Izigaba Zemodyuli

I-PCB yobumba

1. Yiziphi izinto ezivamile zamabhodi aqinile e-PCB e-ceramic?

Izinto ezivamile zifaka i-aluminium oxide (Al₂O₃, ubumsulwa obungu-60%-96%), i-aluminium nitride (AlN), kanye ne-beryllium oxide (BeO, ethathelwa indawo kancane kancane ngenxa yobuthi. I-aluminium oxide engu-96% idala ngaphezu kuka-60% wezicelo.
2. Kuyini ukuqhutshwa kokushisa kwezinto ezahlukene zobumba?

I-Al₂O₃ (96%) cishe ingu-25W/m・K, i-AlN ifinyelela ku-170-230W/m・K, kanti i-beryllium oxide (BeO) cishe ingu-250W/m・K.
3. Iyini i-coefficient yokwanda kokushisa kwamabhodi aqinile e-PCB e-ceramic?

I-aluminium oxide (6-7 ppm/°C), i-aluminium nitride (4.5 ppm/°C), iphansi kakhulu kune-FR4's 18-22 ppm/°C.
4. Kuyini ukumelana kokushisa kwe-substrates ze-ceramic?

Emazingeni okushisa egumbi, ukumelana kokushisa kwe-Al₂O₃ substrates kungu->10¹⁴Ω, kanti ukumelana kwe-AlN substrates kungu->10¹³Ω.
5. Iyini i-dielectric constant yamabhodi aqinile e-ceramic PCB?

I-dielectric constant ye-aluminium oxide engu-96% ingama-9.8 (1MHz), kanti eye-AlN ingama-8.5 (1MHz).
6. Ububanzi bokumelana nokushisa kwezingxenye ze-ceramic buyini?

Izinga lokushisa lokusebenza: -55℃ ~ 300℃, lingamelana namazinga okushisa aphezulu esikhashana adlula 800℃.
7. Ziqine kangakanani izinto zobumba?

Ubulukhuni be-Mohs bungu-6-9, i-aluminium oxide (96%) ifinyelela ezingeni lesi-7, ngobunzima obukhulu bokucubungula.
8. Kuyini ubuningi bezinto zobumba?

I-Al₂O₃ (96%) cishe ingu-3.85g/cm³, kanti i-AlN cishe ingu-3.26g/cm³.
9. Kungani amabhodi aqinile e-PCB e-ceramic efanelekile ukusetshenziswa kwemvamisa ephezulu?

Ukulahleka okuphansi kwe-dielectric (tanδ＜0.002), ukubambezeleka okuncane kokudluliselwa kwesignali.
10. Zimunca amanzi kangakanani izisekelo ze-ceramic?

Izinga lokumuncwa kwamanzi
11. Yiziphi izinqubo zokukhiqiza amabhodi aqinile e-PCB e-ceramic?

Inqubo yefilimu ejiyile (ukuphrinta kwesikrini), inqubo yefilimu encane (ukuchitheka/ukuhwamuka), inqubo yokudubula ngokubambisana (i-HTCC/LTCC), njll.
12. Uyini umehluko phakathi kwezinqubo ze-HTCC kanye ne-LTCC?

Izinga lokushisa lokushiswa kwe-HTCC lingu-1500-1600℃, i-LTCC ingu-850-900℃; i-LTCC ingahlanganisa izingxenye ezingasebenzi ngezindleko eziphakeme.
13. Ububanzi/isikhala esincane somugqa wezinto zobumba singakanani?

Inqubo yefilimu encane ingafinyelela ububanzi/isikhala somugqa esingu-10μm/10μm, kanti inqubo yefilimu ebanzi icishe ibe ngu-100μm/100μm.
14. Ungakanani ububanzi bembobo yokubhoboza obuncane bamabhodi aqinile e-PCB e-ceramic?

Ububanzi obuncane bembobo yokubhoboza nge-laser buyi-50μm, kanti ukubhoboza ngomshini kungu-100μm.
15. Yiziphi izindlela ezivamile zokwenza insimbi engaphezulu kwe-ceramic substrates ibe nkulu?

Ithusi elibopha ngqo (i-DBC), i-active metal brazing (i-AMB), ukuphrinta kwefilimu ejiyile.
16. Ububanzi bokujiya kwesendlalelo sethusi senqubo ye-DBC buyini?

