Izigaba Zemodyuli

Ukuphathwa kwezinto zokushisela

1. Yiziphi izilinganiso zezingxenye kanye nezinzuzo zokusebenza kwe-solder evamile engenalo i-lead SAC305?

Ukwakheka: Sn96.5Ag3.0Cu0.5, iphuzu lokuncibilika elingu-217℃. Izinzuzo: Ukumelana nokushiswa kwe-oxidation okuthuthukisiwe okungu-30%, kuhambisana neziqondiso zezemvelo ze-RoHS, ukuthembeka okuqinile kokushisa okuphezulu, kanye nokugcinwa kwamandla okusebenza okungaphezu kuka-85% ngemva kokuguga ku-150℃ amahora ayi-1000.
2. Iphuzu le-eutectic lama-solder alloys lithinta kanjani inqubo yokushisela?

Ama-solder e-Eutectic (njenge-Sn63Pb37) awanayo indawo yokuhlala ndawonye eqinile lapho encibilika, enefasitela elincane lokushisa lokushisela, elidinga izinga lokushisa eliphakeme lokushisela kabusha libe ngu-50-70℃ ngaphezu kwendawo yokuncibilika; ama-solder angewona a-eutectic anendawo yokuhlala ndawonye eqinile, edinga ukulawulwa okunembile kokushisa ukuze kugwenywe ukushisela okunganele.
3. Ungahlukanisa kanjani izimo zokusetshenziswa kokuguquguquka ngamazinga ahlukene omsebenzi?

Ibanga lika-R (umsebenzi ophansi): Izimo zokuhlanzeka okuphezulu njengezindiza kanye nezokwelapha, kanye nokumelana nokufakwa kwezinsalela ≥10¹²Ω;

Izinga le-RA (umsebenzi ophakathi): Ama-elekthronikhi abathengi, ayakwazi ukulawula izinga lokukhubazeka kokushisela ≤0.5%;

Izinga le-SA (umsebenzi oqinile): Izindawo ezingcoliswe kakhulu, ezidinga ukuhlanzwa okuqinile ukuze kuvinjelwe ukugqwala.
4. Yiziphi izindinganiso zokuqukethwe kwe-flux zentambo ye-solder kanye nomthelela wazo ekushiseleni?

Okuqukethwe okujwayelekile: 1.0%-3.0%. Okuqukethwe okuphansi kakhulu kuholela ekususweni okwanele kwamafilimu e-oxide, okwandisa izinga lokukhubazeka ngo-20%-30%; okuqukethwe okuphezulu kakhulu kubangela izinsalela eziningi ezithinta ukufudumala, kanye no-1.8%-2.2% ovame ukusetshenziswa ekuhlanganisweni kwe-elekthronikhi.
5. Ukusatshalaliswa kosayizi wezinhlayiya zempuphu yensimbi ku-solder paste kuthinta kanjani ukusebenza kokuphrinta?

Uhlobo 3 (25-45μm): Kufanelekela ama-pad anesikhala esingaphezu kuka-0.5mm, izinga lokukhubazeka kokuphrinta
Uhlobo 4 (20-38μm): Ifanelekela isikhala esincane esingu-0.3mm, ivame ukuvaleka nge-stencil ngemingcele engafanele (amathuba +15%).
6. Ububanzi obuvumelekile bokushintshashintsha kwezinga lokushisa kanye nomswakama endaweni yokugcina i-solder paste buyini?

Izinga lokushisa: 0-10℃ (ngaphakathi kokuguquguquka kwe-±2℃), umswakama: RH≤60%. Izinga lokushintsha kwe-viscosity likhuphuka ngo-5%-8% ngosuku lapho ukuguquguquka kwezinga lokushisa kudlula i-±2℃, futhi umswakama owedlulele usheshisa i-oxidation.
7. Yisiphi isikhathi sokugcina esiphezulu sentambo ye-solder engavulwanga?

Intambo yokusoda equkethe i-lead: iminyaka engu-3-5 (15-25℃, RH≤60%);

Ucingo olungenalo umthofu: iminyaka engu-2-3. Ukuxinana kwe-oksijini kuyaqina ngale kwaleso sikhathi, kanti ukuvuleka okungenzeka kukhuphukele ku-10%-15%.
8. Kungani uketshezi kufanele lugcinwe kude nokukhanya?

