I-PCB elahlekile ephansi

Hlukanisa nge-dielectric constant (Dk) kanye nenani le-Df. Izinto ezilahlekelwa kancane zine-Df ephansi kanye nokuqina kwe-Dk okuqinile kumaza aphezulu.

Izinhlelo zokusebenza zifaka phakathi ukuxhumana kwe-5G (i-millimeter wave), ukuxhumana kwesathelayithi (i-Ka band), izinhlelo ze-radar (ezingaphezu kwe-30GHz), kanye namasekethe edijithali asheshayo (28Gbps+).

Ngokuvamile kuphakeme ngokuphindwe kabili kuya kahlanu. Isibonelo, i-FR-4 ibiza cishe i-100 CNY/m², kuyilapho i-Rogers RO4350B isukela ku-500-800 CNY/m².

Ngokunciphisa ngakunye okungu-0.001 ku-Df, ukulahlekelwa kokudluliselwa kwezimpawu ze-10GHz kwehla cishe ngo-0.5dB/10cm, okuthuthukisa ubuqotho bezimpawu.

I-Rogers RO4350B: -40°C~280°C; Isola 370HR: -55°C~280°C.

Yebo, ingafinyelela ukwakheka kwesekethe yesivinini esikhulu okuyinkimbinkimbi, kodwa ukunemba kokuqondanisa phakathi kwezingqimba kumele kulawulwe (≤±50μm).

Khetha ngokusekelwe ezidingweni ze-impedance ezihlukile zemigqa yokudlulisela. Isibonelo, imigqa ye-microstrip engu-50Ω ivame ukusebenzisa izinto ezine-Dk 2.2-3.5.

Yebo, ukumuncwa komswakama kwandisa i-Dk ne-Df. Kunconywa ukubhaka ku-125°C amahora ama-4 ukuze kususwe umswakama ngaphambi kokusebenzisa.

Iningi lihlangabezana nezindinganiso ze-UL94 V-0. Ezinye izinto ezisekelwe kubumba zidinga ukwelashwa okwengeziwe ukuze zihlangabezane nezidingo zokuvimbela umlilo.

Lawula ngokubala okunembile kobubanzi bomugqa, ukujiya kwe-dielectric, ubulukhuni be-copper foil (Ra≤0.5μm), kanye nokwenza ngcono ngamathuluzi okulingisa.

Gwema ukuthambekela kwe-engeli yesokudla (kwandisa ukubonakaliswa ngo-~10%), lawula inani lama-via (i-via ngayinye ingenisa ukulahlekelwa okungu-~0.2dB), futhi ugcine ukuthambekela kobude obulinganayo (ukuphambuka

Gcina umthetho we-3W wesikhala semigqa (ububanzi bomugqa obuphindwe kathathu), sebenzisa ukuhlukaniswa komhlabathi, futhi unciphise ubude bemikhondo ehambisanayo.

Sebenzisa isakhiwo sokufaka esilinganayo esinesikhala sesendlalelo samandla-phansi esingu-≤0.1mm ukuze unciphise umsindo wamandla (cindezela i-EMI ngo-~20dB).

Yebo, kodwa ukujiya kodonga lwembobo kumele kulawulwe (Ra≤1μm); ngaphandle kwalokho, ukulahleka okungu-0.3dB nge-intshi ngayinye yodonga lwembobo kuyangezwa.

Okubalulekile. Imvamisa ephezulu inyusa ukusetshenziswa kwamandla. Sebenzisa izinto ze-dielectric ezine-thermal conductivity ≥1W/mK.

Sebenzisa ama-balun e-microstrip kanye nama-circuits afanayo e-LC ukuze ugcine ukulahlekelwa kokubuya kungaphansi kwe--20dB (ibhendi ye-10GHz).

Yebo. Ama-pad kufanele ambozwe ngegolide eliqinile (ukujiya okungu-≥3μm) ukuvimbela ukungcoliswa komoya ukuthi kungathinti ukusebenza kokuxhumana okuvama kakhulu.

Gcina isilinganiso sobubanzi bomugqa kuya kwesikhala esingu-1:1, i-control impedance ku-100Ω±5%, bese ugcina iphutha lokufana

Sebenzisa i-Thevenin noma i-AC termination matching ukuze ugcine i-reflection coefficient ingaphansi kuka-0.1 (18GHz band).

