PCB ea maqhubu a phahameng

E sebelisa thepa e nang le tahlehelo e tlase (joalo ka Rogers 4350B), e nang le mamello ea bophara ba mola ±0.01mm, ho nepahala ha taolo ea sebaka sa lera la lets'oao ±5%, le ho nepahala ha taolo ea impedance ±5Ω.

Liteishene tsa motheo tsa 5G (24.25-52.6GHz), puisano ea sathelaete (Ka band 26.5-40GHz), radar ea maqhubu a millimeter (77GHz), litsi tsa data tse lebelo le phahameng (100Gbps+).

Ho hlahlojoa ka bongata ka diparamitha tse kang tahlehelo ya ho kenya (

E amanang le sebopeho sa limolek'hule tsa thepa, mocheso (Df e eketseha ka 3%-5% bakeng sa keketseho e 'ngoe le e 'ngoe ea 10℃), le maqhubu (Df e eketseha ka sekwere sa maqhubu).

Rogers 4350B (Dk=3.48, Df=0.0037), Taconic TLY-5 (Dk=2.2, Df=0.0009), Isola 370HR (Dk=3.6, Df=0.004).

Lisebelisoa tse tlaase tsa Dk li fokotsa tieho ea phetisetso (mohlala, lisebelisoa tsa Dk=2.2 li na le tieho e potlakileng ka 25% ho feta FR-4), 'me Df e tlase e fokotsa ho fokotseha ha lets'oao (tahlehelo e tlase ka 70% ho feta FR-4 ha Df=0.001).

Ho monya metsi >0.5% ho baka ho feto-fetoha ha Dk ho feta 5%. Ho kgothaletswa ho sebedisa thepa e monyang metsi

Beha pele thepa e nang le Dr. 2.5 le Df. 0.001 (joalo ka Arlon AD255, Dr. 2.5, Df. 0.0008) ho fihlela lits'ebetso tsa 24-100GHz.

Ho eketsa aluminium oxide ceramics ho ka eketsa thepa ea Tg ho 280℃+ le ho fokotsa coefficient of thermal expansion (CTE) ho 2-3ppm/℃, ho ntlafatsa botsitso ba mocheso o phahameng.

Lits'ebetsong tse tloaelehileng, bophara/sebaka sa mola ≥50μm; lits'ebetso tse tsoetseng pele li ka fihla ho 30μm, tse hlokang ho bapisoa ha taolo ea impedance.

Sebelisa ho bokellana ka mokhoa o lekanang, ka sebaka sa ≤0.1mm pakeng tsa matla le mealo ea fatše le ≤0.05mm pakeng tsa mealo ea lets'oao le ea litšupiso ho fokotsa tšitiso ea motlakase.

Li-vias tse tloaelehileng li baka tahlehelo ea -3dB ho 10GHz. Ho sebelisa ho cheka ka morao (ho tlosa bolelele bo feteletseng ba stub) ho ka fokotsa tahlehelo ka ho feta 60%.

Qoba ho tsamaisa tsela ka lehlakoreng le letona (ponahalo e eketseha ka 15%), beha dikhutlo tse 45° pele; sebaka sa ho potoloha ha letshwao la taolo

Sebelisa ho phunya ka laser ea CO₂ (ho nepahala ha lesoba ±5μm) ho qoba ho aroloa ha lesoba ho tsoa ho ho phunya ka mechine, ka ho teteana ha lebota la masoba Ra≤1.2μm.

Sebelisa polata ea koporo e se nang motlakase + koporo e kopanyang motlakase, laola ho rarahana ha lera la koporo Rz≤2μm ho fokotsa tahlehelo ea bokaholimo (tahlehelo e eketseha ka 10% bakeng sa keketseho e 'ngoe le e 'ngoe ea ho rarahana ha 1μm).

Khauta e qoelisoang ka nickel e se nang motlakase (ENIG) e nang le botenya ba 1-3μm le khanyetso ea ho kopana

Mocheso oa lamination o lokela ho laoloa ho thepa Tg+30℃ (mohlala, mocheso oa lamination oa Rogers 4350B 210-230℃), ka khatello ea 5-8MPa ho qoba ho arohana.