Ubukhulu besendlalelo sethusi obujwayelekile bungu-0.1-0.3mm, kufika ku-0.5mm lapho ubuningi buphezulu.
17. Yiziphi izinzuzo zenqubo ye-AMB?

Amandla okubopha >25N/mm, izikhathi zomjikelezo wokushisa zidlula izikhathi eziyi-1000 (-40℃ ~ 150℃).
18. Liyini izinga lokuqina kobuso be-Ra lezinto ezisetshenziswa ngobumba?

Inqubo yefilimu encane Ra
19. Yiziphi izindlela zokusika ze-ceramic substrates?

Ukusika nge-laser, ukusika, ukusika ngomshini. Ukunemba kokusika nge-laser kungu-±25μm.
20. Iyini inzuzo ejwayelekile yokukhiqiza yamabhodi aqinile e-PCB e-ceramic?

Inzuzo yenqubo yefilimu encane cishe ingu-85%-90%, kanti inqubo yefilimu ebanzi cishe ingu-90%-95%.
21. Yini okufanele iphawulwe ekwakhiweni kwamabhodi aqinile e-PCB enziwe ngobumba?

Gwema ukwakheka kwe-angle ebukhali, i-fillet radius ≥0.2mm; engeza izimbobo zokushabalalisa ukushisa ezindaweni ezinokucindezeleka okujulile kokushisa.
22. Izisekelo ze-ceramic zixhunyaniswa kanjani nama-chips?

Ngokusebenzisa i-flip chip bonding, i-wire bonding, i-eutectic welding, njll. I-flip chip bonding inokumelana nokushisa okuphansi njengo-0.5℃/W.
23. Yiziphi izinhlelo zokusebenza ezivame kakhulu ezifanelekela amabhodi aqinile e-PCB e-ceramic?

Iziteshi zesisekelo ze-5G (ukulahleka kwesiginali
24. Iyini indima yezingxenye ze-ceramic kumadivayisi kagesi?

Nciphisa ukumelana nokushisa. Ukusebenzisa ama-substrate e-AlN kumamojula e-IGBT kunganciphisa ukumelana nokushisa kube yi-1.5℃/W.
25. Ingabe amabhodi aqinile e-PCB e-ceramic angasetshenziswa kuma-electronics ezimoto?

Ingasetshenziswa kumayunithi okulawula injini (ama-ECU), anokumelana okuhle kakhulu nokushisa okuphezulu kanye nokumelana nokudlidliza.
26. Kuyini ukusetshenziswa kwe-ceramic substrates ensimini ye-LED?

Izisekelo zokusabalalisa ukushisa ze-LED ezinamandla aphezulu, ezinokumelana nokushisa okuncishiswa kube ngaphansi kuka-3℃/W.
27. Ungakanani umthamo omkhulu wokuthwala wamanje wamabhodi aqinile e-PCB e-ceramic?

Nge-foil yethusi engu-1oz ngaphansi kokwenyuka kwezinga lokushisa elingu-10℃, ububanzi bomugqa ongu-1mm bungathwala cishe ama-2A.
28. Ungawufinyelela kanjani umklamo onezingqimba eziningi ze-substrates ze-ceramic?

Ihlanganiswe ngezinqubo zokudubulana, i-LTCC ingafinyelela izingqimba ezingaphezu kwe-100 okungenani.
29. Iyini amandla okuguquguquka kwamabhodi aqinile e-PCB e-ceramic?

Amandla okugobeka kwe-Al₂O₃ (96%) >300MPa, kanye nalawo e-AlN >350MPa.
30. Yiziphi izinzuzo ze-ceramic substrates ezindiza?

Ukumelana nemisebe (kungamelana nomthamo we-10⁶Gy), kulula (ubuningi obungaba yi-1/3 yezingxenye zensimbi).
31. Ungazihlola kanjani izivivinyo zokuthembeka zamabhodi aqinile e-PCB e-ceramic?

Ukuhlolwa komjikelezo wokushisa (-40℃ ~ 125℃, izikhathi eziyi-1000), ukuhlolwa kokushisa okumanzi (85℃/85% RH, 1000h).
32. Iyini indlela yokwehluleka komjikelezo wokushisa wezinto zobumba?