Izingxenye ezisebenzayo ze-flux (njenge-organic acid) zibola ngokushesha lapho zivezwa ekukhanyeni, umsebenzi wehla ngo-40% ngemva kwenyanga eyodwa yokuvezwa ekukhanyeni, kuyilapho kwehla ngo-10%-15% kuphela ezinyangeni eziyisithupha zokugcina ngaphandle kokukhanya.
9. Kungani ukuxubha kungavunyelwe ngesikhathi sokubuyiselwa kwezinga lokushisa kwe-solder paste ethathwe endaweni ebandayo yokugcina?

Ukuxuba kubangela izinga lokushisa langaphakathi elingalingani, okuholela ekuqineni kwendawo ngaphambi kwesikhathi noma ekuguqukeni okungavamile kwe-solvent. Ukuphambuka kwe-viscosity ≤5% ngemva kwamahora angu-4-6 okubuyiselwa kwezinga lokushisa, kuyilapho i-违规搅拌 (ukuxuba okungalungile) kungabangela ukuphambuka kufike ku-20%.
10. Uyini umjikelezo wokulinganisa wezinto zokurekhoda izinga lokushisa nomswakama ezindaweni zokugcina i-solder?

Linganisa njalo ezinyangeni eziyi-6 ukuqinisekisa iphutha lokushisa ±1℃ kanye nephutha lomswakama ±3%RH, ugweme izimo zokugcina ezingalawuleki.
11. Yisiphi isikhathi esiphezulu sokusetshenziswa kwe-solder paste evuliwe emshinini wokunyathelisa?

Ukusetshenziswa okuqhubekayo akufanele kudlule amahora angu-8 ekamelweni lokushisa elingu-20-25℃ kanye ne-RH≤60%. Ukuqina kuyanda ngo-30%-50% uma kudlula, kanti izinga lokukhubazeka kokuphrinta likhuphuka lifike ku-15%-20%.
12. Ungawunquma kanjani umjikelezo wokufaka esikhundleni uketshezi lwe-solder ethangini lokugoqa lamagagasi?

Nquma ngomthwalo wokukhiqiza kanye nenani lamanzi okukhipha, shintsha yonke i-PCB engu-500-1000㎡ ekhiqizwayo; shintsha kusengaphambili uma okuqukethwe kwethusi >0.8%, kungenjalo izinga lokukhubazeka likhuphuka ngo-25%-35%.
13. Buyini ubudlelwano phakathi kokusetshenziswa kwentambo ye-solder kanye nosayizi wejoyinti ye-solder ekushiseni okukhethayo?

Ukusetshenziswa kukhuphuka ngo-15%-20% kukho konke ukwanda okungu-0.1mm kobubanzi bejoyinti le-solder. Ukusetshenziswa kungaba yi-预估 (kubikezelwe) ngokubala ivolumu yejoyinti le-solder (ubuningi be-SAC305 7.4g/cm³).
14. Iyiphi inhlanganisela efanele yokushisa kwe-soldering iron tip kanye nesikhathi soku-soldering eku-welding ngesandla?

Izinga lokushisa: 350-380℃, isikhathi: imizuzwana emi-2-3. Ngaphezu kwamasekhondi angu-400℃ noma ngaphezulu kwamasekhondi ama-5 konakalisa kalula izingxenye,
15. I-engeli ye-squeegee iyithinta kanjani ikhwalithi yokuphrinta ngesikhathi sokuphrinta nge-solder paste?

I-engeli engu-45°-60° ingcono kakhulu. I-60° ithambekele ekuchapheni nasekuqhekekeni, kanti izinga lokukhubazeka likhuphuka ngo-8%-10% kukho konke ukuphambuka okungu-5°.
16. Ungazithola kanjani izimbobo zangaphakathi emajoyintini e-solder nge-X-Ray?

I-X-Ray ingathola izikhala ezinobubanzi obungu-≥0.1mm. Izinga elijwayelekile le-IPC-A-610: indawo engenalutho engu-≤25% yemikhiqizo yekilasi B, ≤15% yekilasi C, enezikhala eziningi ezithinta ukushabalaliswa kokushisa namandla.
17. Yiziphi izimo ezijwayelekile kanye nobubanzi bokuphambuka obuvumelekile bokuhlolwa kwe-viscosity ye-solder paste?