Sebelisa TDR (reflectometer ea nako-domain) ho lemoha ho tsoela pele ha impedance, X-ray ho lemoha ka ho kheloha ha boemo (ho lumelleha ±0.05mm), le AOI ho lemoha mamello ea bophara ba mola.

Sebelisa thepa e tlase ea Df, ntlafatsa ho hlaka ha foil ea koporo (foil ea koporo ea RTF e na le tahlehelo e tlase ka 30% ho feta foil ea koporo ea RA), 'me u khutsufatse bolelele ba mohlala.

Hlahloba ho se kgone ho tswela pele ha phetiso ya motlakase (jwalo ka di-via, dihokelo), netefatsa ho kheloha ha phetiso ya motlakase

Bolelele bo feteletseng ba mothati o bapileng bo baka ho thula ha mehala. Ho eketsa sebaka sa mela ho ya molaomotheong wa 3W (W ke bophara ba mola) le ho eketsa karohano ya mobu ho ka fokotsa ho thula ha mehala ka 20dB.

Fela ka li-resistor tse tšoanang (khanyetso = phetiso ea mohala oa phetiso) 'me u sebelise liphetoho tsa bophara ba mola butle-butle ho fokotsa coefficient ea ho bonahatsa ka tlase ho 0.1.

Thebe e nang le sefofane se felletseng sa fatše (sekheo

Ho tsamaisoa ha motlakase ka foil ea koporo (ho tsamaisoa ha motlakase ka mocheso oa 398W/mK) ho etsa 70%, ho tsamaisoa ha thepa ke 20%, le ho tsamaisoa ha motlakase ka mahlaseli ke 10%.

Eketsa mocheso ka bongata (≥200/cm²), sebelisa foil e teteaneng ea koporo (≥3oz), 'me u kopanye le li-heat sinks ho fokotsa khanyetso ea mocheso ka 40%.

Substrate ea aluminium (170W/mK) > substrate ea koporo (398W/mK) > FR-4 e tloaelehileng (0.35W/mK).

Bakeng sa keketseho e 'ngoe le e 'ngoe ea 10℃, Dk e eketseha ka 0.5%-1%, 'me Df e eketseha ka 3%-5%. Mocheso o khothaletsoang oa ts'ebetso ke

Ka bophara ba 0.3-0.5mm, sebaka sa ≤1mm ho netefatsa litsela tse sebetsang tsa ho tsamaisa mocheso le ho fokotsa khanyetso ea mocheso ka 30%.

Teko ea liparamente tsa S (S11, S21, jj.), teko ea impedance, teko ea tahlehelo ea dielectric, teko ea potoloho ea mocheso (-40℃ ~ 125℃, lipotoloho tse 500).

S11 (tahlehelo ea ho khutla), S21 (tahlehelo ea ho kenya). Mefuta ea maqhubu a teko e koahela sehlopha sa ts'ebetso ka ho nepahala ha ±0.5dB.

Etsa liteko tsa mocheso o mongobo (85℃/85% RH, 1000h) le liteko tsa spray ea letsoai (5% NaCl, 24h) ho netefatsa ho hanyetsa boemo ba leholimo ba thepa.

E lekanya sebopeho sa maqhubu a ponts'o ka ho ntša lets'oao la mohato ho fumana litšitiso tsa impedance, ka qeto ea ho fihla ho 0.1mm.

Sebelisa likamore tse se nang molumo ho leka mesi e ntšang mahlaseli (≤-40dBμV/m@1GHz) le teko ea katleho ea thebe (>60dB).

Sebelisa ho kopanya naetrojene hape (kahare ho oksijene

Khetha lihokelo tsa maqhubu a phahameng tse kang SMA, 2.92mm, 1.85mm, jj., ka maqhubu a ts'ebetso a koahelang lebanta le tahlehelo e hlokahalang ea ho kenya

Netefatsa hore ho na le ho tšoana ha impedance pakeng tsa lihokelo le li-PCB, 'me u hloekise li-terminal kamora ho li kopanya ho fokotsa tahlehelo ka 15%.