Ukuqhekeka kwezendlalelo ze-Metallization (izikhathi zomjikelezo wokuhluleka kwe-Al₂O₃ DBC substrate cishe izikhathi ezingu-500-800).
33. Iyini i-voltage yokumelana nokushisa yamabhodi aqinile e-PCB e-ceramic?

Ubukhulu obungu-1mm bungamelana no-≥5kV, i-voltage yokuqala yokukhipha okuyingxenye >2kV.
34. Iyini indinganiso yokuhlola ukunamathela kwezinto ezisetshenziswa ngobumba?

Ukuhlolwa kokuxebuka kwetheyiphu (itheyiphu engu-3M 610), akukho ukuhlukaniswa kwesendlalelo sensimbi.
35. Ingakanani impilo yenkonzo yamabhodi aqinile e-PCB e-ceramic?

Ngaphansi kwezimo zokusebenza ezijwayelekile, ingafinyelela iminyaka engaphezu kweyi-10, futhi ezindaweni ezinokushisa okuphezulu kanye nomswakama ophezulu, ifinyezwa ibe yiminyaka emi-5.
36. Ungazibona kanjani iziphambeko zangaphakathi ze-ceramic substrates?

Ukutholwa kwe-X-ray, i-microscope yokuskena ye-ultrasonic (C-SAM), enesisombululo esifinyelela ku-10μm.
37. Iyini indinganiso yokuhlola ukudlidliza yamabhodi aqinile e-PCB e-ceramic?

Ukudlidliza kwe-sinusoidal okungu-5-2000Hz, ukusheshisa okungu-5g, okuhlala amahora ama-2 ngaphandle kwemifantu.
38. Singakanani isikhathi sokuhlolwa kwe-salt spray ye-ceramic substrates?

Ukuhlolwa kwesifutho sikasawoti samahora angama-96 (isisombululo se-NaCl esingu-5%), akukho ukugqwala kwesendlalelo sokwenza insimbi.
39. Liyini izinga lokuvikelwa kwe-ESD lamabhodi aqinile e-PCB e-ceramic?

Imodeli yomzimba womuntu (HBM) >2kV, imodeli yomshini (MM) >200V.
40. Yiziphi izimo zokuhlolwa kokushaqeka kokushisa kwezingxenye ze-ceramic?

-40℃ ~ 150℃, isikhathi sokuguqulwa
41. Uyini umehluko wezindleko phakathi kwamabhodi aqinile e-PCB e-ceramic kanye ne-FR4?

Izindleko ze-ceramic substrates ziphindwe ka-5-10 kune-FR4, ikakhulukazi ngenxa yezinto eziyinkimbinkimbi nezinqubo.
42. Yiziphi izindlela zokunciphisa izindleko zamabhodi aqinile e-PCB enziwe ngobumba?

Ukukhiqizwa ngobuningi, ukwenza ngcono izinqubo (njengokusebenzisa ifilimu ejiyile esikhundleni sefilimu encane), ukukhetha izinto ezingabizi kakhulu (njenge-aluminium oxide engu-60%).
43. Yiziphi izinzuzo ze-substrates ze-ceramic uma ziqhathaniswa ne-substrates zensimbi?

Ukusebenza kahle kokufakwa kokushisa (izingxenye zensimbi zidinga izendlalelo zokufakwa kokushisa), futhi i-coefficient yokwanda kokushisa ihambisana kakhulu nama-chips.
44. Iyini izinga lezindleko zezinto zobumba ezahlukene?

I-aluminium oxide (60%)
45. Yiziphi izici ezithonya intengo yamabhodi aqinile e-PCB e-ceramic?

Uhlobo lwezinto, ubunzima benqubo, inani lezingqimba, usayizi, ubuningi be-oda.
46. Ingabe ama-substrate e-ceramic angahlanganiswa nama-PCB aguquguqukayo?

Kungatholakala ngenqubo eqinile, ngokukhuphuka kwezindleko okungu-20%-30%.
47. Iyini isilinganiso sezindleko ze-crap rate zamabhodi aqinile e-PCB e-ceramic?

Ibalelwa cishe ku-15%-20% wezindleko eziphelele, futhi ukuthuthuka kwesivuno kungakunciphisa kakhulu.
48. Iyini iphuzu lokulinganisela izindleko zokukhiqizwa kwezingxenye ze-ceramic ngobuningi?