Kudinga ukulawulwa okuqinile kwezinga lokushisa le-lamination (ukuphambuka ±2°C), ukubhoboza okunembe kakhulu (ukubekezelela imbobo ±25μm), kanye nokufakwa kwe-electroplating okufanayo.

Ukubhoboza nge-laser (umbobo omncane ongu-0.1mm) noma ukubhoboza nge-CNC (umbobo omncane ongu-0.2mm), ngokulawula ukujiya kodonga lwembobo.

Ukushiswa kwe-lamination okungalungile kubangela ukushiswa kwe-dielectric. Ukushiswa kwe-vacuum lamination ngengcindezi elawulwa ku-5-8MPa kuyanconywa.

Sebenzisa i-RTF copper foil (Ra≤0.3μm), okunciphisa ukulahlekelwa ngo-15%-20% uma kuqhathaniswa ne-copper foil evamile.

Bhaka ku-150°C amahora ama-2 ngemva kokulamina ukuze ukhulule ukucindezeleka, nge-warpage engu-≤0.7%.

Ukuze uthole imvamisa ephezulu, kunconywa isiliva se-ENIG noma sokucwiliswa ukuze kugwenywe ukushiswa kwe-OSP emazingeni okushisa aphezulu, okwandisa ukulahleka.

Inqubo evamile: 4mil/4mil; inqubo ethuthukisiwe: 2mil/2mil.

Imaski yokubopha i-Df kufanele ibe ngu-≤0.02. Ubukhulu obukhulu bukhulisa ukulahleka (0.1dB/10cm ngo-10μm ngamunye).

Sebenzisa imishini yokuveza i-LDI enembile kakhulu (ukunemba kokuqondanisa ±25μm) kanye nezikhonkwane zokubeka izinto ngomshini.

Cishe u-10%-15%, ikakhulukazi ngenxa yokwehlukaniswa kwe-dielectric kanye nokungalandeli imithetho ye-impedance.

Sebenzisa i-vector network analyzer (VNA) enezihlanganisi zokuhlola ze-microstrip, ezimboza ibhendi yemvamisa eqondiwe.

Impedance enomphetho owodwa ±10%, impedance yomehluko ±8%, edinga ukusampula ezindaweni eziningi.

Ngokusebenzisa ukuhlolwa kwamandla okuxebuka, kudinga amandla okubopha phakathi kwe-copper foil kanye nesendlalelo se-dielectric ≥1.5N/mm.

Sebenzisa i-TDR noma i-VNA. Hlola ukulahlekelwa komugqa wokudlulisa ongu-10cm ≤3dB (10GHz).

Yenza ukuhlolwa kokushaqeka kokushisa (260°C, imijikelezo eyi-10), ungadingi ukuhlukaniswa noma izifunda ezivulekile.

Ukukhishwa kwemisebe kumele kuhambisane ne-EN 55032 Class B, kanye nokusebenza kahle kokuvikela ≥40dB (1GHz).

Ngokusebenzisa ukuhlolwa kwepharamitha ye-S, okudinga ukulahlekelwa kokufakwa kwe-single nge-≤0.5dB (15GHz).

Iphutha lokuhlola ≤±0.05, kusetshenziswa izinto zokuhlola ezilungisiwe kanye namathuluzi.

Yenza ukuhlolwa kokuguga kokushisa okumanzi (85°C/85% RH, amahora ayi-1000), kanye nokwehla kokusebenza okungaphansi kuka-5%.

Ukuhlolwa kwedayagramu yamehlo (ukuphakama kwamehlo ≥80%), ukuhlolwa kwe-jitter (RJ+DJ ≤5% ye-UI), ukuhlolwa kwe-crosstalk (ukukhuluma kwe-crosstalk okuseduze ≤-30dB).

Amamojula e-AAU (Iyunithi ye-Active Antenna), i-RF front-end, adinga ukulahlekelwa okuphansi kuma-millimeter wave bands (24-40GHz).

Sekela izixhumi zesivinini esikhulu njenge-PCIe 5.0 (32GT/s) kanye ne-DDR5 (6400Mbps), okunciphisa ukuncishiswa kwesignali.

Hlola i-Df yezinto zokwakha, ubulukhuni be-copper foil, ngomklamo, kanye nobukhulu bemaski yokusongelwa.

Ukuphambuka kobukhulu be-dielectric, amaphutha okucubungula ububanzi bomugqa, kanye nokucindezela okungalingani kwe-lamination okubangela ukuhlukahluka kwe-Dk.

