Tahlehelo e tlase ea PCB

Ahlola ka boleng ba dielectric constant (Dk) le Df. Thepa e nang le tahlehelo e tlase e na le Df e tlase le botsitso bo matla ba Dk maqhubung a phahameng.

Lisebelisoa li kenyelletsa puisano ea 5G (leqhubu la millimeter), puisano ea sathelaete (leqhubu la Ka), litsamaiso tsa radar (tse fetang 30GHz), le lipotoloho tsa dijithale tse lebelo le phahameng (28Gbps+).

Hangata e phahame ka makhetlo a 2-5. Mohlala, FR-4 e bitsa hoo e ka bang 100 CNY/m², ha Rogers RO4350B e le pakeng tsa 500-800 CNY/m².

Bakeng sa phokotso e 'ngoe le e 'ngoe ea 0.001 ho Df, tahlehelo ea phetisetso ea matšoao a 10GHz e fokotseha ka hoo e ka bang 0.5dB/10cm, e ntlafatsang botšepehi ba lets'oao.

Rogers RO4350B: -40°C~280°C; Isola 370HR: -55°C~280°C.

E, e ka fihlella moralo o rarahaneng oa potoloho ea lebelo le phahameng, empa ho nepahala ha ho hokahanya mekhahlelo e fapaneng ho tlameha ho laoloa (≤±50μm).

Kgetha ho latela ditlhoko tse ikgethang tsa impedance tsa mela ya phetiso. Mohlala, mela ya microstrip ya 50Ω hangata e sebedisa thepa e nang le Dr 2.2-3.5.

E, ho monya mongobo ho eketsa Dk le Df. Ho kgothaletswa ho baka ka 125°C ka dihora tse 4 ho tlosa mongobo pele o sebedisa.

Bongata ba tsona li fihlela maemo a UL94 V-0. Lisebelisoa tse ling tse entsoeng ka letsopa li hloka phekolo e eketsehileng ho fihlela litlhoko tsa ho thibela malakabe.

Laola ka ho bala ka nepo bophara ba mola, botenya ba dielectric, ho rarahana ha foil ea koporo (Ra≤0.5μm), le ntlafatso ka lisebelisoa tsa ketsiso.

Qoba mesaletsa ea sekhutlo se letona (e eketsa ponaletso ka ~10%), laola palo ea li-via (sebaka ka seng se hlahisa tahlehelo ea ~0.2dB), 'me u boloke mesaletsa ea bolelele bo lekanang (ho kheloha

Boloka molao oa 3W bakeng sa sebaka sa mela (bophara ba mola bo imenne hararo), sebelisa karohano ea mobu, 'me u fokotse bolelele ba mesaletsa e bapileng.

Sebelisa sebopeho sa ho bokella se lekanang se nang le sebaka sa lera la motlakase le fatše sa ≤0.1mm ho fokotsa lerata la motlakase (thibela EMI ka ~20dB).

E, empa ho teteana ha lebota la masoba ho lokela ho laolwa (Ra≤1μm); ho seng jwalo, tahlehelo ya 0.3dB ka intshi ya lebota la masoba e a eketswa.

Bohlokoa. Maqhubu a phahameng a eketsa tshebediso ya matla. Sebedisa thepa ya dielectric e nang le motlakase o tsamaisang motlakase ≥1W/mK.

Sebelisa li-balun tsa microstrip le lipotoloho tse tšoanang tsa LC ho boloka tahlehelo ea ho khutla e le ka tlase ho -20dB (leqhubu la 10GHz).

E. Li-pad li lokela ho manehoa ka khauta e thata (botenya ba ≥3μm) ho thibela oxidation ho ama ts'ebetso ea ho kopana le maqhubu a phahameng.

Boloka karolelano ea bophara ba mola ho isa ho sebaka sa 1:1, taolo ea impedance ho 100Ω±5%, 'me u boloke phoso ea ho bapallana

Sebelisa Thevenin kapa AC termination matching ho boloka coefficient ea reflection e le ka tlase ho 0.1 (lebanta la 18GHz).

E hloka taolo e thata haholoanyane ea mocheso oa lamination (ho kheloha ±2°C), ho phunya ka nepo e phahameng (ho mamella ho bula ha ±25μm), le ho betla ka motlakase ka mokhoa o ts'oanang.

