I-AOI, i-X-ray, i-ICT, i-FCT

I-AOI imele i-Automated Optical Inspection. Isebenzisa amakhamera optical ukuthwebula izithombe ze-PCB, iziqhathanise nezithombe ezijwayelekile, futhi ithola ngokuzenzakalelayo amaphutha njengezingxenye ezingekho, izingxenye ezingalungile, i-reverse polarity, i-offset, i-bridging, njll. ngesikhathi senqubo yokubeka izingxenye, ukuqinisekisa ikhwalithi yomkhiqizo nokuthuthukisa isivuno sokukhiqiza.

I-AOI isebenzisa isimiso sokuthwebula izithombe nge-optical. Ikhanyisa i-PCB ngomthombo wokukhanya, ikhamera ithwebula isithombe, bese i-algorithm yokucubungula isithombe ikhipha izici zezingxenye. Lezi zici ziqhathaniswa nedatha yesithombe ejwayelekile efanelekile esethiwe ukuze kutholakale ukuthi kukhona yini amaphutha okubekwa kwezingxenye.

Izici ezinjengokunemba kokuthola (kufanele zihlangabezane nezidingo zokunemba kokubekwa kwezingxenye, isibonelo, ukunemba kufanele kufinyelele ku-±0.02mm lapho kutholwa izingxenye ezingu-0201), isivinini sokuthola (sihambisana nomjikelezo womugqa wokukhiqiza), imisebenzi yesofthiwe (ene-algorithms yokutholwa ecebile, ukuhlela okulula, kanye nokuhlaziywa kwedatha), kanye nokukhula (okusekela ukutholwa kwama-PCB osayizi abahlukene futhi ahambisana nezinhlobo ezahlukene zezingxenye) kudingeka kucatshangelwe.

Izinhlobo zomthombo wokukhanya ezivamile zifaka phakathi imithombo yokukhanya emhlophe, imithombo yokukhanya okubomvu, imithombo yokukhanya okuluhlaza okwesibhakabhaka, kanye nemithombo yokukhanya enesimo sendandatho. Imithombo yokukhanya emhlophe inikeza ububanzi obugcwele futhi ifanele ukutholakala okuvamile. Imithombo yokukhanya okubomvu inemiphumela emihle yokutholakala kuma-foil ethusi kanye nama-solder joints. Imithombo yokukhanya okuluhlaza okwesibhakabhaka inesimo esiphambene kakhulu nama-solder mask aluhlaza okwesibhakabhaka. Imithombo yokukhanya enesimo sendandatho inganciphisa izithunzi futhi ifanele ukutholakala kwezingxenye eziyinkimbinkimbi nama-PCB anomehluko wokuphakama.

Kuyadingeka ukuqinisekisa ukuthi ubuso be-PCB buhlanzekile ngaphandle kwezinto ezingcolisayo ezifana nothuli namabala kawoyela. Hlola ukuthi amaphuzu ophawu lokubeka i-PCB acacile futhi aphelele ukuze idivayisi ye-AOI ikwazi ukuhlonza nokuma ngokunembile. Kuma-PCB afakwe emaceleni amabili, hlukanisa ngokucacile ubuso bokuthola ukuze ugweme ukutholakala okungalungile.

Amapharamitha okuthola afaka phakathi amapharamitha okuthola isithombe (njengesikhathi sokuchayeka, inzuzo, umehluko), amapharamitha e-algorithm okuthola (njenge-threshold, ukuzwela kokuthola umphetho), kanye namapharamitha endawo yokuthola (ukuchaza izindawo zezingxenye okufanele zitholwe kanye nezindawo ezinganakwa). Ngokuvamile, ngokuya ngomklamo we-PCB, izinhlobo zezingxenye, kanye nezinqubo zokukhiqiza, amapharamitha adinga ukwenziwa ngcono ngokusebenzisa ukulungisa amaphutha kanye nokutholwa kwesilingo ukuze kufezwe imiphumela emihle kakhulu yokuthola.

I-AOI ingathola amaphutha afana nezingxenye ezingekho (izingxenye ezingabekwanga), izingxenye ezingalungile (amamodeli ezingxenye angalungile), i-polarity ebuyela emuva (i-polarity - izingxenye ezizwelayo ezine-polarity ebuyela emuva), i-component offset (isikhundla esidlula ukubekezelelana okuvunyelwe), i-solder bridging (ama-solder axhumanisa ama-pads aseduze), umonakalo wezingxenye (umonakalo wokubukeka), ukuthungwa kwezingxenye (ukuphela kwengxenye 翘起), njll.

Uma i-AOI ithola iphutha, izomaka ngokuzenzakalelayo indawo yephutha bese ithayipha bese ikhiqiza umlayezo we-alamu. Abasebenzi kudingeka bahlukanise i-PCB enephutha ngokwesaziso se-alamu, bese beyiqinisekisa ngokwengeziwe ngokuhlola okubonakalayo ngesandla noma ezinye izindlela zokuthola. Bese, lungisa noma ulahle i-PCB ngokwehlobo lephutha.

Linganisa njalo amakhamera nemithombo yokukhanya yedivayisi ye-AOI ukuqinisekisa ukutholwa kwesithombe okunembile. Lungiselela amapharamitha okuthola futhi ulungise ama-algorithms ezinhlobo ezahlukene zezingxenye kanye nemiklamo ye-PCB. Buyekeza umtapo wolwazi wezingxenye kanye nedatha yesithombe ejwayelekile ngesikhathi esifanele ukuze uzivumelanise nemikhiqizo nezinqubo ezintsha. Nikeza ukuqeqeshwa kobungcweti kwabaqhubi ukuze bathuthukise amakhono abo okwahlulela amapharamitha - ukusetha kanye nokwehluleka.

Ukulungiswa kwansuku zonke kuhlanganisa ukuhlanza indawo yedivayisi, amalensi, kanye nemithombo yokukhanya ukuze kuvinjelwe uthuli ukuthi lungathinti ikhwalithi yesithombe. Hlola njalo isimo sokusebenza kwezingxenye zemishini zedivayisi (njengezinsika zokuqondisa nezikulufo ze-lead), zigcobe bese uzibopha. Hlola ukuxhumana kukagesi. Yenza njalo ukuhlolwa kokusebenza kanye nokulinganisa kudivayisi ukuqinisekisa ukusebenza okuzinzile kokutholwa.

Izinzuzo isivinini sokuthola okusheshayo, esingasetshenziselwa ukuthola ngesikhathi sangempela ku-inthanethi; izindleko eziphansi kakhulu; kanye nekhono lokubona ngokubonakalayo ukubukeka kwezingxenye kanye neziphambeko zomphezulu. Iziphambeko ukuthi ayikwazi ukubona iziphambeko zamajoyinti e-solder afihliwe (njengejoyinti yangaphakathi ye-solder ye-BGA ne-CSP), futhi inekhono lokuthola elilinganiselwe leziphambeko ezincane (njengezimbobo ezincane kune-50μm). Ukuhlolwa kwe-X - Ray kungabona iziphambeko zangaphakathi, kodwa kuhamba kancane futhi kuyabiza.