Izimo: 25±0.5℃, isivinini sokujikeleza esingu-5rpm, vivinya imizuzwana engama-60. I-viscosity ejwayelekile ye-SAC305: 80-120Pa·s, ukulungiswa kuyadingeka uma ukuphambuka kudlula ±15%.
18. Yiziphi izindlela zokuhlola amandla okudonsa kanye nezindlela zokufaneleka zamajoyinti e-solder?

Hlola ngesivivinyo sokudonseka ngesivinini esingu-5mm/min. ≥0.5N sephakheji engu-0603, ≥1.5N sezintambo ze-QFP, amandla anele okwehluleka uma kudlidlizwa.
19. Ungasihlaziya kanjani isakhiwo esincane samajoyinti e-solder ngokuhlukanisa i-metallographic?

Bheka ngaphansi kwe-microscope ngemva kokugaya nokupholisha, ugxile ekujiyeni kwengqimba ye-IMC (1-3μm ye-SAC305), >5μm kwenza amalunga e-solder aqhekeke futhi anciphise isikhathi sokuphila ngaphezu kuka-50%.
20. Iyini indinganiso yokuhlola ukuhlanzeka kwama-ion ezinsalela ze-flux?

Ukuhlolwa nge-ion chromatography, insalela ye-ion ngeyunithi ngayinye ≤1.5μg/cm² (ngokulingana ne-NaCl), ukweqisa kubangela kalula ukufuduka kwe-electrochemical short circuits.
21. Izinga lokushisa esigabeni sokushisa ngaphambi kokushintsha kwe-soldering lithinta kanjani ukushisela?

Izinga lika-1-3℃/s lifanelekile. >5℃/s livame ukuqhekeka yingcindezi yokushisa kwezingxenye,
22. Enqubweni yokusongelwa kwamagagasi amabili, yiziphi izindima kanye nezilungiselelo zamapharamitha wegagasi langaphambili negagasi langemuva?

Igagasi langaphambili (igagasi eliyaluzayo): Ukuphakama kwamagagasi kungu-30-50mm, isivinini esingu-2-3m/min, likhipha ukugeleza nomoya;

Igagasi elingemuva (igagasi elibushelelezi): Ukuphakama kwamagagasi 20-30mm, isivinini 1.5-2.5m/min, kubumba amalunga e-solder.
23. Ungakunciphisa kanjani ukuwa kwe-solder paste ngokwenza ngcono umklamo wokuvula i-stencil?

Sebenzisa izimbobo ezinezitebhisi kanye namakhona ayindilinga asikwe nge-laser. Nciphisa ukuvuleka kwe-QFP okungu-0.3mm pitch ngo-10%-15% bese wengeza amakhona ayindilinga angu-0.05mm, unciphise izinga lokugoqa kusuka ku-12% kuya ku-3%-5%.
24. Uyini umthelela wokuvikelwa kwe-nitrogen ekhwalithini yokushisela ekushiseni okukhethiwe?

Indawo ene-nitrogen (okuqukethwe komoya-mpilo
25. Ungalungisa kanjani izinga lokupholisa lokugoqa kabusha ngokushoda kwe-PCB?

Ngokwanda ngakunye okungu-0.5mm kobukhulu be-PCB, yehlisa izinga lokupholisa ngo-1-2℃/s. Ukupholisa okusheshayo kakhulu (>5℃/s) kwamabhodi amakhulu avame ukuqhekeka, okuhamba kancane kakhulu kuthinta ukusebenza kahle futhi kubangele ukubola.
26. Yisiphi isimiso sokufanisa phakathi kwesivinini sokususa umshini wokunyathelisa kanye ne-solder paste viscosity?

Uma i-viscosity iphakeme, isivinini sokususa sihamba kancane. I-viscosity ephezulu (>150Pa·s): 1-2mm/s, i-viscosity ephansi (
27. Buyini ubudlelwano phakathi kwenani lezindawo zokushisa ze-reflow soldering kanye nokushisela kwebhodi lesifunda eliyinkimbinkimbi?

Imishini enezindawo zokushisa eziyi-8 noma ngaphezulu ifaneleka kakhulu kumabhodi wesekethe anomthamo ophezulu, ithuthukisa izinga lokufaneleka kusuka ku-85% kuya ngaphezu kuka-95% uma kuqhathaniswa nemishini enezindawo eziyi-6, ngokulawula izinga lokushisa okunembe kakhudlwana.
28. Iyini ithonya ledivayisi yokuxuba ethangini lokugoqa lamagagasi ekufaneni koketshezi lokugoqa?

