I-PCB yethusi ejiyile

Kubhekisela kumabhodi wesekethe aphrintiwe anobukhulu be-foil yethusi obungu-≥3oz (105μm), asetshenziswa ezimpahleni zamandla amakhulu, kuma-elekthronikhi ezimoto, njll.

Imininingwane evamile ifaka phakathi u-3oz, 4oz, 5oz, 6oz, kanye no-20oz.

Izindleko zokukhiqiza ziphakeme ngo-30%-80% ngenxa yokugcaba okunzima, isikhathi eside sokufaka ama-electroplating, kanye nesilinganiso esiphezulu se-scrap.

Ku-foil yethusi engu-3oz, evamile ingu-8mil/8mil, kanti izinqubo ezikhethekile zingafinyelela ku-5mil/5mil.

Kudinga ukufakwa isikhathi eside ukuqinisekisa ukufana kwesendlalelo sethusi. Ubukhulu bethusi bembobo budinga ukufinyelela ku-25-75μm, futhi umehluko wobukhulu phakathi kwezikhala zembobo nezindonga uvame ukwenzeka.

Ngokuvamile 0.8-1.2, okungandiswa kube ngaphezu kuka-1.5 ngokusika ngesinyathelo noma ngokwakhiwa nge-laser.

Khulisa ama-vias okusatshalaliswa kokushisa (imbobo ≥0.4mm), sebenzisa izinto zokuhambisa ukushisa ezisekelwe ensimbini, bese uklama izendlalelo ze-foil yethusi endaweni enkulu.

Ku-foil yethusi engu-1oz, amandla okuphatha ugesi wezintambo ezihlangothini olulodwa ekukhuphukeni kwezinga lokushisa elingu-10℃ angaba ngu-1A/mm, kanti u-3oz ungandiswa ube ngu-2.5-3A/mm.

Uma i-foil yethusi ijiyile, kulapho ukuguquguquka kwayo kuba kubi khona. Akukhuthazwa ukugoba ngaphezu kwama-6oz, kanti irediyasi yokugoba encane yama-3oz ingu-≥5mm.

Umkhawulo wobubanzi bomugqa ≥20%, umgodi omncane ≥0.3mm, ukujiya kwethusi lembobo ≥25μm, kanye nokwandisa ubuningi bamaphuzu okuhlola.

Ijubane lokujikeleza liphansi ngo-20%-30% kunele-PCB evamile (cishe ama-revolution angu-60,000-80,000 ngomzuzu), kanti izinga lokuphakelayo lingu-0.02-0.04mm/rev.

I-ENIG ifanelekela amasignali asebenzisa imvamisa ephezulu. I-OSP inezindleko eziphansi kodwa ukumelana nokushiswa kwe-oxidation okubuthakathaka. I-hard gold plating ifanelekela izixhumi ezixhuma kakhulu.

Kubhendi yemvamisa ye-10GHz, ukulahleka kwesiginali kwe-foil yethusi engu-6oz kuphakeme cishe ngo-1.5dB/intshi kunokwe-1oz.

Umklamo wefoyili yethusi olinganayo, izinga lokushisa le-lamination lingu-180-200℃, ingcindezi engu-100-150psi, izinga lokupholisa ≤3℃/min.

Izinga elijwayelekile le-IPC ≤12.5μm, amasignali esivinini esikhulu adinga ≤5μm, okungathuthukiswa ngokufakwa kwe-chemical copper + ukugcwalisa nge-electroplating.

Isilinganiso semboni singama-75%-85%, kanti isivuno esingaphezu kwama-6oz singase sehle ngaphansi kwama-70%.

Izimoto ezintsha zamandla (izinqwaba zokushaja, ama-inverter), izinsiza zikagesi zezimboni, izinsiza zikagesi zeseva, izindiza kanye neminye imikhakha.

Ukusetshenziswa okuvamile okungu-0.8-1.2mil, okunamandla aphezulu kudinga u-1.5-2mil, okudingeka umboze i-foil yethusi ukuze kuvinjelwe ukukhukhuleka.

Nciphisa izinqubo ezikhethekile, hlanganisa ubukhulu be-foil yethusi, wandise usayizi we-batch, futhi ugweme ama-vias amaningi angaboni/angcwatshwe.

Umthamo wokwelapha wesisombululo se-acidic copper plating cishe u-100-150Ah/L, futhi amazinga e-copper ion nama-chloride ion kudingeka ahlaziywe njalo.

Amandla okuhluba ≥1.5N/mm (1oz), ama-3oz adinga ≥2.5N/mm.

Sebenzisa i-substrate ye-Tg ephezulu (≥170℃), ingcindezi efanayo ye-lamination, bese ususa imfucumfucu ye-drill ngesikhathi esifanele ngemva kokubhoboza.