Imisebenzi eyinhloko yesofthiwe ye-AOI ihlanganisa ukutholwa nokucubungula izithombe, ukuhlela uhlelo lokuhlola (ukuchaza indawo yokuhlola, ukubeka amapharamitha okuhlola, ukukhetha ama-algorithm okuhlola), ukuqashelwa kwamaphutha kanye nokuhlukaniswa, ukuboniswa nokuqoshwa kwemiphumela yokuhlola, ukuhlaziywa kwedatha kanye nezibalo (ukukhiqiza imibiko yenzuzo, amashadi okusabalalisa amaphutha, njll.), kanye nokusebenzisana kwedatha neminye imishini yomugqa wokukhiqiza (njengemishini yokukhetha nokubeka kanye neziteshi zokulungisa).

Izizathu zifaka phakathi ukusetha okungafanele kwamapharamitha okuthola (njengemingcele ephezulu kakhulu noma ephansi kakhulu), ukuqashelwa kwesithombe okungalungile okubangelwa ukubonakaliswa kobuso bezingxenye noma umehluko wombala, ukuphazamiseka okuvela kumabala noma izinto zangaphandle ebusweni be-PCB, ukungcoliswa kwelensi yedivayisi ye-AOI noma umthombo wokukhanya, kanye nokuphambuka phakathi kwezithombe ezijwayelekile kulabhulali yezingxenye kanye nezingxenye zangempela.

Lungisa kabusha amapharamitha okuthola bese wenza ngcono umkhawulo kanye nokuzwela ngokuthola ukuhlolwa. Hlanza ubuso be-PCB ukuze ususe amabala nezinto zakwamanye amazwe. Hlanza noma ushintshe amalensi angcolile kanye nemithombo yokukhanya. Buyekeza izithombe ezijwayelekile kulabhulali yezingxenye ukuqinisekisa ukuvumelana nezingxenye zangempela. Sebenzisa ama-algorithm amaningi okuthola ukuze ahambisane futhi unciphise ukulinganiselwa kwe-algorithm eyodwa.

Amadivayisi e-AOI anamuhla avame ukuba nokuguquguquka okuhle. Indawo yokuhlola kanye namapharamitha kungalungiswa ngezilungiselelo zesofthiwe ukuze kuvumelane nama-PCB anobukhulu obuhlukene. Ngezinhlobo ezahlukene zama-PCB (njengamabhodi aqinile, amabhodi aguquguqukayo, amabhodi aqinile - aguquguqukayo), uma nje esengaphakathi kwamandla okuthola idivayisi, ukutholwa okuphumelelayo kungatholakala ngokulungisa izinqubo zokuthola kanye namapharamitha ahambisanayo.

I-AOI ngokuvamile ifakwa ngemva komshini wokukhetha nokubeka kanye nangaphambi kokugoqa kabusha, ukuze kutholakale amaphutha okubekwa kwezingxenye ngesikhathi esifanele futhi kuvinjelwe imikhiqizo enephutha ukuthi ingangeni enkambisweni yokugoqa kabusha, kunciphisa izindleko zokulungisa kabusha. Ingafakwa futhi ngemva kokugoqa kabusha ukuze kutholakale ikhwalithi yokugoqa, kodwa uma kutholakala izinkinga ngalesi sikhathi, ubunzima kanye nezindleko zokulungisa kabusha kuzokhula.

Ngokuhlaziya idatha yokuthola i-AOI, bala amazinga okwenzeka kanye nokusatshalaliswa kwamaphutha ahlukahlukene ukuze uthole izixhumanisi ezibuthakathaka enqubweni yokukhiqiza. Isibonelo, uma iphutha elihlanganisiwe lohlobo oluthile lwengxenye livela njalo, amapharamitha okubekwa komshini wokukhetha nokubeka angalungiswa. Uma kunezinkinga eziningi zokubopha, inqubo yokuphrinta i-solder paste noma iphrofayili yokushisa ye-reflow soldering ingalungiswa.

Ukuhlolwa kwe-X-ray kusebenzisa i-X-ray ukungena kwi-PCB kanye nezingxenye. Ngokusekelwe kumazinga ahlukene okumuncwa kwezinto ezahlukahlukene kuya ku-X-ray, i-grayscale - kwakheka izithombe ezahlukene, ngaleyo ndlela kutholwa amaphutha angaphakathi ekubekweni kwe-PCB, njengezikhala, ukunamathela okubandayo, kanye nokungamanzi emajoyintini okunamathela ezingxenyeni ezipakishiwe njenge-BGA ne-CSP, kanye nezakhiwo zangaphakathi ezingavamile zezingxenye nezinto zakwamanye amazwe, okuqinisekisa ikhwalithi yomkhiqizo kanye nokuthembeka.

Imisebe ye-X iyakwazi ukungena. Uma imisebe ye-X ikhanyisa i-PCB, ngenxa yamandla ahlukene okumunca kwezinto ezahlukahlukene kwi-PCB (njengethusi, i-solder, ukupakishwa kwepulasitiki, njll.) kuya kuma-X - imisebe, ukuqina kwemisebe ye-X ngemva kokudlula kwi-PCB kuyahlukahluka. I-detector ithola le misebe ye-X enamandla ahlukene bese iyiguqula ibe yizimpawu zikagesi, ezibe sezicutshungulwa futhi ziguqulwe zibe izithombe ezimpunga. Isakhiwo sangaphakathi kanye nezimo zokukhubazeka kungahlulelwa ngokuhlaziya izithombe.

Izici ezinjengokunemba kokuthola (kufanele zikwazi ukuhlukanisa amaphutha amancane, njenge-micron - level solder joint voids), ukukhuliswa (ukuhlangabezana nezidingo zokuthola izingxenye zobukhulu obuhlukene), isivinini sokuthola (okuhambisana nomjikelezo womugqa wokukhiqiza), ukulungiswa kwesithombe (ukulungiswa okuphezulu kusiza ukubona imininingwane ngokucacile), ukuguquguquka kwemishini (ukusekela ukutholwa kwama-PCB osayizi abahlukene nokuhambisana nezindlela ezahlukene zokuthola), kanye nemisebenzi yesofthiwe (enemisebenzi efana nokuhlaziywa kwesithombe, ukuqashelwa kwamaphutha, kanye nezibalo zedatha) kudingeka kucatshangelwe.

