I-PCB eqinile

Izinto: Iqinile isebenzisa i-fiberglass, i-polyimide eguquguqukayo isebenzisa. Isakhiwo: Iqinile ayikwazi ukugoba, i-flexible ingaguquguquka. Ukusetshenziswa: Iqinile yokuxhumana okuzinzile, iguquguqukayo yezikhala ezincane.

Inesendlalelo esisodwa, enezingqimba ezimbili, enezingqimba eziningi. Isendlalelo esisodwa sinezisekethe ohlangothini olulodwa; inezingqimba ezimbili kuzo zombili; inezingqimba eziningi ixhumanisa izingqimba eziqhubayo ngama-via (isb., amabhodi ebhodi).

Amakhompyutha edeskithophu, ama-TV, ukulawula kwezimboni, ama-elekthronikhi ezimoto (amakhompyutha angaphakathi emotweni), izingxenye zezindiza ezingadlidlizi, njll.

Izindleko eziphansi. Ama-PCB aqinile anezinqubo ezivuthiwe nezinto ezishibhile; ama-PCB aguquguqukayo ayabiza ngenxa yezinto nezinqubo eziyinkimbinkimbi.

Izisekelo ezivamile ze-FR4: -55°C kuya ku-125°C ukuze zisetshenziswe ngokujwayelekile, isikhathi esifushane esingu-260°C ukuze kufakwe i-solder engenalo i-lead. Izinto ezikhethekile zingamelana namazinga okushisa aphezulu.

Kusukela kuma-cm² ambalwa (amabhodi okulawula amancane) kuya kuma-m² amaningana (amabhodi e-motherboard amakhulu eseva).

Kuncike kusayizi, izendlalelo, kanye nezinto zokwakha. Amabhodi e-FR4 anezendlalelo eziningi: ~1-3 kg/m², anzima kune-PCB eziguquguqukayo zendawo efanayo.

Iminyaka eyi-10-20+ ezindaweni ezivamile; ifinyezwe ibe yiminyaka ezimweni ezinzima (ukushisa okuphezulu/umswakama).

I-FR4 ine-modulus egobekayo engu-~100-200MPa, ephansi kakhulu kune-PCB egobekayo. Ukwanda kobukhulu kuthuthukisa ukumelana nokucindezeleka.

I-FR4 (i-fiberglass epoxy), i-phenolic resin, i-epoxy resin; i-PTFE yezinhlelo ezikhethekile zemvamisa ephezulu.

Ukushisa okuhle kukagesi, izakhiwo zemishini, kanye nokuzinza kobukhulu. I-CTE: 13-17ppm/℃. Izindleko eziphansi kanye nezinqubo ezivuthiwe.

Izinga lokushisa eliphansi lokubola (120-150°C), livame ukuhlukaniswa ngesikhathi sokushiswa, izakhiwo zikagesi/zomshini ezingezinhle, i-CTE ephezulu, kanye nephunga elimnandi.

Yakha imikhondo eqhubayo yokugeleza kwamanje. Ubukhulu obujwayelekile: 0.5oz (17μm), 1oz (35μm), 2oz (70μm). Ama-foil aqinile okusetshenziswa kwamanje aphezulu.

Ivikela ukuvikela imijikelezo emifushane, ivikela ithusi ekungcolisweni nasekulinyazweni ngokomzimba, futhi ihlukanisa izindawo ngombala (isb., oluhlaza okotshani, oluhlaza okwesibhakabhaka).

Iphrinta izinhlamvu/izimpawu zokuhlonza izingxenye ngesikhathi sokukhiqiza nokulungisa amaphutha. Umbala ojwayelekile: omhlophe; futhi ompunga, obomvu, omnyama, ophuzi, njll.

I-FR4: Izindleko eziphansi zokusetshenziswa okuvamile. Izinto ezisetshenziswa kakhulu (isb., i-PTFE): Ukulahleka kwesignali okuphansi kwe-5G. Izisekelo ze-ceramic: Ukushisa okuphezulu kokusetshenziswa kokushisa okuphezulu.

Cabanga ngogesi (imvamisa ephezulu/i-voltage ephezulu), oomatshini (ukudlidliza), izinga lokushisa, kanye nezindleko. Sebenzisa i-FR4 kuma-electronics asetshenziswa ngabathengi, i-PTFE kuma-frequency aphezulu, kanye ne-ceramics yokushisa okuphezulu.

I-RoHS: Inciphisa izinto eziyingozi (umthofu, i-mercury, njll.). Ayinayo i-halogen: Br/Cl

Izinto eziphansi ze-CTE zithuthukisa ukuzinza kobukhulu. Ukushisa okuphezulu kuthuthukisa ukushabalaliswa kokushisa. Ama-insulator asebenza kahle anciphisa ukulahleka kwesiginali, okwenza kube lula ukwenza izinto zibe zincane futhi zisebenze kahle kakhulu.