Ijubane lokujikeleza elingu-20-40rpm linikeza ukufana okuhle kakhulu koketshezi oluhlanganisiwe. Ngemva kokuyeka ukuxuba, umehluko wokushisa phakathi kwezingqimba eziphezulu nezingezansi ukhuphuka ngo-3-5℃ ngehora, kanye nokuphambuka kokwakheka kanye nesilinganiso sokukhubazeka ngo-10%-15%.
29. Uyini umthelela wokunemba kwevolumu yesipreyi sethini se-nozzle yokushisela ekhethiwe emajoyintini amancane okushisela?

Ukunemba kufanele kulawulwe ngaphakathi kuka-±0.01mg. Kumaphakheji ka-0201, ukuphambuka >±0.02mg kwandisa amathuba okushintshashintsha/ukunganeli kwe-soldering ngo-40%-50%, okuthinta kakhulu isivuno.
30. Iyini ibanga lokulawula ukungezwani kohlelo lokudla ucingo lwe-solder?

Ukucindezeleka okungu-0.8-1
31. Iyini inqubo ejwayelekile kanye nezinyathelo zokuphepha zokusebenzisa kabusha i-solder engenalo i-lead?

Inqubo: Iqoqo elihlukanisiwe → ukususwa kokuncibilikisa nokungcola → ukulungiswa kokwakheka. Izinga lokushisa lokuncibilikisa lingu-280-320℃, okuqukethwe yithini ≥99.5% ngemva kokususwa kokungcola. Vimbela ukungcola kwensimbi esindayo; amanzi angcolile kumele asuswe futhi avuthelwe ukuze ahlangabezane nezindinganiso zokukhishwa kwe-GB 8978-1996.
32. Yiziphi izingxenye eziyinhloko zamagesi aguquguqukayo agelezayo kanye nemikhawulo yokuchayeka kwawo emsebenzini?

Iqukethe i-abietic acid kanye ne-isopropanol. Imikhawulo yokuchayeka emsebenzini: i-abietic acid 5mg/m³ (isilinganiso esilinganiselwe isikhathi), i-isopropanol 980mg/m³. Hlomisa ngomoya osebenza kahle kakhulu ukuvimbela ukucasuka kokuphefumula kanye nokwemizwa.
33. Iyini ikhodi yokuhlukaniswa kwemfucuza eyingozi kanye nezidingo zokulahlwa kwezinto zokuxuba imfucuza?

Ihlukaniswe njenge-HW49 (ikhodi 900-041-49), kumele ilahlwe amayunithi afanelekayo, ihambisane neMigomo Yokuphathwa Kwamadokhumenti Okudlulisa Imfucuza Eyingozi, futhi ivimbele ngokuqinile ukuxubana nemfucuza yasekhaya.
34. Yiziphi izidingo zezinga lokumelana nokuqhuma kwezindawo zokugcina i-solder?

I-Ex dⅡBT4 evikela ukuqhuma iyadingeka ukuze kugcinwe ukugeleza okuvuthayo. Sebenzisa izibani/amaswishi angaqhumi futhi uvimbele imishini ekhiqiza inhlansi. Ukungalandeli imithetho kwandisa ingozi yomlilo/ukuqhuma ngo-30%-50%.
35. Ungakuvimbela kanjani ukubola kwesibili kwendle ye-solder ngesikhathi sokugcina?

Gcina ezitsheni ezomile ezivalekile ezine-antioxidant engu-0.5%-1.0%BHT. Ukugcwala kwe-oksijini kuyanda ngo-50% emahoreni angama-24 uma kuvezwa; isitoreji esivalekile sandisa isikhathi sokuvuselela sibe izinyanga ezi-3-6.
36. Unganciphisa kanjani izindleko ngokwenza ngcono ukujiya kokuphrinta kwe-solder paste?

Nciphisa ukujiya kusuka ku-0.15mm kuya ku-0.12mm ngaphansi kokuhambisana nekhwalithi, unciphise ukusetshenziswa ngo-20%-25%. Ukulungiswa kwe-DOE kunciphisa izindleko nge-PCB ngayinye ngo-0.3-0.5 RMB.
37. Iyini isilinganiso sokulahlekelwa kwemboni kwentambo yomshini kanye nezindlela zokunciphisa?