Izinhlobo ezivamile zifaka phakathi amadivayisi okuhlola i-2D X - ray kanye namadivayisi okuhlola i-3D X - ray (njengamadivayisi okuhlola i-CT). Amadivayisi e-2D anesakhiwo esilula kakhulu kanye nezindleko eziphansi, futhi angathola ubuso kanye nezinye iziphambeko zangaphakathi zama-PCB. Amadivayisi e-3D angathola izithombe ezinezingqimba eziningi futhi afinyelele ekuthathweni kwezithombe kwe-3D, okungabona ngokunembile iziphambeko zangaphakathi zezingxenye ezinezakhiwo eziyinkimbinkimbi, kodwa izindleko zemishini ziphezulu futhi isivinini sokuthola sihamba kancane.

Ngokuvamile, akudingeki ukwelashwa okukhethekile kwangaphambi kwesikhathi, kodwa kuyadingeka ukuqinisekisa ukuthi ubuso be-PCB buhlanzekile ngaphandle kwamabala asobala nezinto zangaphandle; susa izembozo zokuvikela zensimbi nezinye izesekeli ku-PCB ezingathinta ukuhlolwa; kuma-PCB anezingqimba eziningi, uma izingqimba ezithile zaziwa ukuthi azidingeki ukuhlolwa, zingasethwa kusofthiwe yokuhlola ukuze kuthuthukiswe ukusebenza kahle kokuhlolwa.

Amapharamitha okuthola afaka i-voltage yeshubhu kanye nomsinga weshubhu wemisebe ye-X (okuthinta ubukhali kanye nokungeneka kwemisebe ye-X), isikhathi sokuchayeka (okuthinta ukukhanya nokucaca kwesithombe), ukukhuliswa (okulungisiwe ngokuya ngosayizi wengxenye kanye nezidingo zokuthola), i-engeli yokuthola (yamadivayisi okuhlola e-3D, ama-engeli ahlukene kudingeka asethelwe ukuskena), njll. Ngokuvamile, ngokuya ngezinto ezibonakalayo, ukujiya kwe-PCB, kanye nezinhlobo zezingxenye, amapharamitha adinga ukwenziwa ngcono ngokusebenzisa ukulungisa amaphutha kanye nokutholwa kwesilingo ukuze kutholakale izithombe zokuhlola ezinhle kakhulu.

I-X-ray ingathola amaphutha angaphakathi kwamajoyinti e-solder ezingxenye ezipakishiwe njenge-BGA, i-CSP, ne-QFN, njengezikhala, ukunamathela okubandayo, ukungamanzi, amabhola e-solder angekho, kanye ne-solder ball offset. Ingathola futhi imifantu nezinto zangaphandle ngaphakathi kwezingxenye, kanye nezinkinga ezifana nama-interlayer short circuits kanye nama-open circuits ngaphakathi kwe-PCB.

Uma i-X-ray ithola amaphutha, kuzokhiqizwa umbiko wokuhlola onemininingwane, omaka indawo yephutha, uhlobo, kanye nobunzima. Abasebenzi kudingeka bahlukanise i-PCB enephutha ngokusho kombiko. Uma kukhona amaphutha angalungiseka (njengezinye izinkinga zejoyinti le-solder), angalungiswa ngemishini yokulungisa kabusha. Uma kukhona ama-PCB anezinkinga ezinkulu, azolahlwa, futhi izimbangela zale maphutha zizohlaziywa ukuze kuthuthukiswe inqubo yokukhiqiza.

Lungisa njalo imishini ye-X-ray ukuqinisekisa ukusebenza okuzinzile komthombo we-X-ray kanye ne-detector; lungisa amapharamitha okuthola futhi ulungise amapharamitha ezinhlobo ezahlukene zama-PCB kanye nezingxenye; sebenzisa ama-algorithms okuhlaziya isithombe athuthukile ukuze uthuthukise ukunemba kokuqashelwa kwamaphutha; hlinzeka ngoqeqesho lobuchwepheshe kubasebenzi ukuze bathuthukise amakhono abo okuhlaziya izithombe kanye nokwahlulela amaphutha; sungula izinqubo zokuhlola ezijwayelekile kanye nemininingwane yokunciphisa amaphutha abantu.

Ukugcinwa kwansuku zonke kuhlanganisa ukuhlanza ubuso bedivayisi ukuze kuvinjelwe ukuqongelela kothuli ekuphazamiseni ukushabalaliswa kokushisa; ukuhlola njalo isimo sokusebenza kwepayipi le-X kanye nemingcele yokuqapha efana ne-voltage yepayipi kanye nogesi wepayipi; ukuhlola ukuzwela kanye nokuqina kwe-detector; ukugcoba nokubopha izingxenye zokudlulisa zemishini zedivayisi; ukuqhuba njalo ukuhlolwa kokusebenza kanye nokulinganisa kudivayisi ukuqinisekisa imiphumela yokuthola enembile nethembekile.

Izinzuzo yikhono lokuthola amaphutha angaphakathi afihliwe ama-PCB nezingxenye, futhi inezinzuzo ezihlukile ekuhlolweni kwamajoyinti e-solder amaphakheji afana ne-BGA ne-CSP; inganikeza ulwazi lwesakhiwo se-3D (ukuhlolwa kwe-3D X - ray). Amaphutha yijubane lokuthola elihamba kancane, izindleko eziphezulu; opharetha abangochwepheshe bayadingeka ekuhlaziyweni kwesithombe kanye nokwahlulela amaphutha; imisebe ye-X - inamandla okusakaza imisebe ngezinga elithile, futhi kudingeka izinyathelo zokuzivikela. Ukuhlolwa kwe-AOI kuyashesha, kubiza kancane, futhi kungabona ngokubonakalayo ukubukeka kanye namaphutha ebusweni bezingxenye, kodwa akukwazi ukubona amaphutha angaphakathi afihliwe.

Imisebenzi eyinhloko yesofthiwe yokuhlola i-X-ray ihlanganisa ukutholwa nokucubungula isithombe (ukulungisa ukukhanya kwesithombe, ukuqhathanisa, ukuhlunga, njll.), ukuqashelwa nokumaka amaphutha (ukuqashelwa ngokuzenzakalelayo noma ngesandla amaphutha nokumaka izindawo nezinhlobo zawo), ukwakhiwa kabusha kwesithombe se-3D (kwamadivayisi e-3D-ray), ukukhiqizwa kwemibiko yemiphumela yokuhlola (amarekhodi anemininingwane yolwazi lwamaphutha, amapharamitha okuthola, njll.), ukuhlaziywa kwedatha kanye nezibalo (ukubalwa kwamazinga okwenzeka kwamaphutha kanye nezinkinga zenqubo yokukhiqiza yokuhlaziya), kanye nokusebenzisana kwedatha nezinye izinhlelo zomugqa wokukhiqiza.