Uma inani le-oda lidlula izingcezu ezingu-5,000, izindleko zeyunithi ziyancipha kakhulu.
49. Ingabe izindleko ze-R&D zamabhodi aqinile e-PCB e-ceramic ziphakeme?

Umjikelezo omude wokuthuthukiswa (izinyanga ezi-3-6), izindleko eziphezulu zesikhunta (cishe ama-yuan ayi-50,000-100,000).
50. Kuyini ukuqhathanisa izindleko zokushabalalisa ukushisa phakathi kwezingxenye ze-ceramic nama-PCB asekelwe ku-aluminium?

Ukusebenza kokushabalalisa ukushisa kwama-substrate e-AlN kuphindwe kathathu kunokwama-PCB asekelwe ku-aluminium, kodwa izindleko ziphakeme ngokuphindwe kane.
51. Ungawafaka kanjani amabhodi aqinile e-PCB e-ceramic?

Kuqiniswe ngezikulufo noma kuhlanganiswe ne-adhesive eqhuba ukushisa (ukumelana nokushisa
52. Yiziphi izidingo zokushisa kwe-soldering ze-substrates ze-ceramic?

Izinga lokushisa eliphakeme lokugoqa kabusha: 240-260℃, ubude
53. Ingabe amabhodi aqinile e-PCB e-ceramic angaphinde asetshenziswe?

Ingaphinde isebenze, kodwa izinga lokushisa eliphezulu lingabangela ukuqhekeka kwe-ceramic ngesilinganiso sempumelelo esingaba ngu-70%.
54. Ungahlanza kanjani ubuso bezinto zobumba?

Hlanza nge-IPA (isopropyl alcohol) yokuhlanza nge-ultrasonic imizuzu engaphansi kwe-10.
55. Ungawuvimbela kanjani ugesi ongashintshi kumabhodi aqinile e-PCB e-ceramic?

Gcina umswakama endaweni yokusebenza ku-40%-60% futhi ugqoke amabhande esihlakala alwa nokuma.
56. Ungawafanisa kanjani ama-substrate e-ceramic nama-heat sink?

Khetha izinto ezine-coefficients yokwandisa ukushisa efanayo bese ugcwalisa izikhala ngegrisi ye-silicone eqhuba ukushisa.
57. Ingabe amabhodi aqinile e-PCB e-ceramic angadlula ekusongweni kwamagagasi?

Akukhuthazwa, njengoba ukucindezeleka kokushisa kungabangela ukuqhekeka kwe-ceramic.
58. Yiziphi izidingo ze-torque zokufaka izinto zobumba?

I-torque yezikulufo ze-M3: 0.8-1.2N・m ukuze kugwenywe ukugxilisa ingqondo.
59. Ungawahlola kanjani amabhodi aqinile e-PCB e-ceramic ngemva kokusetshenziswa isikhathi eside?

Thola izindawo ezishisayo nge-infrared thermal imaging bese uhlola ukuxhumana ngokuhlola ukumelana.
60. Yiziphi izimo zokugcina izinto zobumba?

Isitoreji: umswakama
61. Yiziphi izindinganiso zomhlaba wonke zamabhodi aqinile e-PCB enziwe ngobumba?

IPC-6012 (Incazelo Yokusebenza Kwamabhodi Aprintiwe Aqinile), i-MIL-P-55110 (Izinga Lezempi).
62. Yiziphi izitifiketi ezidingekayo kuma-substrate e-ceramic?

Isitifiketi se-UL (esivimbela ilangabi), isitifiketi se-RoHS (esingenazo izidakamizwa eziyingozi), i-ISO 9001.
63. Yiziphi izidingo ezijwayelekile zempi zamabhodi aqinile e-PCB enziwe ngobumba?

Hlangana nokuhlolwa kwemvelo kwe-MIL-STD-810G okunezidingo eziqinile zokudlidliza kanye nokumelana nomthelela.
64. Yiziphi izitifiketi zemboni yezimoto ezidingekayo kuma-substrate e-ceramic?

Kudinga izitifiketi ze-AEC-Q100 (ama-chip) kanye ne-AEC-Q200 (izingxenye ezingasebenzi).
65. Yiziphi izindinganiso zemvelo zamabhodi aqinile e-PCB enziwe ngobumba?

Landela imithetho ye-EU REACH, evimbela ukusetshenziswa kwezinto eziyingozi njenge-lead ne-cadmium.
66. Iyini isilinganiso sokuvimbela ilangabi sezinto zobumba?