Izinga lokushisa lesisombululo sokusika i-alkaline lingu-45-55℃, amandla adonsela phansi angu-1.2-1.3, ingcindezi yokufafaza ingu-0.8-1.2MPa.

Ama-Vias kudingeka ambozwe nge-100% nge-solder mask, futhi usayizi wokuvula mkhulu ngo-0.2-0.3mm kunombhobho ukuze kuvinjelwe ukugcwala kwe-solder.

Izinguquko ekujikeni kwe-foil yethusi zibangela ukuguquguquka kwe-impedance. Kuyadingeka ukulingisa nokulungisa ububanzi bomugqa kanye nobukhulu be-dielectric ngokubekezelela okungu-±5%.

Inqubo evamile ingu-0.3mm, kanti ukubhoboza nge-laser kungafinyelela ku-0.15mm kodwa ngezindleko eziphezulu.

Kudingeka idlule ukuhlolwa kokucwiliswa kwethini okuphindwe kathathu okungu-260℃/10s ngaphandle kokuhlukaniswa kodonga lwembobo noma ukuhlutshwa kwe-copper foil.

Uma i-Ra＞3μm yobulukhuni, ukulahleka kwesiginali kukhuphuka ngo-10%-15%, futhi kudingeka i-foil yethusi (VLP) ephansi yobulukhuni.

Sebenzisa umklamo we-foil yethusi ene-mesh, wandise izindlela ze-shunt zamanje, kanye nobubanzi bomugqa wezindlela ezibalulekile ≥10mil.

Okuvamile okungu-≥4mil, i-voltage ephezulu idinga okungu-≥8mil ukuvimbela ukuqhekeka kwe-flashover.

Ubuningi bamanje obungu-0.8-1.2A/dm², ukulawulwa okunembile kokuhlushwa okungeziwe, kanye nesikhathi sokufaka i-electroplating kuphindwe izikhathi ezingu-2-3 kune-PCB evamile.

Sebenzisa ithuluzi lokulinganisa le-3D optical, eline-warpage ≤0.7% kanye ne-local deformation ≤0.1mm.

Isikhathi sokucwiliswa ≤ imizuzwana emi-3, i-engeli yokumanzisa

Lungiselela ukwakheka kwephaneli, nciphisa imfucuza yasemngceleni, bese usebenzisa ukwakheka kokwakheka kwezindawo okunobukhulu be-foil yethusi.

Ukuhlushwa kwe-ion ye-palladium kungu-0.02-0.05g/L, izinga lokushisa lingu-30-35℃, isikhathi semizuzu eyi-10-15 ukuqinisekisa ukumbozwa okufanayo kodonga lwembobo.

Ubukhulu be-dielectric obuyi-1mil bungamelana nama-V angaba ngu-500, futhi isikhala sokufakwa kokushisa kanye nesikhala se-copper foil kudingeka sakhiwe ngokwezinga le-voltage.

Umswakama wesitoreji ≤40%, izinga lokushisa ≤25℃, ukupakishwa ngesikhathi esifanele ngemva kokulungiswa kwendawo, kusetshenziswa izikhwama ezingangeni umswakama kanye nama-desiccant.

Isivinini sokusika ukugaya singu-25,000-30,000 ngomzuzu, izinga lokuphakelayo lingu-800-1200mm/min ukuvimbela ama-edge burrs.

Bhaka ku-150-160℃ imizuzu engama-60-90, ubulukhuni bube ≥2H, futhi ukunamathela kudlula ukuhlolwa okunqunyiwe.

Ububanzi bendawo ehlukanisiwe ≥20mil, gwema ama-engeli abukhali, bese uxhumanisa izendlalelo zamandla ezahlukene ngama-array.

Ubulukhuni be-Vickers ≥80HV ukuvimbela umonakalo kanye nokuguguleka kwemishini.

Inqubo ye-DES, ukuhlushwa kwe-potassium permanganate 80-100g/L, izinga lokushisa 60-70℃, isikhathi imizuzu eyi-15-20.

Sebenzisa izinto ze-dielectric eziphansi ze-Dk/Df, lawula ukujiya kwe-foil yethusi, futhi uthuthukise ukuqhubeka kwendiza yomhlabathi.

Ukufakwa kwe-Annealing ngemuva kokufakwa kwe-lamination, kugcina ku-120-150℃ amahora angu-2-3 ukuze kukhishwe ukucindezeleka.

Kudingeka imelane nokusula nge-isopropyl alcohol, i-flux, njll., ngaphandle kokuvuvukala noma ukushintsha kombala.

Isikhala esingu-≥20mil, gwema ukushisa ngokweqile, futhi ungakhetha ukwakheka kwezimbali ze-plum.

