Inqubo yokulungisa i-PCBA

Inqubo yokulungisa kabusha i-PCBA (Printed Circuit Board Assembly) inqubo yokuthola amaphutha ezindaweni lapho kukhona ukushibilika okubi noma ukwehluleka kokusebenza, ukususa izingxenye ezinephutha, kanye nokulungisa kabusha izingxenye ezifanelekile. Izibalo zibonisa ukuthi cishe u-5%-15% we-PCBA udinga ukulungiswa kabusha ngesikhathi sokukhiqizwa komkhiqizo we-elekthronikhi.

Ukulungiswa kabusha kulungisa izinkinga ezifana nokukhubazeka kokushisela kanye nokwehluleka kwezingxenye ngesikhathi sokukhiqiza, lapho umkhiqizo olungisiwe udinga ukuhlangabezana nezindinganiso zokukhiqiza zokuqala; ukulungiswa kulungisa amaphutha abangelwa ukuguga, ukusetshenziswa okungafanele, njll., emikhiqizweni esevele isetshenzisiwe. Izinga elihle kakhulu embonini ukulawula izinga lokukhubazeka kabusha ngaphakathi kuka-3%.

Inqubo evamile yile: ukutholwa kwamaphutha → indawo yesici → ukususwa kwengxenye → ukuhlanza amaphedi → ukushiswa kwengxenye entsha → ukuhlolwa nokuqinisekiswa. Phakathi kwazo, ukususwa kwengxenye kanye nokushiswa kwengxenye kubalwa u-60%-70% wesikhathi senqubo iyonke.

Ngisho nasemigqeni yokukhiqiza ye-SMT ethuthukisiwe, kusenezinga lokukhubazeka kokugoqa elingu-0.1%-1% (njengokugoqa okubandayo kanye nokubopha). Ukulungisa kabusha kungathuthukisa amazinga okufaneleka komkhiqizo, kunciphise izindleko zokukhiqiza, futhi kugweme ukulahla ibhodi lonke.

Kungathuthukisa isivuno somkhiqizo esidlula kuqala, kunciphise izindleko zokukhiqiza, kuqinisekiswe ikhwalithi yomkhiqizo kanye nokuthembeka, futhi kunciphise izindleko zokulungisa ngemva kokuthengisa. Izifundo zibonisa ukuthi izinqubo ezinhle zokulungisa kabusha zingakhulisa ukuthembeka komkhiqizo ngo-20%-30%.

Ikakhulukazi ifaka phakathi iziteshi zokuvuselela umoya oshisayo, iziteshi zokuvuselela ze-infrared, iziteshi zokuvuselela ze-BGA, amaphampu okususa ukunamathela, ama-microscope, njll. Phakathi kwazo, iziteshi zokuvuselela ze-BGA zinokunemba kokulawula izinga lokushisa okungu-±1℃, okulungele ukuvuselela izingxenye ze-BGA ngokunemba okuphezulu.

Ikhiqiza umoya oshisayo ngepayipi lokushisa, bese ivuthela umoya oshisayo ezingxenyeni ezizophinde zilungiswe nge-nozzle, incibilikise i-solder ukuze kufezwe ukususwa noma ukushiswa. Izinga lokushisa lomoya oshisayo ngokuvamile lilungiseka kusukela ku-200-450℃, ngesivinini somoya esingu-5-50L/min.

Iziteshi zokuvuselela ze-BGA zinemisebenzi yokulawula izinga lokushisa ezimele yezindawo eziningi zokushisa, okuvumela ukulawula ijika lokushisa eliyinkimbinkimbi, elifanele amadivayisi apakishiwe njenge-BGA ne-CSP; iziteshi zokuvuselela umoya oshisayo ezivamile zisetshenziswa kakhulu kumaphakheji avamile njenge-QFP ne-SOP. Intengo yesiteshi sokuvuselela se-BGA cishe iphindwe kathathu-kahlanu kunesiteshi sokuvuselela umoya oshisayo esivamile.