Izizathu zifaka phakathi ukusethwa okungafanele kwamapharamitha okuthola (njenge-voltage yeshubhu engafanele kanye nesikhathi sokuchayeka okuholela ekhwalithini yesithombe engeyinhle), ukulinganiselwa kwama-algorithms okuhlaziya isithombe (ukungakwazi ukuhlonza ngokunembile amaphutha ayinkimbinkimbi), ukuntuleka kolwazi lomsebenzisi (ukwahlulela okungalungile kwezithombe), izinto ezikhethekile nezakhiwo zama-PCB noma izingxenye (okuholela ekubunjweni kwesithombe okungavamile), kanye nezinkinga ngokunemba nokuzinza kwemishini ngokwayo.

Kabusha - lungisa amapharamitha okuthola ukuze uthuthukise ikhwalithi yesithombe; thuthukisa noma uthuthukise ama-algorithm okuhlaziya isithombe ukuze uthuthukise ikhono lokubona amaphutha; uqinise ukuqeqeshwa kwabasebenzi ukuze bathuthukise izinga labo lobuchwepheshe; sungula umtapo wolwazi wesampula yamaphutha ukuze kuhlaziywe ngokuqhathanisa izithombe eziyinkimbinkimbi; gcina futhi ulinganise imishini njalo ukuqinisekisa ukusebenza okuzinzile kwemishini.

Amadivayisi e-X-ray yesimanje avame ukuba nokulungiswa okuthile kanye nokuhambisana. Ngokusebenzisa izilungiselelo zesofthiwe kanye nokulungiswa kwehadiwe (njengokushintsha amalensi anobude obuhlukene bokugxila kanye nokulungisa usayizi wepulatifomu yokuhlola), angazivumelanisa nokuhlolwa kwama-PCB osayizi abahlukene. Ngezinhlobo ezahlukene zama-PCB (njengamabhodi aqinile, amabhodi aguquguqukayo, amabhodi aqinile aguquguqukayo) kanye nezingxenye, uma nje zingaphakathi kwamandla okuthola idivayisi, ukutholwa okuphumelelayo kungatholakala ngokulungisa amapharamitha okuthola ahambisanayo kanye nezindlela. Kodwa-ke, kuma-PCB anezakhiwo ezikhethekile noma ama-PCB amancane kakhulu futhi aminyene, kungadingeka amadivayisi alungiselelwe ngokukhethekile.

Ngokuvamile ifakwa ngemva kokushiswa kabusha ukuze ihlole i-PCB ngemva kokushiswa futhi ithole ngesikhathi esifanele amaphutha angaphakathi njengamajoyinti okushiswa. Ingasetha futhi isiteshi sokuhlola i-X-ray esihlukile ngemva kwezinqubo ezibalulekile (njengoba ngemva kokubekwa kwezingxenye ze-BGA) ukuze yenze ukuhlolwa okukhethekile ezingxenyeni ezibalulekile ukuqinisekisa ikhwalithi yomkhiqizo, kodwa lokhu kuzokwandisa ubunzima kanye nezindleko zomugqa wokukhiqiza.

Ngokuhlaziya idatha yokuhlola ye-X-ray, bala ukusatshalaliswa kanye nemvamisa yokwenzeka kwamaphutha ahlukahlukene ukuze uthole izixhumanisi ezibuthakathaka enqubweni yokukhiqiza. Isibonelo, uma izinga lokungapheleli kwamajoyinti e-BGA solder kuqoqo elithile lama-PCB litholakala liphezulu, inani lokuphrinta lokunamathisela i-solder, iphrofayili yokushisa kwe-soldering ephinde igeleze, noma ingcindezi yokubekwa kwengxenye ingalungiswa. Uma izinto zangaphandle ngaphakathi kwezingxenye zivela njalo, ikhwalithi yezingxenye ezingenayo kanye nokuhlanzeka kwendawo yokukhiqiza kungahlolwa, futhi inqubo ingathuthukiswa futhi ukulawula kungaqiniswa ngokufanele.

Umugqa we-ICT, okungukuthi umugqa wokuhlola we-In - Circuit, uyidivayisi eqhuba ukuhlolwa kokusebenza kukagesi kuma-PCB anezingxenye ezifakiwe nezihlanganisiwe. Ixhumana namaphuzu okuhlola ku-PCB ngama-probe, ithola izifunda ezivulekile, izifunda ezimfushane, nokuthi ngabe amapharamitha ezingxenye (njengokumelana, amandla, kanye namanani okungena) ayahlangabezana yini nezidingo zomklamo, kanye nekhwalithi yokunamathisela yezingxenye. Ingathola ngokushesha izingxenye ezinephutha kanye namajoyinti e-solder anephutha, iqinisekise ikhwalithi yemikhiqizo ye-PCB futhi ithuthukise ukusebenza kahle kokukhiqiza kanye nokukhiqiza.

Isimiso sokuhlolwa kwe-ICT sisekelwe ekuhlaziyweni kwenethiwekhi yesekethe. Imishini yokuhlola isebenzisa izimpawu zokuvuselela (njengamanje kanye ne-voltage) ezindaweni zokuhlola ku-PCB ngokusebenzisa ama-probe, bese ilinganisa izimpawu zokuphendula zesekethe. Ngokusho kohlelo lokuhlola olusethwe ngaphambilini kanye namapharamitha ajwayelekile, amanani angempela alinganisiwe aqhathaniswa namanani e-theory ukuze kutholakale ukuthi kukhona yini izinkinga ezifana nama-open circuits, ama-short circuits, kanye nokuphambuka kwamapharamitha e-component kusekethe. Isibonelo, engxenyeni yokumelana, kusetshenziswa i-voltage eyaziwayo, i-flow current iyalinganiswa, futhi inani lokumelana liyabalwa futhi liqhathaniswa nenani elijwayelekile.

Uma ukhetha, izici ezifana nokunemba kokuhlola (okukwazi ukukala ngokunembile amapharamitha ezingxenye, njengokunemba kokulinganisa ukumelana okungu-±1%), isivinini sokuhlola (ukuhlangabezana nezidingo zomjikelezo womugqa wokukhiqiza), inani lamaphuzu angahlolwa (afanele inani lamaphuzu okuhlola ku-PCB), imisebenzi yesofthiwe (ene-interface yokuhlela yesithombe, umsebenzi wokuxilongwa okuzenzakalelayo, ikhono lokuhlaziya izibalo zedatha), ukuhambisana kwemishini (okusekela ukuhlolwa kwezinhlobo ezahlukene zama-PCB namaphakheji ezingxenye ahlukene), impilo yesevisi ye-probe, kanye nezindleko zokulungisa kudingeka kucatshangelwe. Ngaphezu kwalokho, kufanele kubhekwe nokusekelwa kobuchwepheshe kanye namakhono enkonzo yangemva kokuthengisa yomhlinzeki wemishini.

