I-PCB encane enezimbobo

Ibhodi lesifunda eliphrintiwe (i-PCB) elenziwe kusetshenziswa ubuchwepheshe bokuqopha nge-laser noma i-plasma enobubanzi bembobo obungaphansi kuka-0.15mm (imboni ngokuvamile isebenzisa u-0.1mm njengendinganiso), elisetshenziselwa ukuxhumana kwabantu abaningi.

Ububanzi bembobo buncane ngo-50% kunobe-PCB ezivamile, ububanzi/isikhala somugqa singafinyelela ku-30μm/30μm, ubuningi bezintambo bukhuliswa izikhathi ezingu-2-3, futhi bufanelekela ukudluliselwa kwesignali okuhamba ngesivinini esiphezulu kanye nesivinini esikhulu.

Ngokwenqubo, zihlukaniswe ngama-via angaboni (ukuqhuba kohlangothi olulodwa), ama-via angcwatshwe (ukuqhuba kwangaphakathi), kanye nama-via (ngokusebenzisa ibhodi lonke). Ububanzi obuvamile bokungaboni bungama-50-100μm.

Isetshenziswa kabanzi ezimweni zokuhlanganiswa kwabantu abaningi njengezingcingo eziphathwayo (ezingaphezu kuka-60%), iziteshi zesisekelo ze-5G, amabhodi e-server, kanye nokupakishwa kwama-chip e-AI.

Kwavela ngemva kokuvuthwa kobuchwepheshe bokubhoboza nge-laser ngawo-1990. Inqubo yamanje evamile ingafinyelela ububanzi bembobo obungu-30μm, kanti irekhodi elincane lobubanzi bembobo lingu-15μm.

Ububanzi bembobo obuncane bokukhiqizwa kwezimboni bungafinyelela ku-50μm, kanti umkhawulo webhubhoratri ungama-15μm, kodwa izindleko zanda kakhulu ngokuncipha kobubanzi bembobo.

Ngokuvamile, isilinganiso se-aspect asidluli ku-1:1, futhi izinqubo ezikhethekile zingafinyelela ku-1:0.8. Isilinganiso se-aspect esiphezulu kakhulu kungenzeka sibangele ukugcwaliswa kabi kwe-electroplating.

Isikhala esincane esinconywayo singu-≥80μm ukuqinisekisa ubuqotho besendlalelo se-copper plating esingena-electro futhi kuncishiswe ingozi yama-short circuits.

Kunconywa ukusebenzisa ukuhlanganiswa okushintshanayo kwamabhodi ayinhloko kanye nama-prepreg, kanti ubukhulu be-dielectric obuphakathi kwezingqimba bulawulwa ku-50-75μm ukuqinisekisa ikhwalithi yokudluliselwa kwesignali.

Kuyadingeka ukunaka amandla e-parasitic embobo (inani elijwayelekile

Ku-BGA fan-out, kukhethwa i-blind via design. Iphedi ngayinye ihambisana nama-microvia angu-1-2, kanti ububanzi bomugqa we-fan-out abukho ngaphansi kwama-40μm.

Thola uxhumano lwamaphuzu amaningi phakathi kwezindiza zamandla/zomhlaba ngokusebenzisa ama-microvia, ngesikhala esingu-≤5mm, ukuze unciphise ukuvimba phakathi kwezindiza.

Khulisa ubuningi be-vias zokusabalalisa ukushisa (kunconywa ama-vias angu-≥10/cm²), ngobubanzi bembobo obungu-≥80μm, ukuze uthuthukise ukusebenza kahle kokuqhuba ukushisa.

Ukuvulwa kwemaski yokusoda kufanele kube mkhulu ngama-20-30μm kunobubanzi bembobo ohlangothini ngalunye ukuvimbela i-inki yemaski yokusoda ukuthi ingavimbi imbobo.

Sebenzisa inqubo yokwakha ukuze wandise inani lezingqimba zokuxhuma, bese usebenzisa ama-via angaboni futhi agqitshwe esikhundleni sama-via adlulayo, okungandisa ubuningi bokuxhuma ngezintambo ngaphezu kuka-30%.