Isilinganiso se-UL 94 V-0 (akukho ukusabalala kwelangabi), inkomba ye-oxygen >30%.
67. Yiziphi izindinganiso zemboni yezokwelapha zamabhodi aqinile e-PCB e-ceramic?

Landela uhlelo lokuphathwa kwekhwalithi yedivayisi yezokwelapha lwe-ISO 13485.
68. Yiziphi izitifiketi zezindiza ezidingekayo kuma-substrate e-ceramic?

Kudingeka isitifiketi sesistimu yokuphathwa kwekhwalithi yezindiza i-AS9100.
69. Yiziphi izindinganiso ze-EMC zamabhodi aqinile e-PCB enziwe ngobumba?

Landela amazinga emisebe kagesi e-EN 55032, ukukhishwa okuqhutshwayo
70. Yiziphi izinhlangano zokuqinisekisa ukuthembeka kwezingxenye zobumba?

Izinhlangano zezitifiketi zeqembu lesithathu: i-SGS, i-TÜV, i-Intertek.
71. Yini okufanele uyenze uma ungqimba lwe-metallization lwe-ceramic substrates luwa?

Hlola inqubo yokubopha (isb., i-DBC copper foil oxidation) bese uphinda ucubungule indawo engaphezulu.
72. Ungalungisa kanjani imifantu emabhodini aqinile e-PCB e-ceramic?

Gcwalisa imifantu emincane nge-epoxy resin; buyisela i-substrate uma imifantu inzima.
73. Ungaxazulula kanjani ukugoqa okubandayo ngesikhathi sokugoqa i-substrate ye-ceramic?

Lungisa iphrofayili yokushisa kwe-soldering kanye nomsebenzi wokulawula i-flux (ibanga le-RA).
74. Ungabhekana kanjani nokuncipha okukhulu kokudluliselwa kwesignali kumabhodi aqinile e-PCB e-ceramic?

Lungiselela izintambo, sebenzisa izinto ezingashintshi ze-dielectric eziphansi, bese wengeza izendlalelo zokusekela phansi.
75. Ungaxazulula kanjani ukushaqeka kokushisa okubi ezindaweni zobumba?

Hlola izindlela zokuqhuba ukushisa bese uhlola ukumelana nokushisa (okuhlosiwe
76. Yini ebangela ukugoba ngokweqile kumabhodi aqinile e-PCB e-ceramic?

Inqubo yokusila engalingani noma ukungakhululeki ngokwanele kokucindezeleka kokushisa; thuthukisa inqubo yokukhiqiza.
77. Ungabhekana kanjani nokungcoliswa komhlaba ezintweni ezingaphansi kwe-ceramic?

Hlanza nge-plasma ukuze ususe izinsalela zezinto eziphilayo.
78. Ungayibona kanjani inkinga yokufakwa kwe-insulation kumabhodi aqinile e-PCB e-ceramic?

Ukuhlolwa kokumelana nokushisa (1000V DC) ukuthola izindawo zokuvuza.
79. Yini okufanele uyenze uma ungqimba lwensimbi lwe-ceramic substrates lubola?

Qinisa izembozo ezivikelayo (isb., i-nickel-gold plating) futhi ugweme amagesi agqwalisayo.
80. Ungathuthukisa kanjani amandla anganele okusebenza kwamabhodi aqinile e-PCB e-ceramic?

Khulisa ukujiya kwe-substrate (≥0.5mm) futhi ulungise ukwakheka kwekona.
81. Yiziphi iziqondiso zokuthuthukiswa kwamabhodi aqinile e-PCB e-ceramic?

Ukuncishiswa (
82. Yiziphi izinto ezintsha zobumba?

I-silicon nitride (Si₃N₄), enokushisa okuphezulu (100W/m・K) kanye namandla.
83. Yini engenzeka yokuhlanganisa izinto zobumba nokuphrinta kwe-3D?

Ukuphrinta kwe-ceramic 3D kufeze izakhiwo eziyinkimbinkimbi zokushabalalisa ukushisa ngokunemba okungu-50μm.
84. I-AI iluthuthukisa kanjani ukwakheka kwamabhodi aqinile e-PCB e-ceramic?