Ubuqotho besiginali (ukufaniswa kwe-impedance, ukuphikisana nokukhanya/ukukhuluma nge-crosstalk), ukusatshalaliswa kwamandla, ukusekela phansi, kanye nomthamo wokuthwala ugesi.

Nciphisa ukulandelwa kwesignali, nciphisa ama-via. Sebenzisa ama-differential pairs kumasignali esivinini esikhulu kanye ne-control impedance. Izindiza zamandla/zomhlaba ezinethusi eliqinile. Amamojula okuhlukanisa ukuze ugweme ukuphazamiseka. Ububanzi bomugqa busekelwe kumandla kagesi.

Usayizi usekelwe ekujiyeni/kumandla kagesi (amabhodi amakhulu adinga ama-via amakhulu). Nciphisa ngokubala. Ukubhoboza emuva ukuze uthole amasignali asheshayo ukuze ususe izinti.

Ukuqondanisa umthombo, umugqa wokudlulisa, kanye nezithiyo zomthwalo ukuze kuncishiswe ukubonakaliswa. Kufezwe ngokulawula ububanzi bomugqa, isikhala, ukujiya kwe-dielectric, kanye nokuvumela (isb., ububanzi obungu-0.33mm be-microstrip engu-50Ω ku-FR4).

Izingxenye zokuhlukanisa; gcina izingxenye ezizwelayo kude nomsindo. Izindiza zamandla/zomhlaba emabhodini anezingqimba eziningi zokuvikela. Izindiza zomhlaba zizungeze amasignali esivinini esikhulu. Ukususa ama-capacitor; ukusekela okulungiselelwe.

Ukuhlukanisa okusebenzayo, ukuhlukanisa izingxenye ezizwela ukushisa, vala izingxenye ezivame kakhulu, beka phambili izingxenye ezinkulu, futhi uqinisekise ukuthi ukufakwa/ukugcinwa kulula.

Amandla aseduze kanye nezindiza zomhlabathi ukuze kuncishiswe ukugeleza kwamanzi. I-voltage enezixhumanisi. Ithusi eliqinile lezindiza zamandla; qinisa izindlela zamandla aphezulu.

Ama-vias okushisa kanye nezindiza zethusi ngaphansi kwezingxenye ezishisayo. Izisekelo zokushisa eziphezulu. Umklamo wokuhamba komoya; engeza ama-heat sink/fan uma kudingeka.

Indawo yembobo: ±0.1mm. Ama-via afakwe ipulasitiki: ±0.076mm. Ama-via angafakwanga ipulasitiki: ±0.05mm. Ububanzi bomugqa: ±10%-20%.

Umklami we-Altium (ofanele imiklamo emincane kuya kwephakathi), i-Cadence Allegro (enezingqimba eziningi ezinesivinini esikhulu), i-Mentor PADS (elula ukuyisebenzisa futhi esebenza kahle).

Ukubhoboza → Ukubhoboza ithusi → Ukuthwebula izithombe → Ukucwebezela → Ukuqopha → Imaski yokusongelwa → Isikrini sesilika → Ukuqeda umphezulu → Ukuphrofayilisha.

Izinkinga: Izindonga eziqinile, ama-burrs, ama-drill aphukile. Izixazululo: Shintsha ama-drill, yenza ngcono isivinini/ukuphakela, hlola izinto zokwakha.

Indima: Ukuqhuba izindonga zemigodi ukuze kuxhunywe ungqimba. Izilawuli: Ukwakheka kwesisombululo, izinga lokushisa (25-35°C), i-pH (11-12), ukuhlanzeka kwangaphambi kokwelashwa.

I-Photolithography: Ukunemba okuphezulu kwe-HDI, izindleko eziphezulu kanye nobunzima. Ukuphrinta kwesikrini: Izindleko eziphansi/imishini elula, ukunemba okuphansi.

Ukulawula ngokusebenzisa ukuminyana kwamanje, isikhathi sokufaka iplati, kanye nokuhlushwa kwesisombululo. Isibonelo, i-1oz (35μm) idinga imizuzu engama-20-30 ku-2-3A/dm².

Lawula ukuhlushwa kwe-etchant, izinga lokushisa, isikhathi, kanye nengcindezi yokufutha, futhi ulondoloze imishini njalo. Ukuhlushwa okuphezulu kungabangela ukuqushwa ngokweqile, kuyilapho ukuhlushwa okuphansi kuholela ekuqushweni okungaphelele. Gcina izinga lokushisa ku-45-55℃, nquma isikhathi ngokusekelwe ekujiyeni kwebhodi, njll., futhi uqinisekise ingcindezi efanayo ukuze uxhumane ngokugcwele.