Kubandakanya ukubhoboza nge-laser (i-CO₂, i-UV laser), ukubhoboza nge-plasma, kanye nokubhoboza ngomshini (kufanele kuphela ububanzi obukhulu bemigodi), kanye nokubhoboza nge-laser okungaphezu kuka-80%.

I-laser ye-CO₂ ifanelekela ububanzi bemigodi engu-0.075-0.15mm ngentengo ephansi; i-laser ye-UV ingacubungula ama-microvia angaphansi kwama-50μm, kodwa izindleko zemishini ziphakeme ngokuphindwe ka-3-5.

Ijubane lokubhoboza le-laser ye-CO₂ licishe libe yimigodi engu-5,000-10,000 ngomzuzu, kanti ele-laser ye-UV licishe libe yimigodi engu-2,000-5,000 ngomzuzu.

Ukunemba kokubekwa kokubhoboza nge-laser kungu-±25μm, ukunemba kokubhoboza ngomshini kungu-±50μm, kanti i-laser ye-UV ingafinyelela ukunemba okuphezulu okungu-±15μm.

Ukubhoboza nge-laser okusizwa yi-nitrogen kungalawula ukuphakama kwe-burr ngaphakathi kwama-5μm, noma kungasetshenziswa ukususwa kwe-plasma.

Kudingeka inqubo yokufaka i-electroplating ngembobo edlulayo, lapho ubukhulu be-copper plating bulawulwa ku-25-35μm, kanye nokufana kobukhulu be-copper emgodini ≥85%.

Beka ungqimba lwethusi oluyi-0.3-0.5μm odongeni lwembobo yokuvikela ukuze unikeze isisekelo esiqhubayo. Ukuhlushwa kwama-ion e-palladium esixazululweni sokusebenza kudinga ukulawulwa ku-2-5ppm.

Izinga lokushisa le-lamination lingu-180-210℃, ingcindezi ingu-300-500psi, kanti izinga lokushisa lingu-1-2℃/umzuzu ukuqinisekisa ukuqiniswa okufanayo kwesendlalelo se-dielectric.

Izinga le-vacuum kudingeka libe ngaphansi kuka--95kPa. Lungisa kusengaphambili i-prepreg ibe yi-B-stage ngaphambi kokulamination, futhi izinga lokukhubazeka kwebhamuza lingancishiswa libe ngaphansi kuka-0.5%.

Ezivamile zihlanganisa igolide lokucwilisa (ukujiya okungu-0.05-0.1μm), i-OSP (ukujiya kwefilimu okungu-0.2-0.5μm), kanye nesiliva lokucwilisa (0.1-0.3μm). Igolide lokucwilisa linokwethenjelwa okuphezulu kakhulu.

Kuyadingeka ukulawula i-viscosity ye-inki kuma-Pa 80-120 bese usebenzisa inqubo yokuvala i-vacuum ukuvimbela insalela ye-inki emigodini, ngesilinganiso sokuvimba imigodi ≤1%.

Ukusika nge-laser kusetshenziswa lapho isidingo sokunemba kwesimo singaphansi kuka-0.1mm. Ngokwezidingo ezivamile, izisiki zokugaya zingasetshenziswa, ngesivinini sokusika esingu-20,000-30,000rpm.

Kubandakanya izindonga zemigodi ezimagebhugebhu (ubugebhugebhu be-Ra >1.5μm), izikhala ezimbobeni (isilinganiso sezikhala >5%), ukuphambuka kwemigodi (>±30μm), njll.

Ukuhlanza nge-plasma kusetshenziselwa ukususa izinsalela zokubhoboza, ukuze ubulukhuni bomphezulu we-Ra wodonga lwembobo lube ≤1.0μm.

Isivuno esiphelele ngaphansi kwezinqubo ezivuthiwe singaba ngu-85-92%. Uma ububanzi bembobo buncane, isivuno siba sincane. Isivuno sama-microvia angu-50μm cishe singaba ngu-80%.