Isilinganiso semboni: 8%-12%. Izinyathelo: Ukuphakelwa ngocingo okuzenzakalelayo (kunciphisa ukulahlekelwa ngo-3-5%), izinqubo ezithuthukisiwe (kunciphisa ukushiswa okungenalutho ngo-15%-20%), ukuphinda kusetshenziswe ngocingo olulahliwe (izinga lokubuyisa elingu-70%-80%), kungancipha ku-5%-8%.
38. Iyini uhlelo lokuhlola ukusebenza kwezindleko zama-solder paste avela kumikhiqizo ehlukene?

Izinkomba: Intengo yeyunithi, okuqukethwe kwensimbi (+5% izindleko nge-+1%), izinga lokukhubazeka kokuphrinta (-0.5 RMB/PCB nge--1%), isikhathi sokuphila kweshelufu (-3% izindleko zokugcina nge-+1 ngenyanga), kubalwa ngenkomba enesisindo.
39. Unganciphisa kanjani udoti we-wave soldering ngokusebenzisa ukulungiswa kwenqubo?

Izinyathelo: Ukuvikelwa kwe-nitrogen (kunciphisa ukungcola ngo-40%-60%), uwoyela wokulwa nokungcola (kunciphisa izinga lokungcola ngo-50%-70%), ukulawulwa kwezinga lokushisa ±2℃, kunganciphisa ukungcola kusuka ku-5kg/amakhithi kuya ku-2-3kg/amakhithi.
40. Buyini ubudlelwano phakathi kokushintshana kwempahla ethengiswayo kanye nokuhlala enhlokodolobha?

Ukwandisa inzuzo kusukela ezikhathini ezi-4 kuya kwezi-6 ngonyaka kunciphisa izindleko zokuqashwa kwenkampani ngo-33%. Thuthukisa ukusebenza kahle ngokuthenga i-JIT, isitokwe esilungisiwe (ukunciphisa okungu-20%-30%), kanye nomjikelezo omfushane (ukunciphisa izinsuku eziyi-15-20).
41. Yiziphi izinqubo ezibalulekile okufanele zigxilwe kuzo ngesikhathi sokuhlolwa kwesitifiketi se-ISO 9001 kwabahlinzeki be-solder?

Ukugxila: Ukuhlolwa kwezinto zokusetshenziswa (ukumbozwa okungu-100%), ukulawulwa kokukhiqiza (isb., ukuphambuka kwesikhathi sokuxuba i-solder paste ≤5%), ukuhlolwa komkhiqizo okuqediwe (≥izinto ezingu-10 ngebhetshi ngayinye), ukuphathwa komkhiqizo okungavumelani (ukufika ngesikhathi ≥95%).
42. Ungahlola kanjani ikhono locwaningo nokuthuthukiswa komhlinzeki ngokusebenzisa ukuhlolwa kwendawo?

Izinkomba zokuhlola: Imishini ye-R&D (i-DSC, ukutholakala kwe-SEM), isilinganiso sabasebenzi be-R&D (≥15%), inani lamalungelo obunikazi (≥3 amasha minyaka yonke), umjikelezo wokuthuthukiswa komkhiqizo omusha (isilinganiso ≤izinyanga ezingu-6).
43. Ungasinquma kanjani isilinganiso sediphozithi yekhwalithi yabahlinzeki be-solder?

Isilinganiso: 5%-10% yenani lokuthengwa lonyaka. Ukukhishwa kwesilinganiso sokukhubazeka kwebhetshi >3%, buyisela emuva ngemuva kwamabhetshi amathathu alandelanayo ukuze kukhuthazwe ukulawulwa kwekhwalithi.
44. Yimaphi amapharamitha obuchwepheshe abalulekile okufanele afakwe esivumelwaneni sobuchwepheshe nabaphakeli be-solder?

Kufaka: Ukwakheka kwe-alloy (isb., ukubekezelelana kwe-SAC305 Sn±0.5%, Ag±0.2%, Cu±0.1%), iphuzu lokuncibilika (217℃±3℃), i-viscosity (50-150Pa·s±10%), izinga lomsebenzi (isb., i-RA grade halide ≤0.5%), izidingo zemvelo (RoHS 2.0), njll.
45. Ungaluphatha kanjani ulwazi lwe-solder batch ngokusebenzisa uhlelo lokulandelela ikhwalithi?

Amarekhodi esistimu: Inombolo yeqembu, usuku lokukhiqiza, ukwakheka, isikhathi sokugcina impahla, njll., exhunywe kuma-ID ahlukile e-PCBA. Isikhathi sendawo yenkinga sincishisiwe sisuka emahoreni angu-24 saya kwangu-≤2.
46. Izinhlobo ezahlukene ze-solder paste squeegees zithinta kanjani ikhwalithi yokuphrinta?

