I-SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

Kuvunyelwe ukulungiswa okuncane kuphela ngaphakathi kuka-±0.05mm. Izingxenye ezinokuphambuka okukhulu zidinga ukubuyiselwa kumhlinzeki ukuze kugwenywe ukuphuka kwephini okubangelwa ukubekwa ngenkani.

Sebenzisa imodi "yokusekela okuphakathi + ukuvala okubili". I-nozzle yomshini wokukhetha nokubeka idinga ukuthinta i-maphakathi kanye ne-end zombili zengxenye ngesikhathi esisodwa ukuqinisekisa ukucindezeleka okufanayo.

Ubukhulu budinga ukuncishiswa bube ngu-60–90μm ukuze kugwenywe ukunqwabelana kwe-solder paste okubangela ukuhlangana. Kunconywa ukusebenzisa i-stencil eyenziwe ngogesi.

Ukulungiswa okuncane (ukushintsha okungu-≤0.1mm) kuvunyelwe ngaphambi kokugoqa kabusha, kodwa kudinga ukusizwa nge-tweezer ecwiliswe ekugelezeni ukuze kugwenywe ukungcolisa iphedi.

Akukhuthazwa ukufaka i-solder ngemuva ngoba amalunga angaphansi e-solder awakwazi ukuhlolwa ngokubona. Ingxenye idinga ukususwa bese i-solder paste idinga ukuphrintwa kabusha.

Qinisekisa ukuthi umehluko enanini lokunamathisela i-solder kuzo zombili izinhlangothi zengxenye u-≤3%, futhi wehlise izinga lokushisa lokugoqa kabusha libe ngu-≤1.5℃/s ukuze unciphise ukucindezeleka kokushisa okungalingani.

Akukhuthazwa ngoba kungalimaza ungqimba olungaphezulu lwamabhola e-solder. Kudingeka kusetshenziswe i-flux ekhethekile (njengohlobo olungahlanzekile) ukuthuthukisa ukumanzisa.

Yehlisa ingcindezi yokubeka ibe ngu-0.05–0.1N, bese ubambezela isikhathi sokukhululwa kwe-nozzle (0.2–0.5s) ukuze ugweme ukuguquka kwamabhola e-solder ngaphansi kwengcindezi.

Izinga le-vacuum kudingeka libe ngu-≥ - 80kPa ukuqinisekisa ukumuncwa okuzinzile kwezingxenye ezincane. Ngesikhathi esifanayo, kufanele kulungiselelwe inzwa yokubona ukuvuza.

Uma inani lamabhola e-solder angekho lingu-≤5% futhi engewona amaphini abalulekile, ukulungiswa nge-laser kanye nokugcwalisa ibhola kungasetshenziswa; ngaphandle kwalokho, ibhodi idinga ukulahlwa.

Amaphakheji e-ceramic avame ukumuncwa umswakama. Adinga ukubhakwa ku-150℃ amahora angu-8 ukuze kuqedwe ukucindezeleka kwangaphakathi futhi kuncishiswe okuqukethwe umswakama kube ngaphansi kuka-0.1%.

Uma umehluko we-CTE > 10×10⁻⁶/℃, inqubo yokupholisa ehamba kancane (izinga ≤1℃/s) idinga ukungezwa ngemva kokugoqa kabusha ukuze kuncishiswe ukuqhekeka kwejoyinti le-solder.

Cha. Njengoba ama-LGA pad engenawo amabhola okusoda, kudingeka i-nozzle eyisicaba enenzwa yokucindezela ukuqinisekisa ukubekwa okufanayo kwengcindezi.

Ingqimba yegolide ecwebezelayo idinga ukuba yi-≥3μm, kanti ingqimba ye-nickel ecwebezelayo idinga ukuba yi-≥5μm. Ngaphandle kwalokho, ukumelana okukhulu kokuthintana kungaholela kalula ekuncipheni kwesignali noma ekuhlulekeni kokushisa.

Isikhungo se-nozzle sidinga ukuhambisana nesikhungo sokudonsa amandla sengxenye (ukuphambuka ≤0.01mm), futhi umsebenzi wokuthola ukuma kwengxenye yomshini wokukhetha nokubeka kufanele uvulwe.

Izikhonkwane zokusekela ezinwebekayo (ubulukhuni bogu 60–70) ziyadingeka ukuze kugwenywe ukugudluka kwengxenye okubangelwa ukugoba kwe-substrate.

Amabala e-lens azobangela iphutha lokubona i-lead >0.02mm. Kudingeka ihlanzwe nge-ethanol ephelele kanye ngesonto.

I-SAM (Scanning Acoustic Microscopy) isetshenziselwa ukuthola ukuhlukanisa endaweni exhumanisayo yejoyinti le-solder. Indawo yokuhlukanisa kufanele ibe yi-≤10% yendawo yephedi.

Ama-flip chips adinga ukulawulwa okunembile kokuqondaniswa kwamabhola e-solder nama-bumps (ukunemba ≤±0.002mm), futhi inqubo yokugcwalisa ngaphansi kwe-underfill idinga ukusetshenziswa.

Ingafinyelela ukushisela okungena-solder-paste, ngesilinganiso se-solder joint void

Isebenzisa imisebe ye-laser ukulawula ngqo izingxenye (ukunemba ≤±0.001mm), ngaphandle kwesidingo sama-nozzles omshini, futhi ifaneleka ekupakishweni kwe-nanoscale.

Ingalingisa inqubo yokubeka ngesikhathi sangempela, ibikezele ukusatshalaliswa kokucindezeleka kwezingxenye, futhi ilungiselele amapharamitha kusengaphambili ukuze kuncishiswe ingozi yokwehluleka kwejoyinti le-solder.

Engeza amadivayisi okupholisa umoya endawo (okulawulwa izinga lokushisa ku-23±2℃), futhi ngesikhathi esifanayo, nciphisa isikhathi sokuchayeka kwezingxenye ngemva kokuvula (≤imizuzu engama-30) ukuze ugweme ukwandisa ukuminyana kwebhola le-solder.

① I-PCB idinga ukubhakwa ku-120℃ amahora ama-4 ngaphambi kokunyathelisa i-solder paste; ② Izingxenye kufanele zifakwe ekukhiqizweni ngokushesha ngemva kokuvulwa, futhi kufanele kulungiselelwe umshini wokususa umswakama (RH≤40%) emishinini.

I-solder eseleyo idinga ukuhlanzwa nge-desoldering braid, kanti ama-oxide adinga ukususwa ngokuhlanzwa kwe-plasma ukuqinisekisa ukuthi ubulukhuni bomphezulu we-pad bungu-≤1.6μm.