Kubandakanya i-FR-4 (i-dielectric constant 4.2-4.5), amabhodi anesivinini esikhulu (njenge-Rogers 4350B, i-Dk=3.66), i-BT resin, njll.

Amabhodi anesivinini esikhulu ane-tangent yokulahlekelwa ephansi (Df

Isetshenziselwa ukubopha okuphakathi kwezingqimba, okuqukethwe kweglue kulawulwa ku-40-50% kanye nokugeleza ku-20-30% ukuqinisekisa ukufana kwe-dielectric ngemuva kokubopha.

Kwesendlalelo sangaphakathi, kunconywa i-foil yethusi engu-18μm noma engu-35μm. Kwesendlalelo sangaphandle, i-18μm ingasetshenziswa ukunciphisa ukulahleka kwesiginali. Amabhodi e-HDI avame ukusebenzisa i-foil yethusi engu-9μm enobuncane kakhulu.

Kudingeka ihlangabezane nokumelana nokushisa (akukho ukuxebuka ku-260℃/10s), ukumelana nokushisa (>10^12Ω), kanye nokunamathela (izinga lokuhlola elinqunyiwe 0).

Kunconywa ukusebenzisa i-RTF (reverse treatment) i-copper foil enobukhulu be-Ra

Khetha izinto ezihambisana ne-dielectric constant ephansi (Dk

Kudingeka balandele isiqondiso se-RoHS 2.0, esinokuqukethwe kwe-halogen (i-chlorine + i-bromine)

Izinto eziyisisekelo ze-FR-4 zinezindleko eziphansi kakhulu. Amabhodi anesivinini esikhulu abiza ngokuphindwe kathathu kuya kahlanu kune-FR-4, kanti i-BT resin iphakathi.

Izinto eziyisisekelo zidinga ukugcinwa ngaphansi kwama-25℃ kanye nomswakama ongaphansi kwama-60%. I-prepreg idinga ukuqandiswa ku--18℃ kanye nesikhathi sokusebenza sezinyanga eziyi-6-12.

Kubandakanya ukuhlolwa okubonakalayo, ukulinganiswa kobubanzi bembobo, ukuhlolwa kokujiya kwethusi lembobo, ukuhlolwa kokungavimbeli, kanye nokuhlaziywa kwesigaba esiphambene.

Sebenzisa ithuluzi lokulinganisa isithombe elinezinhlangothi ezimbili (ukunemba ±1μm) noma i-scanning electron microscope (SEM). Ukuhlolwa okuzenzakalelayo kwe-optical (AOI) kungasetshenziswa ukuthola i-batch.

Izindinganiso ze-IPC zidinga ukuthi ubukhulu bethusi emgodini bube yi-≥20μm, kanye nesilinganiso sobukhulu bethusi obumaphakathi nobukhulu bethusi obuncane sibe yi-≤1.5, okutholwe ngendlela ye-metallographic cross-section.

Sebenzisa i-network analyzer enobubanzi bokuhlola bemvamisa obungu-1-10GHz, futhi ukuphambuka kwe-impedance kufanele kulawulwe ngaphakathi kuka-±10%.

Ingabona ngeso lengqondo ikhwalithi yodonga lwembobo, ukujiya kwesendlalelo sethusi, kanye nesimo sokubopha phakathi kwesendlalelo, ngokunemba kokusikwa okungu-±5μm.

Kubandakanya ukuhlolwa kokucindezeleka kokushisa (260℃/izikhathi eziyi-10), ukuhlolwa kokumelana ne-voltage (500V DC/1 iminithi), kanye nokuhlolwa komjikelezo wokushisa-umswakama (-40℃ ~ 85℃).

Bheka ukuthi udonga lwembobo luyaqhekeka yini ngemva kokuhlolwa kokushaqeka kokushisa (288℃/izikhathi eziyi-10), kanye nobude bokuqhekeka

Sebenzisa i-SEM ukuze ubone isakhiwo esincane, i-energy-dispersive spectroscopy (EDS) ukuze uthole ukwakheka kwezinto eziyisisekelo, kanye ne-X-ray ukuze uthole amaphutha angaphakathi.