Mboza isekethe ngokulinganayo ngaphandle kokulahlekelwa ukuphrinta, imigodi, noma amabhamuza. Ubukhulu bamafutha ebusweni bethusi: 10-18μm, nge: 5-8μm. Isikhala esifanele kusuka emaphethelweni esekethe ukuvimbela ukumbozwa ngokweqile kwephedi noma izingozi zesekethe esifushane.

Izinhlamvu kufanele zicace, ziphelele, zibe nomehluko omuhle wombala, zibekwe kahle ngaphandle kokuvimba izindawo ezibalulekile, futhi zibe nokunamathela okuqinile (khetha uyinki ofanele kanye nezinqubo zokubopha).

I-HASL: Izindleko eziphansi, ukushintshwa okuhle, ukuthamba okulinganiselwe. I-ENIG: Ibushelelezi, ukushintshwa okuhle kanye nokumelana nokugqwala, izindleko eziphezulu. Ithini lokucwilisa: Ukushintshwa okuhle, indawo ebushelelezi, isikhathi sokuphila eshalofini. I-OSP: Izindleko eziphansi, inqubo elula, ukugcinwa okufushane kokushintshwa.

Ukusika ngomshini (ukunemba okuphezulu, okufanele osayizi abakhulu abayinkimbinkimbi). Ukushaya (ukusebenza kahle okuphezulu, okufanele ukukhiqizwa ngobuningi okuvamile). Ukusika nge-laser (ukunemba okuphezulu kakhulu, izindleko eziphezulu, okufanele amaqoqo amancane amancane). Khetha ngokusekelwe esimweni, ukunemba, usayizi weqoqo, kanye nezindleko.

Hlola ubukhulu/ukujiya ngemva kokusika. Hlola indawo yembobo, usayizi, kanye nodonga ngemva kokubhoboza. Hlola ukujiya/ukufana kwethusi ngemva kokufaka iplati. Hlola ubuqotho besekethe ngemva kokusika. Hlola ikhwalithi yokuphrinta yemaski/izinhlamvu ze-solder. Hlola ukujiya/ukunamathela kwengubo ngemva kokuqeda ubuso. Hlola ukuma/imiphetho ngemva kokubunjwa.

Sebenzisa abahloli be-flying probe noma imishini ye-ICT. I-Flying probe ifanela amaqoqo/izinhlobo ezincane, ukuthola ama-open/shorts, njll. I-ICT iwukukhiqiza ngobuningi, ihlola ngokugcwele ukusebenza kukagesi ngezici ezikhethekile.

Thola ngokuxhumeka, izikhala, ubuqotho bethusi emabhodini anezingqimba eziningi. Hlola amalunga e-BGA solder kanye neziphambeko zangaphakathi (izinto zangaphandle, ukuhlukanisa) ngendlela engonakalisi.

Qoqa izithombe ngamakhamera okukhanya bese uqhathanisa nezindinganiso ukuze uthole amaphutha njengezingxenye ezingekho, ukungalungi kahle, ama-shorts. Kusetshenziswa ekuhlolweni kwesikhathi sangempela ngemuva kokuphrinta, ukubeka, ukugoqa kabusha ukuze kuthuthukiswe ukusebenza kahle kanye nekhwalithi.

Isivivinyo sokugoba (bheka imifantu kuma-engeli/imijikelezo ethile). Isivivinyo sokuwa (lingisa imithelela). Isivivinyo sokudlidliza (lingisa ukudlidliza ukuze uhlole ukunamathela kanye nesakhiwo).

Ngokwe-IPC-4552, i-ENIG ifanela imvamisa ephezulu/ukuthembeka okuphezulu (Ni: 3-5μm, Au: 0.05-0.1μm). I-OSP ishibhile (ubukhulu befilimu: 0.2-0.5μm, ifaneleka ukugcina isikhathi esifushane). I-HASL ivuthiwe (ubukhulu be-Sn >2.5μm, ukuthamba okungekuhle).

Lungisa ukuhlushwa kwesisombululo (i-etchant ene-asidi: CuCl₂ 180-220g/L, HCl 1.0-1.5mol/L), izinga lokushisa lingu-50-55℃. Uma ukhipha amanzi ngokweqile, yehlisa isivinini bese wandisa ingcindezi yokufafaza ibe yi-2-3bar.

Ngokwe-IPC-6012, amabhodi ajwayelekile anezingqimba eziningi ≤75μm, amabhodi e-HDI ≤50μm. Ukunemba kokubeka ukubhoboza nge-laser ±25μm, kulawulwa ngemishini yokuchayeka enembile kakhulu.