Khulisa ama-via okushisa (ububanzi ≥0.4mm, isikhala ≤1mm) bese usebenzisa izinto zokushisa.

Hlola amapharamitha e-lamination kanye nomswakama wezinto ezibonakalayo, futhi ugweme ukugcina izinto ezishisa kakhulu.

Sebenzisa ukuskena kwe-probe eseduze nensimu ukuze ugxile ekuhlanganisweni kwengqimba yamandla, nge-resonance, njll.

Yebo, ifanele ama-radar wamagagasi e-ADAS millimeter (77GHz), kodwa kumele ihlangabezane nezindinganiso zokuthembeka ze-AEC-Q200.

Engeza uthango olusemhlabathini (isikhala esingu-≤50mil) bese umboza imiphetho ngezinto ezimunca amagagasi.

Lungiselela ukwakheka kwezingqimba, sebenzisa izinto ezijwayelekile, futhi ukhiqize ngobuningi (wehlisa intengo yeyunithi ngo-~30%).

Cabanga ngezinto ze-FR-4 ezinesivinini esikhulu (isb., i-Megtron 6, i-Df=0.012), kunciphisa izindleko ngo-~40%.

Khetha izinto ezisuselwe kumvamisa yokusebenza yangempela, isib. izinto ezinciphisa ukulahleka okuphakathi kwe-2-6GHz.

Intengo yeyunithi yezinto ezibonakalayo, ubunzima benqubo (isb., amabhodi anezingqimba eziningi, ama-vias angaboni/angcwatshwe), kanye nesilinganiso sokuvunwa.

Sebenzisa ukwakheka kwamaphaneli, yenza lula izinqubo (isib., nciphisa ama-vias angaboni/afihliwe), bese ukhetha abaphakeli bendawo.

Izinto ezithunyelwe kwamanye amazwe: ~ amasonto angu-4-6; ezinye izindlela zasekhaya: zincishisiwe zaba amasonto angu-2-3.

Yebo, nciphisa inani lezingqimba bese usebenzisa osayizi bezinto ezijwayelekile (isb., 18"×24") ukuze unciphise imfucuza yezinto.

Kufaka phakathi izindleko zezinto zokwakha, izindleko zokucubungula, kanye nemali yokusebenza kabusha, ebalelwa ku-~15%-20% wezindleko eziphelele.

Kusebenza kahle ekukhiqizeni isivivinyo esincane, kunciphisa ukutshalwa kwezimali kwempahla engaguquki ngo-~60%.

Kuphezulu, kudinga ukucutshungulwa okukhethekile; izindleko zokuvuselela kabusha zibiza cishe u-10% wezindleko zokukhiqiza.

I-IPC-4101 (izincazelo zezinto), i-IEC 61189 (izindlela zokuhlola), i-RoHS 2.0 (izidingo zemvelo).

Thumela amasampula ukuze kuhlolwe ukusha kanye nokusebenza kukagesi; isitifiketi sithatha amasonto angama-4-6.

I-AEC-Q200 (ukuthembeka kwengxenye engenzi lutho), i-ISO 26262 (ukuphepha okusebenzayo).

Kumelwe uphumelele isitifiketi se-MIL-P-55110 (izincazelo zesekethe ye-microwave) kanye nokuhlolwa kwemvelo okweqile.

Kumelwe kuhambisane ne-RoHS Directive (ekhawulela izinto eziyingozi eziyisithupha njenge-lead ne-mercury) kanye nemithethonqubo ye-REACH.

Yenza ukuhlolwa kwe-EMC kanye ne-LVD; isitifiketi sithatha izinyanga ezingu-2-3.

Landela i-ISO 13485 (ukuphathwa kwekhwalithi yedivayisi yezokwelapha) kanye nesitifiketi se-FDA 510(k).

Izindinganiso ze-IPC zibuyekezwa njalo eminyakeni eyi-~3-5 ukuze zivumelane nobuchwepheshe obusha.

Yenza izivivinyo zokuthembeka njengokuhlolwa kokufuthwa kukasawoti (amahora angu-96) kanye nokuhlolwa kokudlidliza (20-2000Hz).

SGS, EUROLAB, TÜV Rheinland, njll.