Lungiselela inqubo ye-electroplating ukuze unciphise izikhala ezimbobeni, uqinise ukunamathela kwesendlalelo semaski ye-solder, futhi ugweme ukufuduka kwe-electrochemical okubangelwa yizici zemvelo.

Ngaphansi kwezimo ezijwayelekile zokusetshenziswa, ingafinyelela eminyakeni emi-5-10, futhi izindawo ezinzima (izinga lokushisa eliphezulu, umswakama ophezulu) zizoyifinyeza ibe yiminyaka emi-2-3.

Kubandakanya ukunamathisela kwe-SMT, ukushisela kwe-BGA, kanye nokufakwa kwezingxenye, ngesidingo sokunemba kokunamathisela kwe-SMT esingu-±50μm.

Kuyadingeka ukulawula ingcindezi yokunamathisela ku-0.5-1.0kg/cm² ukuvimbela izingxenye ukuthi zingawi ama-microvia, futhi izinga lokushisa eliphakeme lejika le-oven eliphinde ligeleze lingu-230-245℃.

Kuyadingeka ukulawula ngokunembile ukulingana kwamabhola e-solder (

Lungiselela ubukhulu bokuphrinta kwe-solder paste (100-120μm), sebenzisa i-soldering evikelwe yi-nitrogen, futhi okuqukethwe kwe-oxygen kungu-

Izinga lokushisa lokulungisa kabusha kufanele lilawulwe ngaphansi kuka-260℃, futhi isikhathi kufanele sibe ngaphansi kwemizuzwana engama-90 ukuvimbela ungqimba lwethusi odongeni lwembobo ukuthi lungaphuki.

Ifanele ama-microvia anobubanzi bembobo obungu-≥0.3mm, adinga ukusongwa ngamagagasi amabili noma ukusongwa kwamagagasi okukhetha, anokuphakama kwamagagasi okusongwa okungu-25-35mm.

Nikeza kuqala i-solder paste engenalo i-lead (i-SnAgCu alloy) enephuzu lokuncibilika elingu-217℃, i-flux activity level RMA, kanye nokumelana nokufakwa kwe-residue insulation >10^10Ω.

Nciphisa okuqukethwe kwensimbi kwe-solder paste kube ngu-90-92%, lungisa ukwakheka kokuvulwa kwe-stencil, futhi izinga lokukhubazeka kobuhlalu be-solder lingancishiswa libe ngaphansi kuka-0.1%.

Sebenzisa izinto zokuhlanza ezisekelwe emanzini ekushiseni okungu-50-60℃ imizuzu emi-3-5 ukuqinisekisa ukuthi ukugcwala kwama-ion asele ku-

Setha ukunemba kokutholwa kube ngu-±25μm kanye nomkhawulo wokuqhathanisa ube ngu-30-50%, okungabona amaphutha angaphezu kuka-95% enhlangano.

Izindleko zezinto zokwakha zingu-40-50%, izindleko zokucubungula zingu-30-40%, kanti izindleko zokuhlola nokupakisha zingu-10-20%.

Ububanzi bembobo, inani lezendlalelo, inqubo yokwelapha ubuso, uhlobo lwezinto ezibonakalayo. Ukunciphisa ngakunye okungu-10μm kobubanzi bembobo obuncane kwandisa izindleko ngo-15-20%.

Lungiselela umklamo ukuze unciphise inani lezingqimba, usebenzise izinto ezijwayelekile, futhi wandise amaqoqo okukhiqiza, okunganciphisa izindleko ngo-10-30%.

Umjikelezo wokukhiqiza wezinqubo ezivamile uyizinsuku ezingu-7-10, futhi ama-oda aphuthumayo angacindezelwa abe yizinsuku ezingu-3-5, kodwa izindleko zikhuphuka ngo-20-30%.

Yamukela imigqa yokukhiqiza ezenzakalelayo, yenza ngcono ukugeleza kwenqubo, futhi wandise izinga lokusetshenziswa kwemishini yokubhoboza nge-laser ibe ngaphezu kuka-80%.