Ho hlokahala ho fihlela litlhoko tsa sehlopha sa 24-52GHz le ho rarolla mathata a ho qhalana ha mocheso (botenya ba matla >10W/cm²) le mathata a ho ntsha mocheso ka mokhoa o fokolang.

Pasa setifikeiti sa AEC-Q200, ka mocheso o sebetsang oa -40℃ ~ 125

IPC-4101 (tlhaloso ea thepa ea motheo), IPC-6012 (tekanyetso e tiileng ea kamohelo ea boto), IEEE 802.3 (tekanyetso ea lets'oao la lebelo le phahameng).

E lumellana le MIL-PRF-55110 (li-microwave circuits), mocheso oa ts'ebetso -55℃ ~ 125℃, e fetile liteko tsa spray ea letsoai le hlobo.

E fihlela litlhoko tsa AEC-Q200 (setifikeiti sa karolo e sa sebetseng) le ISO 26262 (polokeho e sebetsang).

E kopana le 3GPP TR 38.810 (lisebelisoa tsa seteishene sa motheo), tahlehelo ea ho kenya -15dB.

E latela NASA-STD-8739.3 (thepa ea elektroniki), e fetile teko ea mocheso o mongobo oa lihora tse 1000, phetoho ea Drk

Thepa ea tahlehelo e tlase haholo (Df

CTE e theohetse ho 1ppm/℃, conductivity ea mocheso e eketsehile ho fihla ho 100W/mK, ha e ntse e boloka Drk e tlase (2.8).

Lisebelisoa tse tenyetsehang li na le DD e phahameng hanyane (3.0-3.5) le DF e phahameng ka 20%-30%, empa li nolofalletsa ho tsamaisa 3D.

Thepa e sireletsang tikoloho (e kang ea line e thehiloeng ho faeba) e nang le Dr=3.2 le Df=0.004, e loketse lisebelisoa tsa elektroniki tsa bareki.

Al₂O₃ substrate ea letsopa e nang le Dr=9.8 le conductivity ea mocheso ea 24W/mK, e loketse ho kopanngoa ha lisebelisoa tsa motlakase.

Moqapi oa Altium, Cadence Allegro, ANSYS HFSS (ketsiso ea motlakase), Keysight ADS (ketsiso ea potoloho).

Haha mohlala oa 3D, beha liparamente tsa thepa le maemo a moeli, etsisa liparamente tsa S le kabo ea tšimo ka phoso

E etsa ketsiso ea boemo ba potoloho, e ntlafatsa marang-rang a tsamaellanang, e bolela esale pele tahlehelo ea ho kenya le tahlehelo ea ho khutla, 'me e tšehetsa tlhahlobo ea li-parameter tsa S tsa likoung tse ngata.

Phoso e ka hare ho ±3Ω, e hlokang ho lekanngoa ka diparamitha tsa tshebetso tsa nnete (tse kang ho ba thata ha foil ya koporo, botenya ba dielectric).

Fetola sebopeho sa mohlala ho latela kabo ea tšimo, ntlafatsa ho bapisa impedance ka ho hlahloba liparamente, 'me u rale ka mokhoa o pheta-phetoang ho fokotsa tahlehelo.

Mochini oa ho tjheka ka laser (ho nepahala ± 5μm), laminator ea vacuum, mochini o nang le ho betla ka nepo e phahameng (ho mamella bophara ba mola ± 0.01mm).

Laser ea CO₂ e loketse liboto tse teteaneng (>1mm) tse nang le masoba a maholo (≥0.3mm); Laser ea UV e loketse liboto tse tšesaane (

Tekanyo ea vacuum

Ntlha ea ho qoelisa ≥3:1, ho netefatsa hore karolo ea lehlakore e qoelisa

E ka lemoha ho kheloha ha bophara ba mola/sebaka (± 0.005mm), di-short/di-circuits tse bulehileng, boholo ba bonyane ba sekoli ke 0.01mm.

E latela RoHS 2.0 (e thibela lintho tse 6 tse kotsi tse kang loto le mercury), halogen e ka tlase ho 900ppm.

Sebelisa ho kopanya ho se nang loto, tekanyo ea tšepe e boima 95%).