Zihlukaniswe ngamaphampu okususa i-soldering ngesandla, amaphampu kagesi okususa i-soldering, kanye nezibhamu zokususa i-vacuum. Amaphampu okususa i-soldering ngesandla afanele ukususa inani elincane lamajoyinti okusoldering, amaphampu kagesi okususa i-soldering asebenza kahle kakhulu, kanti izibhamu zokususa i-soldering zifanele izingxenye ezinamaphini amaningi. Amaphampu kagesi okususa i-soldering asusa i-solder ngokushesha okuphindwe ka-3-5 kunalawo asetshenziswa ngesandla.

Kumadivayisi amancane apakishiwe njenge-0201 kanye ne-01005, kudingeka imakroskopu enokukhulisa izikhathi ezingama-50-100; kumadivayisi ajwayelekile apakishiwe, ukukhulisa izikhathi eziyi-10-30 kwanele. Amamakroskopu anokukhulisa okuphezulu abiza cishe izikhathi eziphindwe kabili-kathathu kunalawo anokukhulisa okuphansi.

Setha ngokwephakheji yezingxenye kanye nohlobo lwe-solder. Ku-solder ye-Sn63Pb37, izinga lokushisa lokususa ngokuvamile lingu-350-380℃, kanti izinga lokushisa lokunamathisela lingu-320-350℃; ku-solder engenalo i-lead (njenge-SAC305), izinga lokushisa lokususa lingu-380-420℃, kanti izinga lokushisa lokunamathisela lingu-350-380℃. Izinga lokushisa eliphakeme kakhulu lilimaza kalula izingxenye, kanti izinga lokushisa eliphansi kakhulu livimbela i-solder ukuthi incibilike.

Ngokuvamile kufaka phakathi indawo yokushisa kusengaphambili (izinga lokushisa 1-3℃/s, izinga lokushisa 120-150℃), indawo yokucwilisa (150-180℃, 60-120s), indawo yokugeleza kabusha (izinga lokushisa eliphakeme 217-235℃, eligcinwa imizuzu engu-30-60), kanye nendawo yokupholisa (izinga lokupholisa 2-4℃/s). Ukusetha okungalungile kwejika lokushisa kungabangela izinkinga ezifana nokushiswa kwe-BGA okubandayo kanye nokuqhekeka kwebhola le-solder.

Isivinini somoya esiphezulu kakhulu singasusa izingxenye ezincane noma sibangele ukuchitheka kwe-solder; isivinini somoya esiphansi kakhulu sibangela ukudluliselwa kokushisa okunganele. Ngokuvamile, isivinini somoya samaphakheji angu-0402 nangaphezulu sibekwe ku-10-20L/min, kanti ku-0201 nangaphansi, singu-5-10L/min.

Kunconywa ukuthi isikhathi sokunamathisela i-solder ye-solder eyodwa singadluli imizuzwana emi-3, kanti ukunamathisela okuqhubekayo akudluli imizuzwana eyi-10. Isikhathi eside kakhulu sokunamathisela i-solder sandisa ingozi yokuthi i-PCB ikhiphe i-copper foil ngo-30% kanye namathuba okulimala kwengxenye ngo-25%.

Lungisa ngokosayizi we-PCBA kanye nobuningi bezingxenye, ngokuvamile ngobuningi bamandla obungu-1-3W/cm². Amandla aphezulu kakhulu angabangela ukushisa ngokweqile kanye nokuguquguquka kwe-PCB, kuyilapho amandla aphansi kakhulu eholela ekusebenzeni kahle kokushisa okuphansi.

Sebenzisa isiteshi sokuvuselela umoya oshisayo, uqondise umlomo wezipikili, ufudumale ku-350-380℃ ngesivinini somoya esingu-15-20L/min, bese ususa ingxenye ngama-tweezers ngemva kokuba i-solder incibilikile. Ngemva kokususa, hlanza ama-pad ngentambo yokususa i-soldering.