I-polyurethane squeegee: Iguquguquka, ifaneleka ekukhanyeni okuphansi kanye ne-fine pitch (izikhonkwane
I-squeegee yensimbi: Ubulukhuni obuphezulu, obufanelekela amafilimu anokujiya okuphezulu namakhulu (ama-pad >0.8mm, ukubekezelelana kobukhulu ±5μm).
47. Ungakuhlola kanjani ngobuningi ukusebenza kahle kwezinqubo zokuphatha i-solder?

Izinkomba: Ukushintsha kwempahla ethengiswayo (izinga elihle kakhulu izikhathi ezingu-8-10 ngonyaka), isikhathi kusukela ekuthathweni kuya emugqeni (≤ ihora eli-1), isilinganiso sesikhathi sokungasebenzi ngenxa yezinkinga zokuphatha (
48. Ungazixazulula kanjani izimbangela ngokombono wezinto ezihlanganisiwe lapho kwenzeka ukushiswa kwe-PCBA (ukushiswa okunganele) ngemuva kokushiswa kwe-PCBA?

Amaphuzu okuxazulula izinkinga:

1. Hlola ukuthi okuqukethwe kwensimbi yokunamathisela i-solder ku-≥90% (izinga elingenalo i-lead), ukuntuleka kwayo kwandisa ingozi yokunganeli kwe-solder ngo-40%+;

2. Qinisekisa ukuthi umsebenzi wokujikeleza uhlangabezana nezinga le-RA, umsebenzi onganele ubangela ukumanzika okuncane;

3. Qinisekisa ukuthi i-solder paste iphelelwe yisikhathi (ukuthambekela/ukwehla komsebenzi).
49. Ungazikhetha kanjani izinto ezifanelekile zokusoda ukuze ziqinisekiswe ngesikhathi sokukhiqizwa kwesilingo se-PCBA esincane?

Amasu:

1. Beka phambili imodeli efanayo yokudayisa njengokukhiqiza ngobuningi ukuqinisekisa ukuqhubeka kwenqubo;

2. Ngemikhiqizo eyinkimbinkimbi, khetha izinhlobo ezimbili kuya kwezingu-3 ezinokusebenza okufanayo ukuze uqhathanise;

3. Hlola ngesilinganiso sesici, idatha yamandla okubopha amalunga e-solder, kanye nezindleko eziphelele.
50. Ungawuhlola kanjani umthelela wendawo yokugcina i-solder empilweni yayo eshalofini?

Izici ezibalulekile:

- Isikhathi sokuphila esishelufini sifinyezwa ngo-20% kuwo wonke ama-5℃ ngaphezu kwesilinganiso (isb., unamathisele >10℃);

- Izinga lokuxinana kwe-oxidation likhuphuka ngo-15% kukho konke ukunyuka komswakama okungu-10% we-RH;

Hlaziya ukuhambisana kwedatha ngokusebenzisa iziqophi zokushisa/zomswakama ukuze ubikezele isikhathi sangempela sokuphila eshalofini.
51. Unganquma kanjani ukuthi kufanele yini ushintshe ibhavu lokusoda ngesikhathi sokulungiswa kwethangi lokusoda ngamagagasi njalo?

Izindlela zokufaka esikhundleni:

1. Ukungcola kudlula okujwayelekile (isb., Cu >0.8%, IPC-J-STD-006B), amandla ejoyinti le-solder ancipha ngo-20%-30%;

2. Udoti we-solder umboza okungaphezulu kuka-20% wobuso bokugeza, okuthinta ikhwalithi;

3. Izinga lokukhubazeka kokushisela liyanda njalo ngenxa yezinkinga zokugeza nge-solder.
52. Ungawasebenzisa kanjani kangcono amapulani okuthenga usebenzisa ukuhlaziywa kwedatha enkulu ekuphathweni kwezinto zokuthungatha?