Ho phunya ka laser (lesoba le bonyane 0.1mm) kapa ho phunya ka CNC (lesoba le bonyane 0.2mm), ka taolo ya ho se be le makukuno a lebota.

Ho lamination e sa nepahalang ho baka ho qhalana ha dielectric. Ho lamination ka vacuum ka khatello e laoloang ho 5-8MPa ho kgothaletswa.

Sebelisa foil ea koporo ea RTF (Ra≤0.3μm), e fokotsang tahlehelo ka 15%-20% ha e bapisoa le foil e tloaelehileng ea koporo.

Besa ka mocheso oa 150°C lihora tse 2 kamora ho lamination ho lokolla khatello, ka warpage ≤0.7%.

Bakeng sa maqhubu a phahameng, ho kgothaletswa hore ENIG kapa silevera ya ho qoelisoa e qobe ho oxidation ya OSP mochesong o phahameng, e leng se eketsang tahlehelo.

Mokhoa o tloaelehileng: 4mil/4mil; mokhoa o tsoetseng pele: 2mil/2mil.

Maske ea solder Df e lokela ho ba ≤0.02. Botenya bo feteletseng bo eketsa tahlehelo (0.1dB/10cm ka 10μm).

Sebelisa mechine e pepesetsang LDI e nepahetseng haholo (ho nepahala ha ho otlolla ±25μm) le li-pin tsa ho beha lintho ka mechine.

Hoo e ka bang 10%-15%, haholo-holo ka lebaka la ho arohana ha dielectric le ho se latele melao ya impedance.

Sebelisa sesebelisoa sa ho sekaseka marang-rang a vector (VNA) se nang le lisebelisoa tsa liteko tsa microstrip, se koahelang sehlopha sa maqhubu a shebiloeng.

Impedance e fellang ka motsotso o le mong ±10%, impedance e fapaneng ±8%, e hlokang ho nka sampole maemong a mangata.

Ka teko ea matla a ho hlohlora, e hlokang matla a tlamo pakeng tsa foil ea koporo le lera la dielectric ≥1.5N/mm.

Sebelisa TDR kapa VNA. Leka tahlehelo ea mohala oa phetiso oa 10cm ≤3dB (10GHz).

Etsa teko ea ho tšoha ha mocheso (260°C, lipotoloho tse 10), u sa hloke ho aroloa kapa ho buloa ha lipotoloho.

Ho ntšoa ha mahlaseli ho tlameha ho latela EN 55032 Class B, ka katleho ea tšireletso ≥40dB (1GHz).

Ka teko ea S-parameter, e hlokang tahlehelo ea ho kenngoa ha e le 'ngoe ka ≤0.5dB (15GHz).

Phoso ea teko ≤±0.05, ho sebelisoa lisebelisoa le lisebelisoa tsa teko tse leka-lekaneng.

Etsa teko ea ho tsofala ha mocheso o mongobo (85°C/85% RH, lihora tse 1000), ka ho senyeha ha ts'ebetso

Teko ea dayakeramo ea mahlo (bophahamo ba mahlo ≥80%), teko ea jitter (RJ+DJ ≤5% ea UI), teko ea crosstalk (crosstalk e haufi-ufi ≤-30dB).

AAU (Antenna Unit e Sebetsang), di-module tsa RF front-end, tse hlokang tahlehelo e tlase mefuteng ya maqhubu a millimeter (24-40GHz).

Tšehetsa li-interface tsa lebelo le phahameng joalo ka PCIe 5.0 (32GT/s) le DDR5 (6400Mbps), e leng se fokotsang ho fokotseha ha lets'oao.

Hlahloba Df ea thepa, ho hlaka ha foil ea koporo, ka moralo, le botenya ba maske ea solder.

Ho kheloha ha botenya ba dielektrike, liphoso tsa ho sebetsana le bophara ba mola, le khatello e sa lekanang ea lamination e bakang phetoho ea Dr.

Eketsa li-vias tsa mocheso (bophara ba ≥0.4mm, sebaka sa ≤1mm) 'me u sebelise thepa ea sekheo sa mocheso.