Okokuqala, setha ijika lokushisa elifanele. Ngemva kokuba amabhola e-solder esencibilikile ngokuphelele, susa i-BGA ngokucophelela ngepeni lokumunca i-vacuum; hlanza i-solder esele kuma-pad bese uphinda usebenzise i-solder paste. Izinga lempumelelo lokususwa kwe-BGA lingu-85% ngenxa yokufana kwejika lokushisa.

Qopha isiqondiso se-polarity sengxenye ukuze ugweme ukufakwa okuphambene; naka ukushisa okufanayo ngesikhathi sokususwa ukuze uvimbele ukuqhuma kwengxenye ngenxa yokushisa ngokweqile kwendawo. Ukufakwa kwe-polarity okungalungile kwandisa izinga lokwehluleka komkhiqizo ngo-40%.

Ezimweni ezinjalo, ukuhlolwa kwe-X-ray kuyadingeka ukuze kutholakale izindawo zejoyinti le-solder, futhi kusetshenziswa izindlela zokushisa zasendaweni (njengokushisa nge-laser) ukuze kususwe. Kunzima impela, ngesilinganiso sempumelelo esingu-60%-70% kuphela.

Lawula izinga lokushisa nesikhathi sokushisa, futhi ugweme ukufudumala okuphindaphindiwe endaweni efanayo; sebenzisa amathuluzi afanele, njengokusebenzisa i-pry bar ukusiza ekususeni izingxenye ezinkulu ukuze unciphise ukudonsa i-PCB. Ukusebenza kahle kunganciphisa izinga lokulimala kwe-PCB ngo-50%.

Hlanza i-solder esele kuma-pad usebenzisa i-desoldering wick nge-soldering iron: cwilisa i-wick ekujuleni, uyibeke phezu kwe-pad, bese uyifudumeza nge-iron ukuze umunce i-solder. Qondanisa ububanzi be-wick ne-pad ukuze ugweme ukuhlanza ngokweqile noma okunganele.

Hlanza ungqimba oluxutshwe kahle ngephepha elincane le-sandpaper, ufake i-flux, bese ufudumala ukuze ubuyisele ukunamathela. Ama-pads axutshwe kahle angaphathwa angabangela izinga lokukhubazeka kwe-soldering elingu-80%.

Ukuze uthole ukuhlukanisa okuyingxenye, sebenzisa izintambo ze-jumper; ukuze uthole ukuhlukanisa okuphelele, lungisa kabusha iphedi (i-copper plating, i-solder mask coating) bese uhlola ukusebenza kukagesi ngemva kokulungiswa.

Sebenzisa isihloko sensimbi yokunamathisela esime njenge-chisel ukuze ulinganise i-solder eyengeziwe, bese ufaka isihlabathi uma kudingeka. Iphutha lokuba yisicaba kumele libe ngaphakathi kuka-±0.05mm ukuze ugweme izinkinga zokunamathisela.

Yebo. Sebenzisa i-ethanol engamanzi noma izinto zokuhlanza ezikhethekile ukususa ukugeleza okusele kanye nokungcola, ugweme ukwanda okungu-20% kweziphambeko zokunamathela kanye nokugqwala kwe-PCB.

Hlola imininingwane yezingxenye, faka ama-pads, bese ulungisa amathuluzi afanele bese ushintshashintsha. Ukulungiselela okunganele kungabangela izinga lokushintsha elingu-30%.

Sebenzisa i-microscope kanye nesiteshi sokuvuselela umoya oshisayo noma insimbi yokunamathisela ecijile. Lungisa iphini elilodwa kuqala, bese unamathisela okusele ukuqinisekisa ukuthi indawo ibekwe kahle.

Sebenzisa i-X-ray ukuhlola ukuxhumana kwebhola le-solder (izinga elingenalutho ≤5%) kanye ne-multimeter ukuze kuqhubeke ugesi. I-X-ray ithola amaphutha angaphezu kuka-90%.

Lungisa izingxenye nge-glue noma i-flux ngaphambi kokunamathisela nge-solder, bese ushisa ngokulinganayo ukuze ugweme ukucindezeleka kokushisa. Ukushintshashintsha kubanga u-15%-20% weziphambeko zokunamathisela nge-solder.