Izinto ze-FR-4: ubude obungu-≥345MPa, obunqamulene obungu-≥276MPa (ASTM D790). Ubukhulu obungu-1.6mm obungu-≥300MPa.

Ukuhlukaniswa kwe-Metallographic (IPC-TM-650, imbobo edlulayo ≥20μm, engaboni/engcwatshwe nge ≥18μm). Ukuhlolwa kwe-XRF okungabhubhisi (ukunemba ±0.5μm).

Ukushisa: 90-130℃ (60-120s). Indawo yokunamathisela: 240-260℃ (thinta amasekhondi angu-2-4). Izinga lokupholisa: 3-6℃/s (J-STD-003).

Okuvamile: 15-30μm (IPC-6012), izindawo eziminyene ≥20μm. Ukuphrinta kwesikrini: 20-25μm, ukupholisa okulula: 15-20μm.

Okuvamile: 6/6mil (0.1524mm). I-LDI + ukuqopha kwamakhemikhali: 3/3mil (0.0762mm). Amabhodi e-HDI: 1/1mil (0.0254mm).

Ukuze uthole ukuguquguquka, khetha i-resin plugging (ukujula ≥80% ngokujula, iphutha lokuba yisicaba ≤10μm). Ukuze uthole ukufudumala kuphela, khetha ukumboza (ububanzi bokumboza ≥0.1mm).

Ngokwe-IPC-J-STD-033, bhaka ku-125℃ amahora angu-4-8 (≤1.6mm: amahora angu-4, ＞1.6mm: amahora angu-8) ukuze unciphise okuqukethwe komswakama ngaphansi kuka-0.1%.

Ukurhabaxa okuphezulu kuthuthukisa umphumela wesikhumba kanye nokulahleka kwesignali. I-RTF foil Ra10GHz). I-VLP foil Ra

Ukuxubha ngomshini wokususa imfucuza (ingcindezi engu-0.3-0.5MPa, isivinini esingu-2-3m/min). Ukuxubha okuncane kwamakhemikhali (i-sodium persulfate 100-150g/L, 40-50℃, 1-2min).

Okuvamile: okunesiphelo esisodwa ±10%, umehluko ±8%. Isivinini esiphezulu (>1Gbps): okunesiphelo esisodwa ±5%, umehluko ±3%, kulungiswe ngobubanzi bomugqa, ubukhulu be-dielectric, ubukhulu bethusi.

Ngokwe-UL 796, izinto ze-FR-4 ≥1400V/mm ku-25℃/50% RH. Ibanga lokuhamba kwe-creepage elingu-1mm lihambisana no-100-200V.

Ububanzi/isikhala esincane somugqa, isilinganiso sobubanzi bembobo/iphedi (iphedi ≥imbobo +0.4mm lapho imbobo ≥0.3mm), isilinganiso sendawo yethusi (30%-70%), isilinganiso sesici sokubhoboza (≤8:1), ububanzi bebhuloho lemaski yokusoda (≥0.1mm).

Izimbangela: Ukungafani kwe-CTE, ukujiya okungalingani, ijika lokushisa elingafanele. Izixazululo: Khetha izinto ze-CTE ≤15ppm/℃, lawula ukubekezelela ukujiya ±0.05mm, lungiselela izinga lokushisa ≤3℃/s.

Ngokwe-IPC-TM-650, ≥10¹⁰Ω ngemva kwamahora angu-168 ku-85℃/85% RH, ≥10¹²Ω kwezicelo eziphezulu, ezidinga ukulawulwa kokuhlanzeka kwendawo.

Ama-vias angaboni: Ukubhoboza nge-laser/mechanical + plating, ukujula okungu-≤0.5mm, kokuxhumana kwendawo. Ama-vias angcwatshwe: Ukubhoboza nge-mechanical + lamination, okudinga ukulungiswa, kwezibonakaliso zesendlalelo sangaphakathi ukuze kuncishiswe amapharamitha e-parasitic.

I-Flying probe: Ukumbozwa >98%, kufanelekela ama-batches amancane/ubuningi obukhulu, kuhamba kancane (3-5s/point). Umbhede wezinzipho: Okusheshayo (

Ukwanda ngakunye kwe-1oz (35μm) kuphakamisa ukuhanjiswa kokushisa ngo-38%. I-foil engu-3oz ekusetshenzisweni kwamandla aphezulu kunciphisa ukukhuphuka kwezinga lokushisa ngo-15%-20% ngama-vias okushisa.

Okuvamile: 0.1mm. Amabhodi anobukhulu obuphezulu ane-LDI: 0.075mm, avimbela ukubopha okunamathelayo.

I-solder engalingani kuma-pad, ayanele ngokufaka i-solder, indawo engalingani.