i-pcb yesivinini esikhulu

Kuyadingeka ukulandela ukulawula okulinganayo (iphutha ngaphakathi kwe-±5mil), ukufanisa i-impedance (i-50Ω/75Ω evamile), kanye nesimiso sesikhala esingu-3W (okuphindwe kathathu ububanzi bomugqa wokuvimbela i-crosstalk).

Nciphisa ukubonakaliswa kwesignali ngokuqeda ama-resistors afanayo (uchungechunge emthonjeni noma okuhambisanayo esigungwini), ulawule ukuvimba okuqhubekayo kokulandelela, nokugwema ukulandelela kwe-engeli yesokudla (ukubonakaliswa kuyanda ngo-30%).

Yakhiwe yimigqa yesignali emibili enobude obulinganayo, ibanga elilinganayo, kanye ne-polarity ephambene, inekhono eliqinile lokulwa nokuphazamiseka kanye nesilinganiso sokwenqatshwa kwemodi evamile esingaphezu kwama-40dB.

Kwethula amandla e-parasitic (cishe i-0.5pF) kanye ne-inductance (cishe i-1nH). Inqubo yokubhoboza emuva iyanconywa ukuze kuncishiswe ubude be-stub.

Ngokuvamile kusetshenziswa izendlalelo ezingu-4-16, isendlalelo samandla kanye nesendlalelo somhlabathi kuxhumene eduze, kanti ubukhulu be-dielectric bulawulwa ku-0.1-0.3mm ukuqinisekisa ukuqina kwe-impedance.

Kuncike ebubanzini bomugqa/isikhala (njenge-0.1mm/0.1mm), futhi ubuningi bomzila endaweni ye-BGA bungafinyelela ku-100-150 traces/cm².

Khulisa isikhala semigqa, faka ukuhlukaniswa kwemigqa yomhlabathi, futhi ugweme ukuthambekela okuhambisanayo okungaphezu kuka-100mil, okunganciphisa ukuxabana ngamaphesenti angaphezu kuka-50%.

Kunciphisa ukulahleka kwesiginali (cishe i-3dB), konga isikhala somphezulu, futhi kwandisa ubuningi bomzila ngo-20%-30%.

Sebenzisa amathuluzi anjenge-SI9000 ukuze ubale i-impedance yesici esekelwe ku-dielectric constant (FR4 cishe 4.4), ububanzi bomugqa, kanye nobukhulu be-dielectric.

Sebenzisa okungenani ungqimba lwe-dielectric oluyi-0.1mm ukuze uhlukanise, futhi ugweme ukujikeleza endaweni ehlukanisiwe lapho uhlukanisa ungqimba lwamandla.

Izinto ezisebenzisa imvamisa ephezulu njengeRogers 4350B (Dk=3.66, Df=0.004) kanye ne-Isola FR408HR (Dk=3.8, Df=0.007).

I-dielectric constant ephansi (Dk) inciphisa ukubambezeleka kokudlulisela, kanti i-dielectric loss tangent ephansi (Df) inciphisa ukuncishiswa kwesignali (ukunciphisa ukulahlekelwa okungu-0.5dB nge-10GHz).

Ngokuvamile, kudingeka i-Tg≥150℃, kanti i-Tg≥170℃ iyadingeka ukuze kufakwe i-solder engenalo i-lead ukuqinisekisa ukuzinza kobukhulu emazingeni okushisa aphezulu.

Ukumuncwa kwamanzi kuzobangela ukuthi inani le-Dk likhuphuke (cishe ngo-5%), okwandisa ukubambezeleka kokudluliselwa kwesignali. Izinto ezinezinga lokumuncwa kwamanzi ngaphansi kuka-0.1% kufanele zikhethwe.

Kufanele ifane ne-CTE ye-chip (cishe i-6-10ppm/℃) ukuvimbela ukuqhekeka kwejoyinti le-solder okubangelwa ukucindezeleka kokushisa.

Ngezinhlelo zokusebenza ezivame kakhulu, khetha i-RTF (ephathwe emuva) i-copper foil enobulukhuni bomphezulu i-Ra

Kudingeka ihambisane nezinga le-UL94 V-0 ukuqinisekisa ukuphepha komlilo.

Uma izinga lokushisa lishintsha ngo-±20℃, ukuguquguquka kwe-Dk kungaphansi kuka-2% ukuqinisekisa ukudluliswa kwesignali okuzinzile.

Izinto ezilahlekelwa kancane zinezindleko eziphezulu. Khetha izinto ezifanele ngokuya ngemvamisa yesiginali (njenge-FR4 ethuthukisiwe ngaphansi kwe-10GHz).

Kudingeka imelane namakhemikhali anjengezimbobo kanye ne-soldering fluxes, ngesilinganiso sokugqwala

Ukubhoboza→ukucwebezela→ukudluliselwa kwephethini→ukuqopha→imaski yomshini wokusolda→ukwelashwa kwendawo (njengegolide lokucwilisa, i-OSP), ngokulawula okunembile okungu-±0.05mm.