Ama-lead ethusi ayakwazi ukushintshwa kalula; ama-lead ensimbi adinga ukushintshwa ngaphambi kwesikhathi; ama-lead e-alloy adinga ukushintshwa okufanayo. Ama-lead ensimbi angalungiswa anezinga lokukhubazeka elingu-70%.

Kufaka phakathi ukuhlolwa okubonakalayo, ukuhlolwa kokusebenza kukagesi (ukuqhubeka, ukumelana nokushisa), kanye nokuhlolwa kokusebenza. Ukuhlolwa okubonakalayo kuthola amaphutha asobala angama-70%-80%.

Hlola ukuthi amalunga e-solder agcwele, abushelelezi ngaphandle kokugoqa okubandayo, ukubopha, noma ama-icicle; qiniseka ukuthi ama-lead ahlanganiswe ngokuphelele futhi awalimalanga. Kudingeka ukuhambisana nezindinganiso ze-IPC-A-610.

Ithola ikhwalithi yangaphakathi ye-solder joint yezingxenye ze-BGA/CSP, ihlonza i-cold soldering, amabhola e-solder aqhekekile, kanye nezikhala, ngesilinganiso sokutholwa kwamaphutha angaphezu kuka-95% wezinkinga zangaphakathi.

Ihlola ukusebenza kukagesi ngokusebenzisa izinto zokubopha izinzipho, ithole izinkinga zama-shorts, ama-open, kanye ne-component parameter, ihlanganisa u-80%-90% wokuxhumeka kukagesi.

Hlanganisa i-PCBA ohlelweni ukuze ulingise izimo zokusebenza zangempela futhi uhlole ukusebenza, uthole u-90% wokwehluleka kokusebenza okubangelwa ukushisela.

Izimbangela: ama-pad angahlanzekile, izinga lokushisa elanele, ukugeleza okungasebenzi kahle. Izixazululo: hlanza kabusha ama-pad, lungisa izinga lokushisa/isikhathi, bese ushintsha ukugeleza ngezinketho zekhwalithi ephezulu.

Susa i-solder eningi ngentambo/insimbi esusa ukunamathela, lungisa izinga lokushisa lokunamathela kanye nesivinini somoya ukuze uvimbele ukuchitheka. Ukuphathwa kahle kufinyelela izinga lokulungisa elingu-95%.

Izimbangela ezingaba khona: umonakalo wezingxenye, ukushisa ngokweqile ngesikhathi sokushiswa kwensimbi, i-reverse polarity. Izibalo zibonisa ukuthi umonakalo wezingxenye ungaba ngu-40%, ukushisa ngokweqile kungu-30%.

Lungisa ukuguquguquka okuncane ngokushisa; shintsha ama-PCB uma kwenzeka ukuguquguquka okukhulu. Ukulawula izinga lokushisa/isikhathi kunciphisa izinga lokuguquguquka ngo-60%.

Sebenzisa amabhentshi okusebenzela aphephile e-ESD, izintambo zesandla, kanye nama-tweezers; gcina umswakama we-RH ongu-40%-60% ukuze unciphise umonakalo we-ESD ngo-90%.

Abasebenzi kumele bagqoke izibuko/amagilavu ​​​​okuzivikela ukuze bavimbele ukusha; imishini ephansi ukuze bagweme ukushaqeka kukagesi; maka imishini eshisa kakhulu ngezimpawu zesixwayiso.

Izingxenye zemfucuza, i-solder, kanye ne-flux kuyimfucuza eyingozi, edinga ukulahlwa ngamayunithi afanelekayo; amanzi angcolile okuhlanza kumele ahlangabezane nezindinganiso zokukhishwa kwe-GB 8978.

Iningi lama-flux liyavutha futhi kufanele ligcinwe ezindaweni ezipholile, ezinomoya opholile kude nemithombo yomlilo; gwema ukuthintana kwesikhumba/namehlo bese ugeza ngamanzi ngokushesha uma kuvezwa.