Izindlela:

1. Hlaziya ukusetshenziswa komlando, imijikelezo yokuthengwa, kanye nokushintshashintsha kwentengo ukuze kubikezelwe isidingo;

2. Ukugcina kusengaphambili ngokusekelwe kuma-oda esizini ukuze kuncishiswe izingozi zokuphela kwesitoko;

3. Landelela izitayela zamanani ukuze uthuthukise isikhathi sokuthenga. Idatha ikhombisa izindleko zesitoko esingu-15%-20% kanye nokwehliswa kwezindleko zokuthenga okungu-8%-12%.
53. Uyini umthelela wokusebenzisa izinhlobo ezahlukene zokushintsha i-solder ekuthembekeni komkhiqizo ngesikhathi sokushintsha i-PCBA?

Imiphumela:

- I-solder enokwakheka okufanayo: Ukusebenza okuhlangene okuhambisanayo, ukuthembeka okufana nokwasekuqaleni;

- I-solder enezakhiwo ezahlukene (isb., i-solder esezingeni eliphansi lokushisa esuselwe ku-bismuth): Ukungafani okukhulu kwe-CTE (esuselwe ku-bismuth ≈2x SAC305), evame ukuqhekeka emijikelezweni yokushisa, ukuthembeka kuncishiswe ngo-50%+.

Ukuphathwa kwezinto zokushisela

1. Yiziphi izilinganiso zezingxenye kanye nezinzuzo zokusebenza kwe-solder evamile engenalo i-lead SAC305?

2. Iphuzu le-eutectic lama-solder alloys lithinta kanjani inqubo yokushisela?

3. Ungahlukanisa kanjani izimo zokusetshenziswa kokuguquguquka ngamazinga ahlukene omsebenzi?

4. Yiziphi izindinganiso zokuqukethwe kwe-flux zentambo ye-solder kanye nomthelela wazo ekushiseleni?

5. Ukusatshalaliswa kosayizi wezinhlayiya zempuphu yensimbi ku-solder paste kuthinta kanjani ukusebenza kokuphrinta?

6. Ububanzi obuvumelekile bokushintshashintsha kwezinga lokushisa kanye nomswakama endaweni yokugcina i-solder paste buyini?

7. Yisiphi isikhathi sokugcina esiphezulu sentambo ye-solder engavulwanga?

8. Kungani uketshezi kufanele lugcinwe kude nokukhanya?

9. Kungani ukuxubha kungavunyelwe ngesikhathi sokubuyiselwa kwezinga lokushisa kwe-solder paste ethathwe endaweni ebandayo yokugcina?

10. Uyini umjikelezo wokulinganisa wezinto zokurekhoda izinga lokushisa nomswakama ezindaweni zokugcina i-solder?

11. Yisiphi isikhathi esiphezulu sokusetshenziswa kwe-solder paste evuliwe emshinini wokunyathelisa?

12. Ungawunquma kanjani umjikelezo wokufaka esikhundleni uketshezi lwe-solder ethangini lokugoqa lamagagasi?

13. Buyini ubudlelwano phakathi kokusetshenziswa kwentambo ye-solder kanye nosayizi wejoyinti ye-solder ekushiseni okukhethayo?

14. Iyiphi inhlanganisela efanele yokushisa kwe-soldering iron tip kanye nesikhathi soku-soldering eku-welding ngesandla?

15. I-engeli ye-squeegee iyithinta kanjani ikhwalithi yokuphrinta ngesikhathi sokuphrinta nge-solder paste?

16. Ungazithola kanjani izimbobo zangaphakathi emajoyintini e-solder nge-X-Ray?

17. Yiziphi izimo ezijwayelekile kanye nobubanzi bokuphambuka obuvumelekile bokuhlolwa kwe-viscosity ye-solder paste?

18. Yiziphi izindlela zokuhlola amandla okudonsa kanye nezindlela zokufaneleka zamajoyinti e-solder?

19. Ungasihlaziya kanjani isakhiwo esincane samajoyinti e-solder ngokuhlukanisa i-metallographic?

20. Iyini indinganiso yokuhlola ukuhlanzeka kwama-ion ezinsalela ze-flux?

21. Izinga lokushisa esigabeni sokushisa ngaphambi kokushintsha kwe-soldering lithinta kanjani ukushisela?

22. Enqubweni yokusongelwa kwamagagasi amabili, yiziphi izindima kanye nezilungiselelo zamapharamitha wegagasi langaphambili negagasi langemuva?