Ingqimba yesiginali ≥18μm, kanye nengqimba yamandla ≥35μm ukuqinisekisa amandla okuthwala ugesi kanye nobuqotho besiginali.

Sebenzisa ubuchwepheshe be-laser direct imaging (LDI) obunokubekezelela ububanzi bomugqa obungu-±0.02mm kanye ne-etching factor ≥3.

Ubukhulu bemaski ye-solder bungu-0.02-0.05mm. Ubukhulu obukhulu buzothinta i-impedance. Kunconywa ukuvula amafasitela emigqa yesignali yokhiye.

Ukuze uthole amasignali avame kakhulu, khetha igolide lokucwilisa (ungqimba lwe-Au 0.05-0.1μm) noma ukwelashwa kobuso besiliva ngokumelana nokuxhumana

Izinga lokushisa eliphakeme kakhulu lokugoqa kabusha kwe-soldering lingu-245-255℃, kanti isikhathi sesigaba soketshezi singama-60-90s ukuqinisekisa ukuthi ubukhulu besendlalelo se-IMC esihlanganisiwe se-solder bungu-1-3μm.

Ukunemba kokubekwa kwezingxenye ze-0201 kungu-±0.05mm, kanti i-pin offset yamadivayisi e-QFP ingu-

Sebenzisa ukuhlanza okusekelwe emanzini noma okune-semi-aqueous ngama-ionic residues

Sebenzisa ukusika kwephaneli yokugaya noma ye-laser enokucindezeleka okusele

Bhaka ku-120℃ amahora angu-2-4 ukuze ususe umswakama ebhodini futhi uvimbele ukuqhuma kwebhodi ngesikhathi sokugoqa.

Sebenzisa i-network analyzer (njenge-Keysight N5244B) enobubanzi bokuhlola imvamisa obungu-1-40GHz kanye nephutha elingu-±5%.

Ukuhlolwa kwedayagramu yeso (ukuphakama kweso ≥80%, ububanzi beso ≥70%), ukuhlolwa kwepharamitha ye-S (S11 -3dB).

Thola izikhala zangaphakathi kumajoyinti e-BGA solder (isilinganiso se-void

Ingakwazi ukubona amasekethe amafushane, amasekethe avulekile, ama-offset okubekwa kwezingxenye (ukunemba ± 0.02mm), kanye namaphutha e-polarity.

Ukuhlolwa kokumbozwa kwama-key node kungu-≥95% ukuqinisekisa ukunemba kokuxhumeka kukagesi.

Akukho mshini odingekayo, ungahlola ama-PCB anomthamo ophezulu, futhi isivinini sokuhlola singamaphuzu angu-50-100 ngomzuzu.

Izinga lokushisa eliphezulu kanye nomswakama (85℃/85% RH, 1000h), ukushaqeka kokushisa (-40℃ ~ 125℃, imijikelezo eyi-1000).

I-voltage yokuhlola ingu-500V, kanti ukumelana kokufakwa kokushisa kungu-≥10GΩ ukuqinisekisa ukuhlukaniswa kwesignali.

I-voltage yokuhlola ingu-1000V umzuzu owodwa ngaphandle kokuphuka noma ukushaqeka.

Faka esithandweni sethini esingu-235℃, isikhathi sokumanzisa singaphansi kwemizuzwana emi-3 nendawo yokucwilisa ithini ingaphezulu kwama-95%.

Ukulahleka okukhulu kwezinto ezibonakalayo, ukungafani kwe-impedance, imikhondo emide kakhulu (ukuncipha kuyanda ngo-2dB ngo-10cm), kanye nama-via amaningi kakhulu.

Lungiselela ama-resistor okuqeda, lungisa i-trace topology, futhi unciphise inani lama-vias nama-connectors.

Engeza ungqimba lokuvikela, lungisa indlela yokuqondisa, bese ufaka ukuhlukaniswa komugqa womhlaba ukuze unciphise ukuxabana ngo-30%-50%.

Khulisa ama-capacitor okuhlukanisa (inhlanganisela engu-0.1μF+10μF), lungiselela ukwakheka kwesendlalelo samandla, futhi ufushanise indlela yokunikezwa kwamandla.

Ukucindezeleka okukhulu kokushisa, ukungafani kwe-CTE, ijika lokushisa elingafanele lokugoqa, kanye nesilinganiso sokulungisa kabusha kufanele sibe ngaphansi kuka-0.5%.

Sebenzisa i-flying probe tester noma i-micro-ohmmeter enokunemba okufika ku-0.1mΩ kanye nendawo ebekwe kuyo

Isekela amabhendi emvamisa yamagagasi angamamilimitha (24-40GHz), ukulahlekelwa okuphansi (ukulahlekelwa

Izinga lokudluliswa kwe-100Gbps+, ubuqotho obuhle besiginali, kanye nokusekelwa kobuchwepheshe be-high-density interconnect (HDI).

Izingqimba zamandla eziningi, ama-backplane asheshayo (ukulahlekelwa

Ukuphatha idatha enkulu (ububanzi be-bandwidth 1TB/s+), kudinga ukulawula ukukhuluma okuphambene kanye nokubambezeleka, ngobuningi bezintambo obudlula ama-trace angu-200/cm².