Lungiselela ukusatshalaliswa kokushisa ngama-algorithms okulingisa, unciphise umjikelezo wokuklama ngo-30%.
85. Iyini indlela yokusebenzisa izinto zobumba ezimotweni ezintsha zamandla?

Kusetshenziswa kumamojula kagesi e-SiC anesilinganiso sokukhula kwemakethe sonyaka esingaphezu kuka-20%.
86. Iyini isidingo samabhodi aqinile e-PCB e-ceramic ku-inthanethi yesathelayithi?

Ukulahlekelwa yi-dielectric okuphansi kuhlangabezana nezidingo zokuxhumana ezivame kakhulu, kanti kulindeleke ukuthi isidingo sikhule ngo-50% ngo-2025.
87. Yibuphi ubuchwepheshe bokukhiqiza obuluhlaza bezinto zobumba?

Ama-paste efilimu eqinile asekelwe emanzini athatha indawo yezinyibilikisi eziphilayo ukuze anciphise ukukhishwa kwe-VOC.
88. Yiziphi izinselele zokuhlanganisa izinto zobumba kanye nezinto zikagesi eziguquguqukayo?

Ubunzima bokufanisa ama-coefficients okwandisa ukushisa, okudinga izinto zesendlalelo se-buffer.
89. Yikuphi ukuthuthuka ekucutshungulweni kwamabhodi aqinile e-PCB e-ceramic ngesilinganiso esincane?

I-lithography ye-EUV ifinyelela amasekethe asezingeni le-10nm, okwamanje asesigabeni selabhorethri.
90. Iyini amandla okusetshenziswa kwe-ceramic substrates ekubaleni kwe-quantum?

Ukuqina okuphezulu emazingeni okushisa aphansi kungenza kube yizithwali zama-chip e-quantum.
91. Kuyini ukusetshenziswa kwamabhodi aqinile e-PCB e-ceramic ezithandweni zokushisa okuphezulu?

Ukumelana nokushisa okuphezulu: 800℃, okudinga izinto zokwakha insimbi ezishisa kakhulu (isb., indlela ye-molybdenum-manganese).
92. Yiziphi izidingo zokuvikela izinto zobumba emishinini yolwandle olujulile?

Imelana nengcindezi engu-100MPa futhi ivikeleke nge-IP68 ngokusebenzisa i-potting.
93. Iyini isivikelo sokukhishwa kwemisebe yamabhodi aqinile e-PCB e-ceramic embonini yenuzi?

Sebenzisa izinto zobumba ezimelana nemisebe (isb., i-silicon carbide) ukuvikela imisebe ye-neutron.
94. Yiziphi izinto ezibalulekile ezidizayinwayo ze-ceramic substrates kumadivayisi kagesi e-microwave?

Lawula ukuvimba kwesici (50Ω) futhi unciphise ukulahleka kwe-dielectric (tanδ
95. Iyini indlela yokusabalalisa ukushisa kwamabhodi aqinile e-PCB e-ceramic ku-LiDAR?

Sebenzisa izakhiwo zokushabalalisa ukushisa zesiteshi esincane ezinobukhulu bokugeleza kokushisa obufika ku-100W/cm².
96. Kuyini ukuhambisana kwezinto zobumba kumadivayisi ezokwelapha?

Kudingeka ukuphambuka kobuso, okuhambisana nokuhlolwa kwezinto eziphilayo kwe-ISO 10993.
97. Yiziphi izinzuzo zokusetshenziswa kwamabhodi aqinile e-ceramic PCB kuma-inverter e-photovoltaic?

Ukumelana nokushisa okuphezulu kanye nokushisa, okuthuthukisa ukusebenza kahle kohlelo ngo-1%-2%.
98. Iyini isidingo sezinto zobumba kumagridi ahlakaniphile?

Ihlangabezana nezidingo zokufakwa kwe-DC (HVDC) enamandla aphezulu, i-voltage imelana no-≥10kV.
99. Iyini idizayini yokuzamazama komhlaba yamabhodi aqinile e-PCB enziwe ngobumba asetshenziswa ngokunemba?

Sebenzisa amabhulakhethi abambe ukushaqeka futhi ugweme amaza omsindo angaphandle ukuze uthole amaza emvelo.
100. Iyini uhlelo lokuhlanganisa ama-substrate e-ceramic kuma-sensor e-IoT?