Amadivayisi avamile e-ICT afaka phakathi i-bed - of - nails ICT kanye ne-flying - probe ICT. I-bed - of - nails ICT ixhumana namaphuzu okuhlola e-PCB ngokusebenzisa umbhede ohleliwe wezipikili, futhi ingahlola amaphuzu amaningi ngesikhathi esisodwa, ngesivinini sokuhlola esisheshayo, esifanele ukukhiqizwa ngobuningi. Kodwa-ke, izindleko zokwenza umbhede wezipikili ziphakeme, futhi umbhede wezipikili udinga ukushintshwa kuma-PCB ahlukene. I-flying - probe ICT isebenzisa ama-probe ashukumayo ukuhlola amaphuzu ngamunye ngamunye, ngaphandle kwesidingo sokwenza umbhede wezipikili, ngokuguquguquka okuphezulu, okufanele ukukhiqizwa kweqembu elincane nezinhlobonhlobo eziningi, kodwa isivinini sokuhlola sihamba kancane.

Kuyadingeka ukuqinisekisa ukuthi ubuso be-PCB buhlanzekile ngaphandle kwezinto ezingcolisayo ezifana nodoti we-solder, ubuhlalu be-tin, kanye namabala kawoyela ukuze kugwenywe ukuthintana okuhle phakathi kwama-probe kanye namaphuzu okuhlola. Hlola ukuthi amaphuzu okuhlola ku-PCB aphelele futhi awanayo i-oxidation. Uma kudingeka, hlanza noma ubophe amaphuzu okuhlola nge-tin. Susa izembozo zokuvikela zensimbi nezinye izesekeli ku-PCB ezingase ziphazamise ukuhlolwa. Kuma-PCB afakwe emaceleni amabili, hlukanisa ngokucacile ubuso bokuhlola.

Amapharamitha okuhlola afaka uhlobo (i-voltage, i-current), ubukhulu, kanye nemvamisa yesignali yokuvuselela; ububanzi bokulinganisa (njengobubanzi bokulinganisa ukumelana obungu-0.1Ω - 10MΩ); isikhathi sokuhlola (ubude bokuhlola bephuzu ngalinye lokuhlola); ukusethwa komkhawulo (njengobubanzi bokuphambuka obuvumelekile benani lokumelana elingu-±5%), njll. Ngokusho komklamo wesekethe we-PCB, imininingwane yengxenye, kanye nezidingo zokuhlola, amapharamitha adinga ukusethwa ngokufanele ngokusebenzisa ukulungisa amaphutha kanye nokuhlolwa kwesilingo ukuqinisekisa ukunemba nokuthembeka kokuhlolwa.

I-ICT ingathola amasekethe avulekile (isekethe ayixhunyiwe), amasekethe amafushane (ukuhanjiswa okungalindelekile phakathi kwemigqa ehlukene), ukufakwa kwengxenye okungalungile (njengokufaka i-resistor njenge-capacitor), amapharamitha engxenye angalungile (amanani ama-resistor, ama-capacitor, nama-inductor awafani namanani ajwayelekile), i-reverse component polarity (izingxenye ze-polar ezifana nama-diode nama-capacitor e-electrolytic zifakiwe ngokuphambene), i-cold soldering (amalunga e-solder abonakala exhunyiwe kodwa asebenza kabi ngogesi), njll.

Uma i-ICT ithola amaphutha, izobonisa indawo yephutha, uhlobo, kanye nolwazi oluningiliziwe ku-interface yesofthiwe yokuhlola. Abasebenzi kudingeka basuse i-PCB enephutha emgqeni wokukhiqiza ngokwemiyalelo futhi basebenzise amathuluzi anjenge-multimeters nama-oscilloscopes ukuqinisekisa izinkinga. Uma kukhona amaphutha angalungiseka (njengokushiswa okubandayo kanye nokufakwa kwezingxenye okungalungile), zilungise ngamathuluzi okulungisa kabusha. Uma kukhona ama-PCB anezinkinga ezinkulu ezingalungiseki, zisuse, uqophe idatha yephutha, bese uhlaziya izimbangela ukuze uthuthukise inqubo yokukhiqiza.

Lungisa njalo imishini ye-ICT ukuqinisekisa ukunemba kwesiginali yokuvuselela kanye nohlelo lokulinganisa. Gcina ama-probe ehlanzekile futhi esesimweni esihle, bese ushintsha ama-probe agugile noma onakele ngesikhathi esifanele. Lungiselela uhlelo lokuhlola bese usetha ngokunembile amapharamitha okuhlola. Nikeza ukuqeqeshwa kobungcweti kwabaqhubi ukuze bathuthukise amakhono abo okwahlulela nokuphatha amaphutha. Misa izinqubo zokuhlola ezijwayelekile kanye nemininingwane yokunciphisa amaphutha okusebenza kwabantu.

Ukugcinwa kwansuku zonke kuhlanganisa ukuhlanza ubuso bedivayisi kanye nama-probe ukuvimbela uthuli kanye nezinsalela ze-solder ukuthi zingathinti isivivinyo. Hlola njalo ingcindezi ye-probe ukuqinisekisa ukuthintana kahle namaphoyinti okuhlola. Qapha ukusebenza kukagesi kwemishini, njengokuzinza kwesignali yokuvuselela. Nge-ICT yezipikili zombhede, hlola isimo sokulungisa sezipikili zombhede kanye nokuqhuba kwezipikili. Gcina njalo izinhlelo zokuhlola kanye nedatha ukuze uvimbele ukulahleka. Yenza ukulinganisa okuvamile kanye nokugcinwa kochwepheshe ngokwezidingo zomenzi wemishini.

Izinzuzo yikhono lokubona ngqo ukusebenza kukagesi kwesekethe, ukwahlulela ngokunembile amapharamitha ezingxenye kanye nekhwalithi yokugoqa, nokuthola ngokunembile amaphuzu amaphutha; inomphumela omuhle wokuthola ezinkingeni ezifana namasekethe avulekile kanye namasekethe amafushane. Okubi yisidingo sokusetha amaphuzu okuhlola ku-PCB, okwandisa izindleko zokuklama nokukhiqiza i-PCB; ingathola kuphela izindawo ezifinyeleleka ngamaphuzu okuhlola, ngamachashazi okuthola; ukuthuthukiswa kohlelo lokuhlola kuyinkimbinkimbi, futhi ukuhlelwa kabusha kuyadingeka kuma-PCB ahlukene. I-AOI ithola kakhulu ukubukeka kanye namaphutha ebusweni bezingxenye, ngesivinini sokuthola okusheshayo kanye nezindleko eziphansi. Ukuhlolwa kwe-X-ray kungathola amaphutha angaphakathi afihliwe ama-PCB kanye nezingxenye, kodwa inesivinini sokuthola esihamba kancane kanye nezindleko eziphezulu.