Izinga lokushisa lokusebenza lingu--40℃ ~ 125℃, lidlula isitifiketi se-AEC-Q100, kanye nempilo yesevisi engaphezu kweminyaka eyi-15.

Idizayini elula (ubuningi amahora angu-100,000), kanye nokumelana nemisebe.

Ukuhambisana nezindinganiso zokuphepha kukagesi kwezokwelapha (IEC 60601), ngokuphazamiseka kwesignali

Ukwengeza izendlalelo zokuhlukanisa, ukusebenzisa izixhumi ezivikelwe, ukuthuthukisa izinhlelo zokumisa, kanye nekhono lokulwa nokuphazamiseka elithuthukisiwe ngo-40%.

Ukusebenzisa izinto ezivamile (njenge-FR4), ukwenza lula izinqubo, kanye nokwenza ngcono imiklamo, ngezindleko ezincishisiwe ngo-20%-30%.

Ukusebenzisa ama-PCB asekelwe ensimbi noma ama-thermal ngokusebenzisa ama-array, ukumelana nokushisa kwehliswe ngo-30% kanye nokushisa kobuso

I-Ansys HFSS, i-Cadence Sigrity, i-ADS, enephutha lokunemba kokulingisa

Ukwakha imodeli yenethiwekhi yamandla nokuhlaziya umsindo wamandla (i-ripple

Isikhathi sokukhuphuka kwesignali yokufaka (

Ukuchaza imithombo yokuphazamiseka kanye nemigqa yesisulu, ukusetha isikhala nobude, ngomphumela wokulingisa kanye nephutha lokulinganisa

Ukuhlaziya ukulahlekelwa kokudluliswa kwesignali (S21) kanye nokubonakaliswa (S11) ukuze kuhlolwe ukusebenza kohlelo.

Ukusebenzisa ukulingisa isizinda sesikhathi noma isizinda semvamisa, ukugxila emsindweni kubhendi yemvamisa ye-100kHz-100MHz.

Ukubikezela ukuqina kwemisebe (

Ukusetha izinga lokushisa elizungezile, i-coefficient yokushabalalisa ukushisa, kanye nokusetshenziswa kwamandla, ngephutha lokusabalalisa ukushisa

Ukuqhathanisa i-impedance, imidwebo yamehlo, kanye nama-S-parameter, nokuhlaziya izimbangela zomehluko (njengemingcele ye-parasitic kanye namaphutha enqubo).

Ukuhlaziywa okuphelele kwesignali, amandla, ukushisa, kanye nokusebenza kahle komshini, kanye nokusebenza kahle komklamo okuthuthukisiwe ngo-40%.

I-IPC-6012 (izincazelo zokusebenza kwebhodi eliphrintiwe), i-IEEE 802.3 (izindinganiso ze-Ethernet), i-JEDEC (izindinganiso zokupakisha).

I-GB/T 4588 (imininingwane ejwayelekile yamabhodi wesekethe aphrintiwe), i-SJ/T 11364 (ukulawulwa kokungcola kwemikhiqizo yolwazi lwe-elekthronikhi).

Kubandakanya ukulawulwa kwe-impedance, imithetho yokuxhuma, ukwakheka kwe-layer stack, izidingo ze-EMC, njll., ingqikithi yezigaba ezingu-12 ezinkulu zezincazelo.

Ukubekezelelana kobubanzi bomugqa ±10%, ukubekezelelana kobubanzi bembobo ±0.05mm, ubulukhuni bomphezulu Ra

Ukuhambisana ne-RoHS 2.0 (ukunciphisa izinto eziyingozi eziyisithupha), i-REACH (ukulawula izinto ezingu-224).

Kudingeka uphumelele izitifiketi ze-UL, CE, FCC ukuqinisekisa ukuphepha kukagesi kanye nokuhambisana kwe-electromagnetic.

Kulandelwa uhlelo lokuphatha ikhwalithi lwe-ISO 9001, olunenkomba yamandla enqubo i-CPK ≥1.33.

Ukuhambisana ne-GJB 362B (izincazelo ezijwayelekile zamabhodi aphrintiwe), kanye nezimfuneko eziqinile zokuzivumelanisa nezimo zemvelo.

Ukuhambisana ne-ISO 13485 (uhlelo lokuphatha ikhwalithi yamadivayisi ezokwelapha), ngezimfuneko zokulandelela eziyi-100%.

Ukulandela i-IATF 16949, ngesilinganiso sokufaneleka kokuvumelana komkhiqizo ≥99.5%.

Amaza aphezulu (amabhendi emvamisa ye-terahertz), ukulahleka okuphansi (i-Df

I-AI ithuthukisa izintambo (ukusebenza kahle kukhuphuke ngo-60%), ibikezela izinkinga zobuqotho besignali, futhi ikhiqize ngokuhlakanipha imithetho yokuklama.

Ukufeza ukukhiqizwa okusheshayo kwezakhiwo eziyinkimbinkimbi ngokunemba okungu-0.1mm kanye nokwehliswa kwezindleko okungu-30%.