani na tsaftace ruwa da ruwa da kuma ruwan da ke narkewa?

57. Menene ma'aunin ragowar ionic bayan tsaftacewa?

58. Menene ƙimar rufe lahani na duba AOI?

59. Menene mafi ƙarancin ƙudurin duba X-Ray?

60. Menene fahimtar gano hanyoyin sadarwa na bude-da'ira na ICT?

61. Menene iyakokin sha danshi ga PCBs a ƙarƙashin yanayi daban-daban?

62. Yadda ake kimanta ƙarfin injin haɗin haɗin solder?

63. Menene kewayon da aka yarda da shi don warpage na PCB?

64. Menene ƙayyadadden lalacewar ESD ga sassan?

65. Menene tsarin farashi na PCBA mai ƙarancin girma?

46. Ta yaya za a guji jifan sassan kabari yayin sanya su?