Ubuchwepheshe be-pulsed electroplating, isikhala se-anode-to-board esingu-10-15cm, futhi uhlole njalo ukuncibilika kwe-anode.

Izindleko zokubhoboza nge-laser cishe ziphindwe kathathu kuya kahlanu, kodwa ngokunemba okuphezulu kanye nokuvulwa okuncane.

Ukushisela ngesiliva kuyashesha, i-ENIG inokwethenjelwa okuphezulu, futhi i-OSP idinga ukushisela zingakapheli amahora angu-72.

Khetha i-substrate ene-CTE efana neye-foil yethusi (njenge-Tg FR-4 ephezulu ene-CTE engaba ngu-14ppm/℃) ukuze unciphise ukucindezeleka kokushisa

Izinga le-IPC lidinga ama-pores angu-≤10/cm², kanti izinhlelo zokusebenza ezinokwethenjelwa kakhulu zidinga ama-pores angu-≤5/cm², okungathuthukiswa ngokufakwa kwe-electroplating ngembobo.

Ububanzi bephedi = ububanzi bembobo + 0.6mm (okuvamile), futhi ukwanda okungu-0.1-0.2mm kuyadingeka ezimweni zethusi elijiyile ukuze kulungiswe ukuphambuka kokuqopha.

Ukumelana ne-black solder kunamandla okudonsa ukushisa, kanti izinga lokushisa lobuso liphakeme ngo-3-5℃ kune-white solder resist, kodwa akunamthelela omkhulu ekushabalaleni kokushisa okuphelele.

Ubukhulu besendlalelo se-nickel bungu-3-5μm, ubukhulu besendlalelo segolide bungu-0.05-0.1μm, isixazululo se-plating pH 4.8-5.2, izinga lokushisa lingu-85-90℃.

Kusetshenziswa inqubo yokuchoma ngamakhemikhali, lapho inani lokuchoma ngamakhemikhali lilawulwa ku-0.5-1μm, noma ukwelashwa kokugaya ngomshini.

I-voltage evamile yokuhlola ingu-1000V AC/1 minute, futhi izinhlelo zokusebenza ze-voltage ephezulu zidinga ukwenyuswa kube ngu-2000-5000V AC.

Ngaphansi kwe-foil yethusi engu-3oz, ubukhulu bezintambo obunohlangothi olulodwa bunconywa ukuthi bube ngu-≤15cm²/100cm², futhi amabhodi anezingqimba eziningi adinga ukulinganisela ubuqotho besignali kanye nomthamo wokuthwala ugesi.

Izinga lokunwebeka kufanele libe ngu-≥20% ukuqinisekisa ukuthi akukho ukuphuka ngaphansi kokucindezeleka komshini.

Amabhodi angu-±50μm (avamile), kanye namabhodi anesivinini esikhulu adinga ukuthuthukiswa abe ngu-±25μm, kusetshenziswa uhlelo lokubeka i-laser.

Kudingeka imelane nokushiswa kabusha kwe-solder ku-280℃ imizuzwana emi-5 ngaphandle kokuqhekeka noma ukuqhekeka.

Ukuhlolwa kokususa ukungcola okungu-90° kusetshenziselwa ukuqopha amandla okususa ukungcola ngobubanzi beyunithi ngayinye, ngobubanzi obujwayelekile obungu-≥1.5N/mm.

Isilinganiso sokujula kwembobo engaboni kahle nobubanzi bembobo (isilinganiso sesici) ≤3:1 ukuvimbela ukugcwaliswa kabi kwe-electroplating.

Okuqukethwe kwe-phosphorus kungqimba lwe-nickel plating olungena-electro kufanele kulawulwe ku-7%-9% ukuqinisekisa ukumelana nokugqwala.

Kusetshenziswa izisiki zokugaya ezimboziwe (njenge-TiAlN coating), kanti izisiki zokugaya zishintshwa njalo (zishintshwa njalo ngemva kwamahora angu-50-100 okucubungula).

Lawula ukuqhubeka kwe-impedance, nciphisa ngobude be-Stub, sebenzisa ukudluliselwa kwesignali ehlukile, bese wengeza ungqimba lokuvikela.

±10% (ejwayelekile), kanye nezinhlelo zokusebenza ezinembile kakhulu zidinga ukulawulwa ngaphakathi kuka-±5%.

Ukuhlolwa okusikiwe, futhi kuyafaneleka uma indawo ye-脱落 ngemva kokukhishwa kwetheyiphu ingu-≤5%.

Kusetshenziswa ukuthululwa kwethusi okufana negridi (isikhala segridi ≤10mil) ukulinganisela ukuthwala kwamandla kagesi kanye nokubuya kwesignali.