Imisebenzi eyinhloko yesofthiwe yokuhlola i-ICT ifaka phakathi ukuhlela uhlelo lokuhlola (ukuchaza amaphuzu okuhlola, ukusetha amapharamitha okuhlola, ukubhala i-logic yokuhlolwa), ukwenziwa kokuhlolwa nokulawula (ukuqala, ukumisa isikhashana, ukumisa ukuhlolwa), ukuqashelwa kwamaphutha kanye ne-alamu (ukwahlulela ngokuzenzakalelayo imiphumela yokuhlolwa, ukumaka amaphutha, nokukhipha ama-alamu), ukuboniswa nokurekhoda kwemiphumela yokuhlolwa (ukwethula idatha yokuhlolwa ngendlela yamashadi nemibiko), ukuhlaziywa kwedatha kanye nezibalo (ukubala izinhlobo zamaphutha kanye namazinga okwenzeka, ukuhlaziya izinkinga zenqubo yokukhiqiza), kanye nokusebenzisana kwedatha nezinye izinhlelo zomugqa wokukhiqiza (njengohlelo lwe-MES).

Izizathu zifaka phakathi ukwakheka okungafanele kwamaphuzu okuhlola (njengebanga elincane kakhulu phakathi kwamaphuzu okuhlola nendawo engafanele), okuholela ekuthinteni okungekuhle kweprobe noma ukuphazamiseka okuhambisanayo; ukusetha okungafanele kwamapharamitha okuhlola (njengobubanzi obuncane kakhulu noma obukhulu kakhulu bomkhawulo); ukuguguleka kweprobe, ukushiswa kwe-oxidation, noma ukungcola, okuthinta ukudluliswa kwezimpawu zokuhlola; ubuso be-PCB obungalingani, okubangela ukucindezela kweprobe okungalingani; amaphutha anengqondo ohlelweni lokuhlola, okuholela ekuhluleleni kabi izifunda ezijwayelekile; ukusebenza kukagesi okungazinzile kwemishini ngokwayo, njll.

Lungiselela ukwakheka kwamaphuzu okuhlola ukuqinisekisa ukwakheka okufanele, isikhala esifanele, kanye nekhwalithi enhle yobuso bamaphuzu okuhlola. Linganisa kabusha futhi ulungise amapharamitha okuhlola, bese unquma ububanzi bomkhawulo obufanele ngokusebenzisa izivivinyo eziningi zokuhlola. Hlanza njalo, nakekela, futhi ushintshe ama-probe. Phatha ama-PCB angalingani kusengaphambili noma sebenzisa ama-probe aguquguqukayo. Hlola ngokucophelela futhi ulungise amaphutha anengqondo ohlelweni lokuhlola. Linganisa futhi ulinganise imishini njalo ukuqinisekisa ukusebenza okuzinzile kwemishini.

Amadivayisi e-ICT e-Bed - of - nail ngokuvamile adinga ukwenza ngokwezifiso izinzipho ze-bed - of - zama-PCB ezinobukhulu nezinhlobo ezahlukene, ngokuguquguquka okuncane, kodwa asebenza kahle kakhulu ngobuningi - akhiqiza uhlobo olufanayo lwama-PCB. Amadivayisi e-ICT e-Flying - probe alawula ukunyakaza kwama-probe ngesofthiwe ngaphandle kwesidingo sokushintsha ihadiwe, futhi angazivumelanisa nokuhlolwa kwama-PCB anobukhulu nezinhlobo ezahlukene. Uhlelo lokuhlola kanye nemingcele kuphela okudingeka kulungiswe. Kodwa-ke, kuma-PCB noma ama-PCB amakhulu kakhulu anenani elikhulu kakhulu lamaphuzu okuhlola, ukusebenza kahle kokuhlola kungancishiswa.

Ukuhlolwa kwe-ICT kuvame ukufakwa ngemva kwenqubo yokugoqa kabusha kanye nangaphambi kokuhlolwa kokusebenza, ukuze kutholakale ngesikhathi izinkinga zokusebenza kukagesi ezidalwe ngesikhathi sezinqubo zokugoqa kanye nokubekwa kwezingxenye, kuvimbele imikhiqizo enephutha ukuthi ingene ezinqubweni ezilandelayo, futhi kunciphise izindleko zokusebenza kabusha. Kungaphinde, ngokwezidingo zenqubo yokukhiqiza, kumise isiteshi sokuhlola i-ICT esihlukile ngemuva kokubekwa kwezingxenye ezibalulekile ukuze kwenziwe ukuhlolwa kusenesikhathi ezingxenyeni zesekethe ezibalulekile.

Ngokuhlaziya idatha yokuhlola i-ICT, bala ukusatshalaliswa kanye nokuvela kwamava okuphambuka ahlukahlukene ukuze uthole izixhumanisi ezibuthakathaka enqubweni yokukhiqiza. Isibonelo, uma izinga lokuphambuka kohlobo oluthile lwamapharamitha ezingxenye liphezulu, ikhwalithi yezingxenye ezingenayo, ukunemba kokubekwa, noma inqubo yokunamathisela ingahlolwa. Uma izinkinga zesekethe evulekile noma zesekethe esifushane zivela njalo, ukwakheka kwe-PCB kungalungiswa (njengokulungisa izintambo nokwengeza amaphuzu okuhlola), amapharamitha okunamathisela angathuthukiswa, noma izinyathelo zokulwa nokuma ngesikhathi senqubo yokukhiqiza zingaqiniswa.

Umugqa we-FCT, okungukuthi umugqa wokuhlola we-Functional Circuit, usetshenziselwa ukuqinisekisa imisebenzi yama-PCB noma imikhiqizo ehlanganisiwe ngemuva kokubekwa kwengxenye kanye nokushintshwa kwe-solder. Ulingisa indawo yokusebenza yangempela yomkhiqizo, ufaka izimpawu zokuvuselela, futhi uthola ukuthi izimpawu zokukhipha kanye nemisebenzi ehlukahlukene yomkhiqizo ziyahlangabezana yini nezidingo zomklamo. Ungabona amaphutha anengqondo angaba khona kanye nezinkinga zokusebenza, uqinisekise ukuthi umkhiqizo ungasetshenziswa ngendlela evamile. Kuyisinyathelo esibalulekile ekuqinisekiseni ubuqotho bokusebenza kanye nokuthembeka komkhiqizo.

Isimiso sokuhlolwa kwe-FCT sisekelwe ezicini zokusebenza kanye nemininingwane yomklamo womkhiqizo. Imishini yokuhlola isebenzisa izimo ezithile zokuvusa, njengokunikezwa kwamandla kanye nokufakwa kwesignali, ku-PCB noma umkhiqizo ovivinyiwe, futhi ngesikhathi esifanayo, iqoqa izimpawu zomkhiqizo. Lezi zimpawu zomkhiqizo ziqhathaniswa futhi zihlaziywe ngedatha yomkhiqizo elungile esethiwe, ama-waveform, izimo ezinengqondo, njll. Uma imiphumela yomkhiqizo ingahambisani nezindinganiso, kutholakala ukuthi kuneziphambeko zomsebenzi, ngaleyo ndlela kutholakale amaphuzu okusebenza omkhiqizo.