23. Ungakunciphisa kanjani ukuwa kwe-solder paste ngokwenza ngcono umklamo wokuvula i-stencil?

24. Uyini umthelela wokuvikelwa kwe-nitrogen ekhwalithini yokushisela ekushiseni okukhethiwe?

25. Ungalungisa kanjani izinga lokupholisa lokugoqa kabusha ngokushoda kwe-PCB?

26. Yisiphi isimiso sokufanisa phakathi kwesivinini sokususa umshini wokunyathelisa kanye ne-solder paste viscosity?

27. Buyini ubudlelwano phakathi kwenani lezindawo zokushisa ze-reflow soldering kanye nokushisela kwebhodi lesifunda eliyinkimbinkimbi?

28. Iyini ithonya ledivayisi yokuxuba ethangini lokugoqa lamagagasi ekufaneni koketshezi lokugoqa?

29. Uyini umthelela wokunemba kwevolumu yesipreyi sethini se-nozzle yokushisela ekhethiwe emajoyintini amancane okushisela?

30. Iyini ibanga lokulawula ukungezwani kohlelo lokudla ucingo lwe-solder?

31. Iyini inqubo ejwayelekile kanye nezinyathelo zokuphepha zokusebenzisa kabusha i-solder engenalo i-lead?

32. Yiziphi izingxenye eziyinhloko zamagesi aguquguqukayo agelezayo kanye nemikhawulo yokuchayeka kwawo emsebenzini?

33. Iyini ikhodi yokuhlukaniswa kwemfucuza eyingozi kanye nezidingo zokulahlwa kwezinto zokuxuba imfucuza?

34. Yiziphi izidingo zezinga lokumelana nokuqhuma kwezindawo zokugcina i-solder?

35. Ungakuvimbela kanjani ukubola kwesibili kwendle ye-solder ngesikhathi sokugcina?

36. Unganciphisa kanjani izindleko ngokwenza ngcono ukujiya kokuphrinta kwe-solder paste?

37. Iyini isilinganiso sokulahlekelwa kwemboni kwentambo yomshini kanye nezindlela zokunciphisa?

38. Iyini uhlelo lokuhlola ukusebenza kwezindleko zama-solder paste avela kumikhiqizo ehlukene?

39. Unganciphisa kanjani udoti we-wave soldering ngokusebenzisa ukulungiswa kwenqubo?

40. Buyini ubudlelwano phakathi kokushintshana kwempahla ethengiswayo kanye nokuhlala enhlokodolobha?

41. Yiziphi izinqubo ezibalulekile okufanele zigxilwe kuzo ngesikhathi sokuhlolwa kwesitifiketi se-ISO 9001 kwabahlinzeki be-solder?

42. Ungahlola kanjani ikhono locwaningo nokuthuthukiswa komhlinzeki ngokusebenzisa ukuhlolwa kwendawo?

43. Ungasinquma kanjani isilinganiso sediphozithi yekhwalithi yabahlinzeki be-solder?

44. Yimaphi amapharamitha obuchwepheshe abalulekile okufanele afakwe esivumelwaneni sobuchwepheshe nabaphakeli be-solder?

45. Ungaluphatha kanjani ulwazi lwe-solder batch ngokusebenzisa uhlelo lokulandelela ikhwalithi?

46. ​​Izinhlobo ezahlukene ze-solder paste squeegees zithinta kanjani ikhwalithi yokuphrinta?

47. Ungakuhlola kanjani ngobuningi ukusebenza kahle kwezinqubo zokuphatha i-solder?

48. Ungazixazulula kanjani izimbangela ngokombono wezinto ezihlanganisiwe lapho kwenzeka ukushiswa kwe-PCBA (ukushiswa okunganele) ngemuva kokushiswa kwe-PCBA?

49. Ungazikhetha kanjani izinto ezifanelekile zokusoda ukuze ziqinisekiswe ngesikhathi sokukhiqizwa kwesilingo se-PCBA esincane?

50. Ungawuhlola kanjani umthelela wendawo yokugcina i-solder empilweni yayo eshalofini?

51. Unganquma kanjani ukuthi kufanele yini ushintshe ibhavu lokusoda ngesikhathi sokulungiswa kwethangi lokusoda ngamagagasi njalo?

52. Ungawasebenzisa kanjani kangcono amapulani okuthenga usebenzisa ukuhlaziywa kwedatha enkulu ekuphathweni kwezinto zokuthungatha?

53. Uyini umthelela wokusebenzisa izinhlobo ezahlukene zokushintsha i-solder ekuthembekeni komkhiqizo ngesikhathi sokushintsha i-PCBA?

46. Izinhlobo ezahlukene ze-solder paste squeegees zithinta kanjani ikhwalithi yokuphrinta?