Ukucindezeleka kokucindezela ≤15MPa, ukucindezeleka kokucindezela ≤10MPa, ukuvimbela ukuguquguquka kwe-foil yethusi.

Akukho zinsalela ze-resin noma ukungcola kokubhoboza, okuqinisekiswe ukubonwa kwesigaba se-metallographic.

Ngemva kokuguga ku-85℃/85% RH amahora angu-168, umehluko wombala u-ΔE≤3.

Iphrofayili yobuso isetshenziswa ukukala inani le-Ra, kanti i-Ra yefoyili yethusi evamile ingu-≤5μm.

I-via eyodwa engu-0.5mm ingathwala cishe u-0.5-1A, futhi inani lama-via lidinga ukunqunywa ngokwesidingo samanje sangempela.

I-X-ray fluorescence spectrometer (XRF) isetshenziselwa ukukala ubukhulu besendlalelo sethusi ezindaweni ezahlukene, ngokuphambuka okungu-≤10%.

Ukubekezelela ubukhulu bohlaka ±0.1mm, ukuphambuka kwe-engeli ±0.5°.

Qondanisa ukuvimba kwe-terminal, lungisa i-trace topology, futhi unciphise ukuvimba kwe-engeli yesokudla kanye nokungaqhubeki kwe-impedance.

Ukushiswa okuncane kungalashwa ngokucheba okuncane ngamakhemikhali, kanti ukushiswa okukhulu kudinga ukwelashwa kabusha kobuso.

Ukuqina kwesikrini 25-35N/cm, ingcindezi ye-squeegee 3-5kg/cm, isivinini 30-50mm/s.

Isendlalelo samandla kanye nesendlalelo somhlaba ziseduze, izendlalelo zesignali zibekwe phakathi, futhi ukufana kobukhulu obuphakathi kuyalawulwa.

Kusetshenziswa umshini wokuhlola ubulukhuni be-micro-Vickers, lapho ibanga eliphakathi kwamaphuzu okuhlola lingu-≥0.5mm, kanye nenani elimaphakathi liyathathwa.

Kusetshenziswa ukubeka iphuzu lomaka, futhi ukuphambuka kuyatholwa futhi kubuyiselwe ngedivayisi ye-AOI.

Ngemva kokuhlikihla okungu-500 (ukucindezela okungu-500g), akukho ukuguguleka okusobala noma ukuvezwa kwethusi.

Sebenzisa izinto zesendlalelo se-buffer (njengamafilimu okunamathela okushisa) noma izikhala zokunciphisa ukucindezeleka eziklanywe ngomklamo.

Kungasetshenziswa i-resin plugging + i-surface electroplating, noma ukugcwalisa i-solder paste bese kuba yi-curing.

Indlela yokugeleza kwegesi noma ukubonwa kwe-metallographic microscope isetshenziswa ukubala inani lama-pores endaweni ngayinye.

Isivinini esiphezulu kakhulu sivame ukukhiqiza ama-burrs, kanti isivinini esiphansi kakhulu sithinta ukusebenza kahle, okudingeka kulungiswe ngokuya ngobukhulu be-foil yethusi.

Khulisa isikhala sokulandelela (umthetho ongu-≥3W), faka imigqa yesivikelo somhlabathi, bese ulungisa ukwabiwa kwezingqimba zomzila.

Ukucindezeleka okusele kuzobangela ukuguquka nokuqhekeka kwe-copper foil, kunciphisa ukuthembeka kwesikhathi eside.

Amaphutha endawo angaphrintwa kabusha ngesandla, futhi amaphutha endawo enkulu adinga ukuphrintwa kabusha futhi alungiswe.

Isikhala esingu-≥20mil, inombolo ibalwa ngokwesidingo sokuthwala ugesi, futhi zisakazwa ngokulinganayo.

Indlela ye-X-ray diffraction noma ukuhlolwa kwendandatho yokucindezeleka isetshenziselwa ukukala inani lokucindezeleka kwangaphakathi.

Ukurhabaxa okuphezulu kuzobangela ukungalingani kwe-electroplating futhi kwandise umehluko wobukhulu bethusi elimboziwe.

Ngemva kokuhlolwa kokuguga kwe-UV (amahora angu-500), akukho ukushintsha kombala noma ukushova.

Ukufakwa kwegolide eliqinile kunokuphila kokufakwa nokukhishwa okungaphezu kwezikhathi eziyi-1000, kanti inqubo yokucwiliswa kwegolide cishe iphindwe izikhathi ezingama-50-100.

Izindleko zama-vias angaboniwe nagqitshiwe ziphakeme ngo-30%-50% kunezemigodi edlulayo, futhi ukwenyuka kwezindleko kubaluleke kakhulu uma kwenzeka ithusi elijiyile.