Uma ukhetha, izici ezifana nobubanzi bemisebenzi yokuhlola (ukuthi ingahlangabezana yini nazo zonke izidingo zokuhlola ezisebenzayo zomkhiqizo), ukunemba kokuhlola (ukunemba ekulinganiseni izimpawu ze-analog nezedijithali), isivinini sokuhlola (ukufanisa umjikelezo womugqa wokukhiqiza), ukuhambisana (ukusekela ukuhlolwa kwemikhiqizo yamamodeli ahlukene kanye nokucaciswa), imisebenzi yesofthiwe (enemisebenzi efana nokuhlela uhlelo lokuhlola, ukuqoshwa kwedatha nokuhlaziywa, kanye nezeluleko zokuxilongwa kwamaphutha), ukunwebeka kwemishini (ikhono lokwengeza amamojula okuhlola ngokuya ngokuthuthukiswa komkhiqizo), kanye nezindleko zemishini kanye nensizakalo yokuthengisa ngemuva kokuthengisa kudingeka kucatshangelwe.

Amadivayisi avamile e-FCT afaka amadivayisi azinikele e-FCT asekelwe ezintweni ezisetshenziswayo kanye namadivayisi e-FCT ajwayelekile asekelwe ezintweni ezisetshenziswayo. Amadivayisi azinikele e-FCT aklanyelwe imikhiqizo ethile, enokufaneleka okuqinile kokuhlola kanye nokusebenza kahle okuphezulu, kodwa ukuguquguquka okuncane. Izinto ezisetshenziswayo zidinga ukuhlelwa kabusha lapho umkhiqizo ubuyekezwa. Amadivayisi e-FCT ajwayelekile asebenzisa izinto zokuhlola ezingasetshenziswa kabusha (njenge-multimeter, ama-generator esignali, ama-oscilloscope, njll.) futhi afinyelela ukuhlolwa kwemikhiqizo ehlukene ngokusebenzisa izinhlelo zesofthiwe. Anokuguquguquka okuphezulu kanye nobubanzi bezinhlelo zokusebenza, kodwa ukuthuthukiswa kwezinhlelo zokuhlola kuyinkimbinkimbi, futhi izindleko zokuqala zemishini ziphakeme kakhulu.

Kuyadingeka ukuqinisekisa ukuthi i-PCB ayinawo umonakalo wangaphandle, ikhwalithi enhle yokunamathisela, futhi ayinazo iziphambeko ezisobala njengokunamathisela okubandayo kanye nama-short circuits. Yenza ukuhlanza okudingekayo ku-PCB ukuze ususe ukugeleza okusele, uthuli, nokunye ukungcola ebusweni. Hlola ukuthi izixhumi, ama-interface, njll. ku-PCB zifakwe kahle futhi azinawo umonakalo. Ngokwezidingo zokuhlola, yenza ukucushwa okudingekayo ku-PCB (njengokushisa uhlelo, ukusetha i-jumper, njll.).

Amapharamitha okuhlola afaka uhlobo (isignali ye-analog, isignali yedijithali), ubukhulu, imvamisa, kanye nomjikelezo womsebenzi wesignali yokufaka; isikhathi sokuhlola; izindlela zokwahlulela zezibonakaliso zokukhipha (njengebanga le-voltage, izinga le-logic, izici ze-waveform); ukulandelana kanye nemibandela yezinyathelo zenqubo yokuhlola, njll. Ngokusho kwencazelo yokusebenza komkhiqizo kanye nezidingo zangempela zokusebenza, kuhlanganiswe nokusebenza kwemishini yokuhlola, amapharamitha adinga ukusethwa ngokufanele ngokusebenzisa ukulungisa amaphutha nokuqinisekisa ukuqinisekisa ukusebenza kahle nokunemba kokuhlolwa.

I-FCT ingathola amaphutha okusebenza okunengqondo (njengokulawulwa okungavamile kwe-logic kwama-chip), ukudluliswa kwesignali okungavamile (ukuncipha kwesignali, ukuphambuka, ukuphazamiseka), ukwehluleka komsebenzi wesixhumi esibonakalayo (i-USB, isixhumi esibonakalayo senethiwekhi, njll. esingakwazi ukuxhumana ngokujwayelekile), izinkinga zokuphathwa kwamandla (ukukhishwa kwamandla kagesi okungazinzile, ukuvikelwa kwamanje okungavamile), amaphutha okusebenza kwesofthiwe (amaphutha okusebenza kohlelo, isikhathi sokuvala impendulo), njll. La maphutha angabangelwa ukubekwa kwengxenye okungalungile, ukushiswa okungekuhle, umonakalo wengxenye, noma izinkinga zokuklama.

Uma i-FCT ithola amaphutha, imishini yokuhlola izoqopha ulwazi lwephutha bese ikhipha isaziso se-alamu. Abasebenzi kudingeka bamake imikhiqizo enephutha ngokwemiyalelo futhi basebenzise amathuluzi ochwepheshe (njenge-oscilloscopes kanye ne-logic analyzers) ukuze bahlaziye kabanzi izimbangela zokwehluleka. Ngezinkinga ezingalungiseka (njengamaphutha ohlelo kanye nokushiswa kwezingxenye), zilungise bese uzihlola kabusha. Ngemikhiqizo engenakulungiseka, yiphathe ngokwenqubo yokuklwebha, bese uphendula idatha yephutha eminyangweni yokukhiqiza kanye neye-R & D ukuze kuthuthukiswe inqubo futhi kuthuthukiswe umklamo.

Lungisa njalo imishini yokuhlola ukuqinisekisa ukunemba kwezimpawu zokufaka nezokukhipha. Lungiselela uhlelo lokuhlola futhi usethe ngokunembile amapharamitha okuhlola kanye nezindlela zokwahlulela. Sebenzisa izindlela eziningi zokuhlola kanye nezindlela (njengokuhlolwa kwesimo semingcele kanye nokuhlolwa komkhawulo) ukuze uthole ngokuphelele imisebenzi yomkhiqizo. Nikeza ukuqeqeshwa kochwepheshe kwabaqhubi ukuze bathuthukise amakhono abo okuhlaziya amaphutha kanye nokwahlulela. Misa indlela ephelele yokuqopha nokuhlaziya idatha yokuhlola, bese uthola izinkinga ezingaba khona ngokuqhathanisa idatha yomlando.

Ukulungiswa kwansuku zonke kuhlanganisa ukuhlanza ubuso bemishini kanye nezinto zokuhlola ukuze kuvinjelwe uthuli kanye nokungcola ukuthi kungathinti isivivinyo. Hlola njalo isimo sokusebenza kwemojuli ngayinye yemishini (njengemojuli yamandla kanye nemojuli yokukhiqiza isignali) bese uqapha izinkomba zokusebenza ezibalulekile. Hlola futhi ulinganise izinto zokuhlola ukuqinisekisa ukuthintana okuhle. Buyekeza isofthiwe yokuhlola ngesikhathi esifanele ukuze ulungise amaphutha futhi wengeze imisebenzi emisha. Yenza ukulinganisa okubanzi njalo kanye nokulungisa okujulile ngokwezidingo zomenzi wemishini.