Hlanza njalo izinsalela ze-solder bese uphuma emishinini; faka isivikelo sokushisa ngokweqile ukuze ucime ngokuzenzakalelayo lapho imikhawulo yokushisa idluliwe.

Kumelwe ulandele imiyalelo ye-RoHS, unciphise izinto eziyingozi njenge-lead/mercury/cadmium, unciphise ukuguquguquka kwe-flux, futhi usebenzise izinto zokuhlanza ezinobungani nemvelo.

Lungiselela izinqubo, yamukela imishini ezenzakalelayo, futhi uqeqeshe abaqhubi. Imishini ezenzakalelayo ingandisa ukusebenza kahle ngo-30%-50%.

Nciphisa ukuvuselelwa kwesibili ngenxa yokusebenza okungafanele, khetha amathuluzi/izinto zokwakha ngendlela efanele, futhi uthuthukise izinqubo ukuze wehlise amazinga okuqala okukhubazeka. Ukuvuselelwa kwesibili kubalwa u-25%-35% wezindleko eziphelele.

Lungiselela amapharamitha enqubo, khetha i-flux/solder efanele, futhi uqinise ukuhlolwa kwesihloko sokuqala kanye nokusampula kwenqubo. Ukuthuthukiswa kwenqubo kunganciphisa amazinga okukhubazeka ngo-40%-60%.

Kuthuthukisa ukuzinza kwekhwalithi, kunciphisa amaphutha abantu, kusiza ukuqeqeshwa kwabasebenzi abasha, futhi kuthuthukisa ukusebenza kahle. Ukulinganisa kunganciphisa ukuguquguquka kwezinga lamaphutha ngo-50%.

Yenza izivivinyo zokuguga (amahora angu-24-100) kanye nezivivinyo zemvelo (izinga lokushisa eliphezulu/umswakama/ukudlidliza) emikhiqizweni ephinde yasetshenziswa ukuze uhlole ukuthembeka kwesikhathi eside.

Kuyadingeka ukucabangela izidingo zokulungisa kabusha izingxenye ze-SMT kanye ne-THT. Lapho kususwa izingxenye ze-THT, kufanele kuqashelwe umthelela kumadivayisi e-SMT. Ubunzima bokulungisa kabusha buphakeme ngo-30%-50% kunobobhodi be-SMT emsulwa.

Izinto zokwakha zithambile futhi kulula ukuzishintsha, ngakho-ke kudingeka izinto ezikhethekile zokulungisa; izinga lokushisa lokushisa kufanele libe ngaphansi kuka-10-20℃ kunele-PCB eqinile ukuze kugwenywe ukulimaza i-substrate.

Isekethe yangaphakathi iyinkimbinkimbi, futhi ukudluliselwa kokushisa akungalingani ngesikhathi sokushisa, okuvame ukubangela isekethe esifushane noma isekethe evulekile yesendlalelo sangaphakathi; ukulungiswa kwephedi kunzima, futhi izinga lempumelelo lokulungisa kabusha lingu-50%-60% kuphela.

Susa isembozo sokuvikela kuqala bese uvikela izingxenye zangaphakathi. Sifake kabusha ngemva kokulungiswa kabusha ukuqinisekisa umphumela wokuvikela. Ukusebenza okungalungile kuzothinta ukuhambisana kwe-electromagnetic.

Ine-conductivity enhle yokushisa kanye nokuqhekeka okuphezulu. Idinga ukushisa okusheshayo ukuze igweme ukuqhekeka okubangelwa ukugcwala kokucindezeleka kwendawo, futhi izinga lokushisa kungcono lilawulwe ku-5-10℃/s.

Kudingeka babe nekhono elihle lokubona izingxenye, ubuchwepheshe bokushisela, ukusebenza kwemishini, kanye nokuhlaziywa kwamaphutha, futhi bajwayelane nezindinganiso ezifana ne-IPC-A-61. Izinga lamaphutha labasebenzi abaqeqeshwe ngobuchwepheshe liphansi ngo-40% kunelabaqalayo.