Umthamo wokukhiqiza wanyanga zonke womugqa owodwa wokukhiqiza ungaba ngu-5,000-10,000㎡, kuye ngokucushwa kwemishini kanye nobunzima benqubo.

Izindleko zamaqoqo amancane (1000㎡), ikakhulukazi ngenxa yokusethwa komshini kanye nokwabiwa kwezindleko ezihleliwe.

Kubalwa ngokuphelele ngendawo (yuan/㎡), inani lezendlalelo, ububanzi bembobo, njll. Imali yokucubungula ibhodi le-microvia elijwayelekile elinezendlalelo ezingu-8 elingu-0.1mm cishe liyi-yuan/㎡ engu-2000-3000.

Ngokwenza ngcono ukwakheka kwe-DFM, izidingo zokubekezelelana eziphumuzayo ngaphansi kwesisekelo sokuhlangabezana nokusebenza zinganciphisa izindleko ngaphezu kuka-15%.

Ukutshalwa kwezimali emishinini ephelele yomugqa wokukhiqiza kungaba yi-yuan eyizigidi eziyi-10-20, okuhlanganisa imishini yokubhoboza nge-laser, imigqa ye-electroplating, ama-laminator, njll.

Ukuthuthuka kube ububanzi obuncane bemigodi (izendlalelo ezingu-20), ukulahleka okuphansi, kanye nokupakishwa okuhlanganisiwe.

Kuyadingeka ukufeza ububanzi bemigodi yokuxhumanisa eqondile

Isetshenziselwa ukwenza ngcono ipharamitha yenqubo kanye nokutholwa kwesici okuhlakaniphile, okungakhulisa isivuno ngo-5-10% kanye nokusebenza kahle kokutholwa ngo-30%.

Ukukhiqizwa kwelabhorethri kobubanzi bemigodi engu-10μm sekufeziwe, kodwa ukukhiqizwa ngobuningi kubhekene nezinselele zezinto zokwakha, imishini kanye nezindleko.

Finyelela ukuxhumana okungenamthungo phakathi kwama-chip nama-PCB ngokusebenzisa ukuxhumana okunobuningi obukhulu, nciphisa izindlela zokudlulisa isignali, futhi uthuthukise ukusebenza kohlelo.

Sebenzisa izinto nezinqubo ezingangcolisi imvelo, lapho okuqukethwe kwensimbi esindayo kuphuma emanzini angcolile

Kudinga izinto ezihlala njalo ze-dielectric (Dk

Kuyadingeka ukuxazulula izinkinga zokuqhekeka kodonga lwemigodi kanye nokuxebuka kwengqimba yethusi ngesikhathi sokugoba, ngerediyasi yokugoba engu-≥3mm.

Ukufeza ukuqapha okugcwele kanye nokukhiqiza okuzenzakalelayo ngokusebenzisa amafektri edijithali, kanye nokusebenza kahle kokukhiqiza okwandiswe ngaphezu kuka-50%.

Kudinga ukulahleka okuphansi kakhulu kanye nokuxhumana okuzinzile okuphezulu, ngobubanzi bemigodi kanye nobubanzi bomugqa obulawulwa ezingeni le-submicron ukuqinisekisa ukudluliswa kwesignali ye-quantum.

Sebenzisa amabhodi e-HDI anezingqimba ezingu-6-10 anobubanzi bembobo obungu-0.075mm ukuze ufinyelele ukuhlanganiswa okuphezulu kwama-chip, amakhamera, njll., okwenza u-30-40% wezindleko zebhodi lomama lefoni ephathekayo.

Kudinga amabhodi anokulahlekelwa okuncane (Df

Kudingeka kuhlangatshezwane nokuxhumana okusheshayo kwamaprosesa amaningi, kusetshenziswe ubuchwepheshe bokubhoboza emuva ukuze kuqedwe izingcezu, kanye nokubambezeleka kokudluliselwa kwesignali

Phatha isitifiketi se-AEC-Q100, izinga lokumelana nokushisa -40℃ ~ 125℃, bese uphasa isivivinyo sokufafaza usawoti samahora ayi-1000.