Hlanganisa nama-chip e-MEMS ukuze ufeze ukwakheka okuncane kanye nomklamo wamandla aphansi

I-PCB yobumba

1. Yiziphi izinto ezivamile zamabhodi aqinile e-PCB e-ceramic?

2. Kuyini ukuqhutshwa kokushisa kwezinto ezahlukene zobumba?

3. Iyini i-coefficient yokwanda kokushisa kwamabhodi aqinile e-PCB e-ceramic?

4. Kuyini ukumelana kokushisa kwe-substrates ze-ceramic?

5. Iyini i-dielectric constant yamabhodi aqinile e-ceramic PCB?

6. Ububanzi bokumelana nokushisa kwezingxenye ze-ceramic buyini?

7. Ziqine kangakanani izinto zobumba?

8. Kuyini ubuningi bezinto zobumba?

9. Kungani amabhodi aqinile e-PCB e-ceramic efanelekile ukusetshenziswa kwemvamisa ephezulu?

10. Zimunca amanzi kangakanani izisekelo ze-ceramic?

11. Yiziphi izinqubo zokukhiqiza amabhodi aqinile e-PCB e-ceramic?

12. Uyini umehluko phakathi kwezinqubo ze-HTCC kanye ne-LTCC?

13. Ububanzi/isikhala esincane somugqa wezinto zobumba singakanani?

14. Ungakanani ububanzi bembobo yokubhoboza obuncane bamabhodi aqinile e-PCB e-ceramic?

15. Yiziphi izindlela ezivamile zokwenza insimbi engaphezulu kwe-ceramic substrates ibe nkulu?

16. Ububanzi bokujiya kwesendlalelo sethusi senqubo ye-DBC buyini?

17. Yiziphi izinzuzo zenqubo ye-AMB?

18. Liyini izinga lokuqina kobuso be-Ra lezinto ezisetshenziswa ngobumba?

19. Yiziphi izindlela zokusika ze-ceramic substrates?

20. Iyini inzuzo ejwayelekile yokukhiqiza yamabhodi aqinile e-PCB e-ceramic?

21. Yini okufanele iphawulwe ekwakhiweni kwamabhodi aqinile e-PCB enziwe ngobumba?

22. Izisekelo ze-ceramic zixhunyaniswa kanjani nama-chips?

23. Yiziphi izinhlelo zokusebenza ezivame kakhulu ezifanelekela amabhodi aqinile e-PCB e-ceramic?

24. Iyini indima yezingxenye ze-ceramic kumadivayisi kagesi?

25. Ingabe amabhodi aqinile e-PCB e-ceramic angasetshenziswa kuma-electronics ezimoto?

26. Kuyini ukusetshenziswa kwe-ceramic substrates ensimini ye-LED?

27. Ungakanani umthamo omkhulu wokuthwala wamanje wamabhodi aqinile e-PCB e-ceramic?

28. Ungawufinyelela kanjani umklamo onezingqimba eziningi ze-substrates ze-ceramic?

29. Iyini amandla okuguquguquka kwamabhodi aqinile e-PCB e-ceramic?

30. Yiziphi izinzuzo ze-ceramic substrates ezindiza?

31. Ungazihlola kanjani izivivinyo zokuthembeka zamabhodi aqinile e-PCB e-ceramic?

32. Iyini indlela yokwehluleka komjikelezo wokushisa wezinto zobumba?

33. Iyini i-voltage yokumelana nokushisa yamabhodi aqinile e-PCB e-ceramic?

34. Iyini indinganiso yokuhlola ukunamathela kwezinto ezisetshenziswa ngobumba?

35. Ingakanani impilo yenkonzo yamabhodi aqinile e-PCB e-ceramic?

36. Ungazibona kanjani iziphambeko zangaphakathi ze-ceramic substrates?

37. Iyini indinganiso yokuhlola ukudlidliza yamabhodi aqinile e-PCB e-ceramic?

38. Singakanani isikhathi sokuhlolwa kwe-salt spray ye-ceramic substrates?

39. Liyini izinga lokuvikelwa kwe-ESD lamabhodi aqinile e-PCB e-ceramic?

40. Yiziphi izimo zokuhlolwa kokushaqeka kokushisa kwezingxenye ze-ceramic?

41. Uyini umehluko wezindleko phakathi kwamabhodi aqinile e-PCB e-ceramic kanye ne-FR4?

42. Yiziphi izindlela zokunciphisa izindleko zamabhodi aqinile e-PCB enziwe ngobumba?

43. Yiziphi izinzuzo ze-substrates ze-ceramic uma ziqhathaniswa ne-substrates zensimbi?

44. Iyini izinga lezindleko zezinto zobumba ezahlukene?

45. Yiziphi izici ezithonya intengo yamabhodi aqinile e-PCB e-ceramic?

46. ​​Ingabe ama-substrate e-ceramic angahlanganiswa nama-PCB aguquguqukayo?