Kuhlanganisa ukuqeqeshwa kwethiyori (ulwazi lwenqubo, imininingwane ejwayelekile) kanye nokuqeqeshwa okusebenzayo (ukusebenza kwemishini, umkhuba wokushisela), kanye nokuhlolwa ngemva kokuqeqeshwa, futhi umjikelezo ngokuvamile uthatha amasonto angu-1-2.

Kuhlanganisa imiyalelo yenqubo yokulungisa kabusha, izincwadi zokusebenza kwemishini, amazinga okuhlola ikhwalithi, amarekhodi okulungisa kabusha, njll., okungathuthukisa ukulandelelwa kanye nokusebenza kahle kokuhlaziya izinkinga.

Setha izindawo zokulawula ezibalulekile (njengokususa izingxenye, ukuhlanza amaphedi, ukushisela, njll.), bese wenza ukuhlolwa kokuqala, ukuhlolwa kokuqapha kanye nokuhlolwa komkhiqizo oqediwe, okunganciphisa izinga lokukhubazeka ngo-30%-40%.

Qoqa idatha yokulungisa kabusha ukuze uhlaziye izinkinga, wenze izivivinyo zenqubo ukuze uthuthukise amapharamitha, futhi wethule ubuchwepheshe obusha nemishini, okungakhuphula ukusebenza kahle ngo-10%-15% minyaka yonke.

Khetha ngokuya ngohlobo lokuqala lwe-PCBA solder, nikeza kuqala imikhiqizo enokwakheka okufanayo, bese ucabangela ukusebenza okufana nendawo yokuncibilika, ukumanzisa, kanye nokuthembeka.

Zihlukaniswe nge-flux engahlanzekile, i-flux encibilikayo emanzini kanye ne-flux esekelwe ku-rosin. I-flux engahlanzekile ifaneleka ngezikhathi ezinezidingo eziphansi zokuhlanzeka, kanti i-flux encibilikayo emanzini ilungele ukuhlanzwa kodwa okusele kufanele kuqashelwe.

Isetshenziselwa ukulungisa izingxenye ezincane noma ukuvimbela ukugudluka ngesikhathi sokushisela, futhi idinga ukuba namandla amahle okubopha (≥5N/mm²) kanye nokumelana nokushisa.

Khetha ngokwezinhlobo zokushintshashintsha (njenge-isopropyl alcohol ye-rosin-based), bese ucabangela ukuvikelwa kwemvelo, ukugqwala kanye nokuguquguquka.

Kuyadingeka ukuhlola imodeli, imininingwane, ukubukeka, ukusebenza kukagesi, njll. ukuqinisekisa ukuvumelana nezingxenye zokuqala. Izinto ezingenayo kahle zizokwandisa izinga lokwehluleka kokulungiswa kabusha ngo-20%.

Hlanza ukungcola okungaphakathi kwe-nozzle yomoya ukuze uvimbele ukuvaleka, hlola isimo se-heating tube bese ulinganisa izinga lokushisa njalo, bese uthambisa izingxenye zemishini. Ukuvaleka kwe-nozzle yomoya kuzokwandisa izinga lokukhubazeka kokushisela cishe ngo-15%.

Izinga lokushisa lilinganiswa kanye ngenyanga (iphutha ≤±1℃), kanti ukuphakama kwe-Z-axis kulinganiswa kanye ngekota (ukunemba ≤±0.05mm). Okungalinganiswanga kungandisa izinga lokungasebenzi kwe-welding ngo-20%.

Ukumunca okunganele: shintsha indandatho yokuvala ukuze uthole ipompo yokususa i-solder ngesandla, hlola ipompo ye-vacuum noma uhlanze indawo evalekile ukuze uthole ipompo kagesi yokususa i-solder; awukwazi ukususa i-solder: hlola ukuthi umlomo wombhobho wonakele noma uvaliwe, shintsha bese uhlanza i-solder esele.