Ukuthuthuka ku-Df ephansi (

Umklamo osizwa yi-AI uthuthukisa umzila (ukuthuthukisa ukusebenza kahle ngo-40%) futhi ubikezela izinkinga zobuqotho besignali.

Izinto ezihlanganisiwe ze-ceramic matrix (Df

Okwamanje kunqunyelwe ukunemba (ububanzi bomugqa ≥ 10 mil), kodwa kulindeleke ukuthi kufinyelele ekuhlolweni okusheshayo esikhathini esizayo

Finyelela ukuhlanganiswa okuphezulu ngokufaka ama-chip kanye nezingxenye ezingasebenzi, kunciphisa ukulahleka kokudluliselwa kwesignali.

Kudinga izinto ezilahlekelwa kakhulu (Df

Kumelwe isekele amabhendi emvamisa ye-terahertz (100-300GHz) nge-Df≤0.0015.

Sebenzisa ukugoba okusekelwe emanzini kanye nokunamathisela okungenalo umthofu ukuze unciphise ukusetshenziswa kwamandla ngo-~25%.

Qaphela ukuqapha kwepharamitha yenqubo ngesikhathi sangempela ngezinhlelo ze-MES, uthuthukise isivuno ngo-15%.

Ukuhlola ukusetshenziswa kwezinto ezihlakaniphile (isb., ama-alloy enkumbulo yokwakheka) ukulungisa imifantu emincane.

Hlola amakhono enqubo (ubuncane bobubanzi bomugqa, inani lezendlalelo), isitifiketi, isikhathi sokulethwa, kanye nensizakalo yangemva kokuthengisa.

Rogers, Isola, Panasonic, Taconic.

Ubuchwepheshe beShengyi, Izinto Ezintsha zeHuazheng, iJingangguoji, enezinzuzo ezisobala zokusebenza ngezindleko.

Kubalulekile; kufanele inikeze ukukhethwa kwezinto ezibonakalayo, isiqondiso senqubo, kanye nezinsizakalo zokuhlaziya ukwehluleka.

Hlola umthamo wokukhiqiza (sq.m/ngenyanga) kanye nesilinganiso sokulethwa ngesikhathi (≥95%).

Izilinganiso zokusebenza, izindlela zokwamukela, umthwalo wemfanelo wokwephulwa komthetho, ubunikazi bempahla yobuhlakani, njll.

Kumelwe ube nesitifiketi se-ISO 9001 futhi ubukeze idatha ye-SPC (statistical process control).

Cacisa izigaba zokubuyiselwa/zokufaka esikhundleni senkontileka; faka isinxephezelo uma izinga lokukhubazeka lidlula u-5%.

Thola izaphulelo zamanani (~5%-10%), ukuhlela izinto eziza kuqala, kanye nokwabelana ngobuchwepheshe.

Kudinga imibiko yokuhlolwa kwe-RoHS kanye nesitifiketi sohlelo lokuphathwa kwemvelo (ISO 14001).

Sebenzisa ukupakisha okungahambisani nokunyakaza, gwema ukukhipha/ukuguquka, futhi ulawule izinga lokushisa ku-5-35℃.

Indawo eyomile (umswakama

Kunconywa ukusebenzisa izinto zokuhlanza ezisekelwe emanzini; gwema izinyibilikisi ezine-chlorine ukuze uvimbele ukugqwala kwezinto.

Nikeza izinkampani zochwepheshe zokuvuselela kabusha ukuze kugwenywe ukungcoliswa kwemvelo.

Kumele ilebheli uhlobo lwezinto, inombolo yenguqulo, usuku lokukhiqiza, kanye nobubanzi bokulawula ukuvinjelwa.

Ihlanganisa cishe u-3%-5% wezindleko eziphelele; imikhiqizo esezingeni eliphezulu idinga ukupakishwa kwe-vacuum + ama-desiccant.

Nikeza ukuqeqeshwa okukhethekile ngezakhiwo zezinto ezibonakalayo, imininingwane yenqubo, kanye nokusebenza kwemishini (isikhathi sokuqeqeshwa ~ isonto eli-1).

Ubunzima obukhulu; kudinga amathuluzi akhethekile (isb., iziteshi zokulungisa kabusha nge-laser) futhi kulula ukulimaza ungqimba lwe-dielectric.

Kumelwe agcine amafayela okuklama, imingcele yenqubo, imibiko yokuhlola, njll., okungenani iminyaka emi-5.