47. Iyini isilinganiso sezindleko ze-crap rate zamabhodi aqinile e-PCB e-ceramic?

48. Iyini iphuzu lokulinganisela izindleko zokukhiqizwa kwezingxenye ze-ceramic ngobuningi?

49. Ingabe izindleko ze-R&D zamabhodi aqinile e-PCB e-ceramic ziphakeme?

50. Kuyini ukuqhathanisa izindleko zokushabalalisa ukushisa phakathi kwezingxenye ze-ceramic nama-PCB asekelwe ku-aluminium?

51. Ungawafaka kanjani amabhodi aqinile e-PCB e-ceramic?

52. Yiziphi izidingo zokushisa kwe-soldering ze-substrates ze-ceramic?

53. Ingabe amabhodi aqinile e-PCB e-ceramic angaphinde asetshenziswe?

54. Ungahlanza kanjani ubuso bezinto zobumba?

55. Ungawuvimbela kanjani ugesi ongashintshi kumabhodi aqinile e-PCB e-ceramic?

56. Ungawafanisa kanjani ama-substrate e-ceramic nama-heat sink?

57. Ingabe amabhodi aqinile e-PCB e-ceramic angadlula ekusongweni kwamagagasi?

58. Yiziphi izidingo ze-torque zokufaka izinto zobumba?

59. Ungawahlola kanjani amabhodi aqinile e-PCB e-ceramic ngemva kokusetshenziswa isikhathi eside?

60. Yiziphi izimo zokugcina izinto zobumba?

61. Yiziphi izindinganiso zomhlaba wonke zamabhodi aqinile e-PCB enziwe ngobumba?

62. Yiziphi izitifiketi ezidingekayo kuma-substrate e-ceramic?

63. Yiziphi izidingo ezijwayelekile zempi zamabhodi aqinile e-PCB enziwe ngobumba?

64. Yiziphi izitifiketi zemboni yezimoto ezidingekayo kuma-substrate e-ceramic?

65. Yiziphi izindinganiso zemvelo zamabhodi aqinile e-PCB enziwe ngobumba?

66. Iyini isilinganiso sokuvimbela ilangabi sezinto zobumba?

67. Yiziphi izindinganiso zemboni yezokwelapha zamabhodi aqinile e-PCB e-ceramic?

68. Yiziphi izitifiketi zezindiza ezidingekayo kuma-substrate e-ceramic?

69. Yiziphi izindinganiso ze-EMC zamabhodi aqinile e-PCB enziwe ngobumba?

70. Yiziphi izinhlangano zokuqinisekisa ukuthembeka kwezingxenye zobumba?

71. Yini okufanele uyenze uma ungqimba lwe-metallization lwe-ceramic substrates luwa?

72. Ungalungisa kanjani imifantu emabhodini aqinile e-PCB e-ceramic?

73. Ungaxazulula kanjani ukugoqa okubandayo ngesikhathi sokugoqa i-substrate ye-ceramic?

74. Ungabhekana kanjani nokuncipha okukhulu kokudluliselwa kwesignali kumabhodi aqinile e-PCB e-ceramic?

75. Ungaxazulula kanjani ukushaqeka kokushisa okubi ezindaweni zobumba?

76. Yini ebangela ukugoba ngokweqile kumabhodi aqinile e-PCB e-ceramic?

77. Ungabhekana kanjani nokungcoliswa komhlaba ezintweni ezingaphansi kwe-ceramic?

78. Ungayibona kanjani inkinga yokufakwa kwe-insulation kumabhodi aqinile e-PCB e-ceramic?

79. Yini okufanele uyenze uma ungqimba lwensimbi lwe-ceramic substrates lubola?

46. Ingabe ama-substrate e-ceramic angahlanganiswa nama-PCB aguquguqukayo?