Inzuzo ukuthi ingathola izinkinga kusukela ezingeni langempela lokusebenza komkhiqizo, eliseduze nesimo sokusetshenziswa komsebenzisi, futhi ingabona amaphutha anengqondo nokusebenza angenakutholakala ngezinye izivivinyo. Amaphutha yizindleko zokuhlola eziphakeme (izindleko zemishini kanye nokufakwa), ukuthuthukiswa kohlelo lokuhlola oluyinkimbinkimbi, kanye nesivinini sokuhlola esihamba kancane. I-AOI ithola kakhulu amaphutha okubukeka kanye nobuso, ngesivinini esisheshayo kanye nezindleko eziphansi. Ukuhlolwa kwe-X-ray kungabona amaphutha angaphakathi afihliwe. I-ICT igxile ekutholeni amapharamitha kagesi ezisekethe futhi ingathola ngokunembile izingxenye ezinephutha, kodwa akekho kulaba abathathu ongaqinisekisa ngqo imisebenzi yomkhiqizo.

Imisebenzi eyinhloko yesofthiwe yokuhlola i-FCT ifaka phakathi ukubhala nokuhlela uhlelo lokuhlola (ukuchaza inqubo yokuhlola, ukusetha amapharamitha, ukubhala izitatimende zokwahlulela okunengqondo), ukulawula ukwenziwa kokuhlolwa (ukuqala, ukumisa isikhashana, ukumisa ukuhlolwa), ukuqoqwa kwedatha yesikhathi sangempela kanye nokuboniswa (ukubonisa amaza okufaka nokukhiphayo kanye namanani), ukuqashelwa kwephutha okuzenzakalelayo kanye ne-alamu (ukumaka amaphutha kanye nokukhuthaza ngokwemigomo yokwahlulela), ukuqoshwa kwemiphumela yokuhlolwa kanye nokukhiqizwa kwemibiko (ukubala izinga lokuphasa, ukuqopha ulwazi lwephutha), ukuhlaziywa kwedatha kanye nokulandelelwa (ukuhlaziya ukuthambekela kwedatha yokuhlolwa, ukulandelela umlando wokuhlolwa komkhiqizo).

Izizathu zifaka phakathi ukusetha okungafanele kwamapharamitha okuhlola (ububanzi obukhulu kakhulu noma obuncane kakhulu), amaphutha anengqondo ohlelweni lokuhlola (izimo zokwahlulela ezinganembile), ukushintshashintsha kokusebenza kwemishini yokuhlola ngokwayo (ukukhishwa kwesignali okungazinzile), ukuxhumana okungekuhle kwento yokuhlola (okuholela ekudlulisweni kwesignali okungavamile), ukuphazamiseka kwemvelo (ukuphazamiseka kwe-electromagnetic okuthinta ukuqoqwa kwesignali), kanye nezinkinga zokuhambisana ekwakhiweni komkhiqizo (ukusebenza okungavamile endaweni yokuhlola).

Buyekeza futhi ulungise amapharamitha okuhlola, bese wenza ngcono umkhawulo ngokusebenzisa izivivinyo eziningi. Hlola ngokucophelela futhi ulungise ukuqonda kohlelo lokuhlola bese wenza ukuqinisekiswa okwanele kokuhlola. Lungisa njalo futhi ulinganise imishini yokuhlola ukuqinisekisa ukusebenza okuzinzile. Hlola futhi uthuthukise isimo sokuxhumana se-test fixture, bese ushintsha i-fixture uma kudingeka. Vikela noma ulungise indawo yokuhlola ukuze unciphise ukuphazamiseka. Xhumana nomnyango we-R & D ukuqinisekisa ukuhambisana komklamo womkhiqizo endaweni yokuhlola futhi uxazulule izinkinga ezingaba khona.

Amadivayisi e-FCT azinikele asekelwe ezintweni ezifakiwe ngokuvamile aklanyelwe imikhiqizo ethile futhi awakwazi ukuzivumelanisa kahle nama-PCB anobukhulu nezinhlobo ezahlukene. Izinto ezifakiwe kudingeka ziphinde zenziwe kabusha. Amadivayisi e-FCT ajwayelekile asekelwe ezintweni ezifakiwe angazivumelanisa nokuhlolwa kwama-PCB anobukhulu nezinhlobo ezahlukene ngezinga elithile ngokusebenzisa uhlelo lwesofthiwe nokufaka esikhundleni sezindawo zokuhlola ezifanele, kodwa ngemikhiqizo enemisebenzi noma izakhiwo ezikhethekile, amanye amamojula okuhlola angadinga ukwenziwa ngokwezifiso.

Ukuhlolwa kwe-FCT ngokuvamile kubekwa ekugcineni komugqa wokukhiqiza, okungukuthi, ngemva kokuba izinqubo ezifana nokuhlolwa kwe-ICT kanye nokuhlolwa kokubukeka seziqediwe, ukuqinisekisa ukuthi imikhiqizo ehlolwe yizinqubo zangaphambilini iqinisekisiwe ngemisebenzi esesimweni esiseduze nokusetshenziswa kwangempela, nokuvimbela imikhiqizo engafanele ukuthi igelezele kuklayenti. Ngokwezimpawu zomkhiqizo, ukuhlolwa kwe-FCT okuhlukaniswe ngezigaba nakho kungabekwa ngemuva kokuhlanganiswa kwamamojula abalulekile okusebenza ukuze kutholakale izinkinga ngesikhathi esifanele futhi kuncishiswe ukuchithwa kwezinqubo ezilandelayo.

Ngokuhlaziya izibalo zedatha yokuhlola i-FCT, amaphethini okusatshalaliswa kanye namaphuzu ezinkinga ezivame kakhulu zeziphambeko zomsebenzi womkhiqizo angatholakala. Isibonelo, uma uhlobo oluthile lwesiphambeko somsebenzi luvela njalo, izinqubo zokukhiqiza ezihambisanayo (njengokubekwa kwezingxenye, ukushiswa kwe-solder, ukushiswa kwesofthiwe) zingaphenywa kahle. Hlaziya ubudlelwano phakathi kweziphambeko nezici ezifana namaqoqo ezinto zokusetshenziswa, imishini yokukhiqiza, kanye nabaqhubi, futhi uthuthukise amapharamitha enqubo, uqinise ukulawulwa kwekhwalithi, futhi wenze ngcono ukwakheka komkhiqizo ngokufanele, ngaleyo ndlela kuthuthukiswe ikhwalithi yomkhiqizo iyonke kanye nokusebenza kahle kokukhiqiza.