Ngokuvamile, ishintshwa njalo eminyakeni eyi-1-2 ngokuya ngemvamisa yokusetshenziswa. Ngemva kokuguga, ukufana kwezinga lokushisa kuyehla, futhi izinga lokukhubazeka kokushisela likhuphuka cishe ngo-12%.

Hlanza ilensi njalo ngephepha lelensi elikhethekile, gwema ukushayisana ukuze uvimbele ukufuduka kwezingxenye ze-optical, futhi ulinganise ubude be-focal minyaka yonke ukuqinisekisa ukuthi izithombe zicacile.

Okokuqala sebenzisa izinyibilikisi zamakhemikhali (njenge-acetone) ukuze uncibilikise izinto ezifakwe esikhumbeni, ulungise kabusha ngokwenqubo evamile ngemva kokususwa, bese uphinda uzifake esikhumbeni ngemva kokuqeda, unake ukugeleza kanye nezimo zokuphola kwezinto.

Kubaluleke kakhulu ukususa izingxenye ezinkulu nezikhiqiza ukushisa okuphezulu ukuze kugwenywe ukuthinta izingxenye ezilungisiwe; landela isimiso kusukela kokulula kuya kokunzima ukunciphisa izingozi.

Kudingeka imishini ekhethekile (njengesiteshi sokulungisa kabusha i-flip chip) futhi kusetshenziswa ubuchwepheshe bokushisa nge-laser noma bokushisela nge-ultrasonic. Amapharamitha anqunywa ngokuhlolwa kwangaphambi kwesikhathi, futhi izinga lempumelelo livame ukuba ngu-60%-70%.

Sebenzisa i-multimeter ukuhlola ukuqhubeka ukuze uthole iphuzu lesifunda esifushane, bese uhlola futhi uxazulule izinkinga ezifana nokubopha izinsalela ze-solder, ukungalingani kwephini yezingxenye, kanye nomonakalo wesifunda se-PCB.

Hlola ukuthi isisekelo silungile yini nokuthi isembozo sokuvikela sifakiwe yini endaweni yaso, hlola ukuthi umugqa wesignali wonakele yini ngesikhathi sokushisela, sebenzisa i-spectrum analyzer ukuthola umthombo wokuphazamiseka, bese uthatha izinyathelo ezifana nokuvikela nokuhlunga.

Hlaziya idatha yokushintsha ngokusebenzisa ukufunda komshini ukuze ubikezele amaphutha, sebenzisa ukubonwa kokubona ukuze uthole ngokuzenzakalelayo izingxenye ezinephutha, futhi ulungise ngokuhlakanipha amapharamitha emishini ukuze uthuthukise ukusebenza kahle kanye nekhwalithi.

Izothuthukela ekuhlanganisweni okunembe kakhulu kanye nemisebenzi eminingi (njengokuhlanganisa ukuhlolwa kwe-X-ray, ukutshala ibhola okuzenzakalelayo, ukushisela, njll.), futhi ikwazi ukuxhumana nohlelo lwe-MES ukuze kuthuthukiswe ukuphathwa okuhlakaniphile.

Khuthaza izinto zokuhlanza nezokusebenzisa ugesi ezingangcolisi imvelo, uthuthukise imishini engasetshenziswa kakhulu, futhi uhlole ubuchwepheshe bokuvuselela obungabhubhisi ukunciphisa ukungcola kanye nokungcola kwezinsiza.

Ingakha ngokushesha izinto zokwakha kabusha ukuze inciphise izindleko, futhi isetshenziselwa ukulungisa umonakalo wendawo we-PCB (njengemigqa yokuqhuba yokuphrinta) ukuze kube lula izinqubo eziyinkimbinkimbi.

Ukulawula kwedijithali kanye nokuqapha kude imishini yokuvuselela, ukwenza ngcono izinqubo ngokuhlaziya idatha enkulu, kanye nokusungula izinhlelo zokulandelela umkhiqizo kabusha ukuze kuthuthukiswe ukulawulwa kwekhwalithi.