Hlahloba diparamente tsa lamination le mongobo wa thepa, mme o qobe polokelo e nang le mocheso o phahameng.

Sebelisa ho skena probe e haufi le tšimo ho tsepamisa maikutlo ho kopanyong ea lera la motlakase, ka resonance, jj.

E, e loketse li-radar tsa maqhubu a millimeter tsa ADAS (77GHz), empa e tlameha ho fihlela maemo a ts'epo a AEC-Q200.

Kenya terata ea fatše (sebaka sa ≤50mil) 'me u koahele mathōko ka thepa e monyang maqhubu.

Ntlafatsa moralo oa lera, sebelisa thepa e tloaelehileng, 'me u hlahise ka bongata (u fokotsa theko ea yuniti ka ~30%).

Nahana ka thepa ea FR-4 e lebelo le phahameng (mohlala, Megtron 6, Df=0.012), e fokotsang litšenyehelo ka ~40%.

Khetha thepa ho latela maqhubu a sebele a ts'ebetso, mohlala, thepa ea tahlehelo e mahareng bakeng sa 2-6GHz.

Theko ea yuniti ea thepa, ho rarahana ha ts'ebetso (mohlala, liboto tse nang le mekhahlelo e mengata, li-vias tse foufetseng/tse patiloeng), le sekhahla sa chai.

Sebelisa moralo oa phanele, nolofatsa lits'ebetso (mohlala, fokotsa li-vias tse foufetseng/tse patiloeng), 'me u khethe bafepedi ba lehae.

Thepa e tsoang kantle ho naha: ~libeke tse 4-6; mekhoa e meng ea lapeng: e fokotsehile ho libeke tse 2-3.

E, fokotsa palo ea lera 'me u sebelise boholo bo tloaelehileng ba thepa (mohlala, 18"×24") ho fokotsa litšila tsa thepa.

E kenyeletsa litšenyehelo tsa thepa, litšenyehelo tsa ho sebetsana le thepa, le litefiso tsa ho lokisa lintho bocha, tse etsang ~ 15%-20% ea litšenyehelo tsohle.

E theko e tlase bakeng sa tlhahiso ea teko ea bongata bo tlase, e fokotsa matsete a thepa e tsitsitseng ka ~60%.

Ho hodimo, ho hloka ts'ebetso e ikgethang; ditjeo tsa ho sebedisa botjha di etsa ~10% ya ditjeo tsa tlhahiso.

IPC-4101 (litlhaloso tsa thepa), IEC 61189 (mekhoa ea teko), RoHS 2.0 (litlhoko tsa tikoloho).

Romela disampole bakeng sa teko ya ho cha le ya tshebetso ya motlakase; setifikeiti se nka dibeke tse ~ 4-6.

AEC-Q200 (botšepehi ba likarolo tse sa sebetseng), ISO 26262 (polokeho e sebetsang).

O tlameha ho pasa setifikeiti sa MIL-P-55110 (litlhaloso tsa potoloho ea microwave) le tlhahlobo ea tikoloho e feteletseng.

E tlameha ho latela RoHS Directive (e thibelang dintho tse 6 tse kotsi tse kang loto le mercury) le melaoana ya REACH.

Etsa liteko tsa EMC le LVD; setifikeiti se nka ~ likhoeli tse 2-3.

Latela ISO 13485 (taolo ea boleng ba lisebelisoa tsa bongaka) le setifikeiti sa FDA 510(k).

Maemo a IPC a ntlafatsoa lilemo tse ling le tse ling tse ~3-5 ho ikamahanya le mahlale a macha.

Etsa liteko tsa botšepehi tse kang tlhahlobo ea letsoai (lihora tse 96) le liteko tsa ho thothomela (20-2000Hz).

SGS, EUROLAB, TÜV Rheinland, joalo-joalo.

Ho ntshetsa pele ho lebisa ho Df e tlase (

Moralo o thuswang ke AI o ntlafatsa tsela eo maqhubu a tsamayang ka yona (o ntlafatsa bokgoni ka 40%) mme o bolela esale pele mathata a botshepehi ba matshwao.