Fumana koporo hape ka ho e silakanya ka matla + ho qhibiliha ha lik'hemik'hale (sekhahla sa ho hlaphoheloa > 98%), 'me u phekole litšila tsa resin ka mokhoa o se nang kotsi.

Lisebelisoa tse thehiloeng ho polylactic acid tse nang le Dr=3.3 le Df=0.005, sekhahla sa ho senyeha ha tsona ke > 80% matsatsing a 180 kamora ho sebelisoa.

Mekhoa ea tikoloho e eketsa litšenyehelo ka 10%-15%, empa ho latela melao ho qoba likotsi tsa kotlo.

Li-algorithms tsa AI li ntlafatsa topology ea ho tsamaisa litsela, li fokotsa nako ea moralo oa letsoho ka 50% le tahlehelo ea lets'oao ka 15%.

E nolofalletsa meaho e rarahaneng ea 3D e nang le ho nepahala ha ho hokahanya mekhahlelo e fapaneng ± 0.05mm, empa tahlehelo ea thepa hajoale e holimo (Df=0.01).

E hloka thepa ea tahlehelo e tlase haholo (Df

E hloka thepa e nang le Dr

E amohela theknoloji ea ho paka ea 2.5D/3D ho khutsufatsa litsela tsa matšoao le ho fokotsa tahlehelo ea sistimi ka 30%.

Qoba libaka tse nang le mocheso o phahameng le mongobo o phahameng (mocheso o ka tlase ho 60℃, mongobo o ka tlase ho 60% RH), 'me u hloekise lerōle la bokaholimo khafetsa (ho tlosa lerōle la motlakase).

Sebelisa ho phunya ka morao ho tlosa tse feteletseng ka li-stub, tse bolelele ba li-stub ≤1/8λ; sebelisa ho kopanya lesoba le kenang ka har'a masoba ho fokotsa bokhoni ba likokoana-hloko.

Beha pele thepa ea DD e tlase (

Leka di-parameter tsa S ka sehlahlobi sa marang-rang, se hlokang S11 ≤ -15dB le phoso ya impedance e ikgethang ±5Ω; sebedisa TDR ho bona coefficient ya pontsho

Botenya ba lera la dielectric ke 0.05-0.2mm, ho ba thata ha foil ya koporo Ra≤0.5μm; mesaletsa ya lera e haufi e otlolohile, sebaka sa lera la matla/lefatshe

Sebelisa makotikoti a tšireletso a tšepe (bokgoni ba tšireletso ≥80dB) ka bophara ba sekheo

Sebaka sa mela ≥3 × bophara ba mola, phoso ea bolelele

ENIG e fana ka bokaholimo bo boreleli le tahlehelo e tlase; botenya bo bosesaane ba OSP bo loketse lits'ebetso tsa maqhubu a phahameng, ho qoba tahlehelo ea makenete ho tsoa ho mealo ea nickel.

Sebelisa HFSS/CST bakeng sa ketsiso ea motlakase ea maqhubu a felletseng ho netefatsa SI/PI; etsa tlhahlobo ea S-parameter sweep ho lintlha tsa maqhubu a ≥10.

Khetha thepa e nang le CTE ≤15ppm/℃, eketsa mocheso ka bongata (≥20/cm²), 'me u sebelise liboto tse koahetsoeng ka koporo tse thehiloeng tšepeng.

Sebelisa thepa ea Df e tlase e thehiloeng ho PTFE; ntlafatsa botenya ba lera la dielectric ho fihlela maemo a resonance a λ/4 le ho fokotsa tahlehelo ea matla.

Ho mamella bophara ba mola ±0.02mm ho baka impedance 波动 ±3Ω; ho mamella botenya ba dielectric ±0.01mm ho baka ho kheloha ha Dk ±0.1, ho hlokang taolo e tiileng.

Beha metswako ya MLCC (10nF/100nF/1μF) sebakeng sa ho kenya motlakase; arola lera la motlakase ka sebaka sa ≥50mil pakeng tsa libaka tsa motlakase.

Phetoho ea ho kopana le sesebelisoa