Dikompositi tsa matrix tsa ceramic (Df

Hona jwale e lekanyeditswe ke ho nepahala (bophara ba mola ≥ 10 mil), empa ho lebelletswe hore e tla fihlella prototyping e potlakileng nakong e tlang

Finyella kopanyo e phahameng ka ho kenya di-chip le dikarolo tse sa sebetseng, ho fokotsa tahlehelo ya phetiso ya letshwao.

E hloka thepa e nang le tahlehelo e tlase haholo (Df

E tlameha ho tšehetsa lihlopha tsa maqhubu a terahertz (100-300GHz) ka Df≤0.0015.

Sebelisa ho tjhesa ho thehiloeng metsing le ho kopanya ho se nang loto ho fokotsa tshebediso ya matla ka ~25%.

Hlokomela tlhokomelo ea liparamente tsa ts'ebetso ea nako ea sebele ka litsamaiso tsa MES, ho ntlafatsa chai ka 15%.

Ho hlahloba tšebeliso ea thepa e bohlale (mohlala, li-alloy tsa memori ea sebopeho) ho lokisa mapetso a manyane.

Lekola bokgoni ba tshebetso (bophara ba bonyane ba mela, palo ya lera), setifikeiti, nako ya ho tlisa thepa, le tshebeletso ya kamora thekiso.

Rogers, Isola, Panasonic, Taconic.

Theknoloji ea Shengyi, Lisebelisoa tse Ncha tsa Huazheng, Jingangguoji, ka melemo e totobetseng ea ts'ebetso ea litšenyehelo.

Bohlokoa; e lokela ho fana ka khetho ea thepa, tataiso ea ts'ebetso, le lits'ebeletso tsa tlhahlobo ea ho hloleha.

Hlahloba bokgoni ba tlhahiso (sq.m/kgwedi) le sekgahla sa ho pepa ka nako (≥95%).

Litekanyo tsa tshebetso, maemo a kamohelo, boikarabello ba tlōlo ea molao, beng ba thepa ea kelello, jj.

O tlameha ho ba le setifikeiti sa ISO 9001 le ho hlahloba lintlha tsa SPC (taolo ea ts'ebetso ea lipalo-palo).

Hlalosa lipehelo tsa pusetso/phetoho konterakeng; etsa kopo ea puseletso haeba sekhahla sa phoso se feta 5%.

Fumana litheolelo tsa theko (~5%-10%), kemiso ea lintho tse tlang pele, le ho arolelana lintho ka botekgeniki.

Hloka litlaleho tsa liteko tsa RoHS le setifikeiti sa sistimi ea taolo ea tikoloho (ISO 14001).

Sebelisa sephutheloana se thibelang ho fetoha ha mocheso, qoba ho ntša/ho senyeha ha mocheso, 'me u laole mocheso ho 5-35℃.

Tikoloho e omileng (mongobo o ka tlase ho 40%), mocheso o pakeng tsa 20-25℃, nako ya ho boloka dishelefo hangata ke dikgwedi tse 12.

Ho kgothaletswa ho sebedisa disebediswa tsa ho hlwekisa tse thehilweng metsing; qoba di-solvent tse nang le chlorine ho thibela ho bola ha thepa.

Nehelana ka tsona ho lik'hamphani tsa litsebi tsa ho sebelisa lintho tse nchafalitsoeng ho qoba tšilafalo ea tikoloho.

E tlameha ho ngolwa mofuta wa thepa, nomoro ya mofuta, letsatsi la tlhahiso, le sebaka sa taolo ya impedance.

E ikarabella bakeng sa ~3%-5% ea litšenyehelo tsohle; lihlahisoa tsa maemo a holimo li hloka ho paka ka vacuum + litlolo tsa ho ntsha metsi.

Fana ka koetliso e khethehileng mabapi le thepa ea thepa, litlhaloso tsa ts'ebetso, le ts'ebetso ea lisebelisoa (nako ea koetliso ~ beke e le 'ngoe).

Bothata bo boholo; e hloka lisebelisoa tse khethehileng (mohlala, liteishene tsa ho lokisa laser) 'me e na le tšekamelo ea ho senya lera la dielectric.

E tlameha ho boloka difaele tsa moralo, diparamente tsa tshebetso, ditlaleho tsa teko, jj., bonyane dilemo tse 5.