Ukugeleza kwenqubo yokuhlangana kwe-PCBA

Ukutholwa kwesikhathi sangempela kokuguqulwa kwe-polarity yezingxenye, izingxenye ezingekho, kanye ne-offset. Isivinini sokubona singu-≤0.1s/ingxenye, kanti izinga lokunemba lingaphezulu kuka-99.9%.

① Qapha ukuguguleka kwezikulufo ze-lead ngokusebenzisa izinzwa zokudlidliza (izinga lokunemba kokubikezela >95%); ② Qeqesha amamodeli asekelwe kudatha yomlando ukuze anikeze isexwayiso samahora angu-72 kusengaphambili sokuphelelwa yisikhathi kwe-nozzle.

Ingcindezi idinga ukuba ≤2 isisindo sengxenye, kanye nokuguquguquka kwamabhola e-lead/solder ≤5% ukuvimbela umonakalo wemishini.

Izinto zokugcoba kudingeka zingabi nezinto eziyingozi njenge-Pb, Hg, Cd, kanye nokuqukethwe kwe-SVHC (Izinto Ezikhathaza Kakhulu) ≤0.1%.

① Beka izingxenye ezinkulu ohlangothini lwe-wave-soldering kuqala (njengezixhumi); ② Bese ubeka izingxenye ezincane ohlangothini lwe-reflow-soldering (njenge-01005) ukuze ugweme umthelela wokushisa kwesibili ezingxenyeni ezincane.

① Nge-ENIG, ubukhulu bengqimba ye-nickel (5 - 8μm) budinga ukulawulwa ukuze kuvinjelwe ama-pads amnyama; ② Nge-OSP, ukubekwa kudinga ukuqedwa zingakapheli amahora angama-24 ukuze kugwenywe ukushiswa kobuso bethusi; ③ Nge-HASL, ukuthamba kwe-pad (≤0.05mm) kudinga ukuqashelwa.

Ama-nozzle asetshenziswa kaningi (njenge-BGA) adinga ukuhlanzwa njalo emahoreni ama-4 ukuze kugwenywe ukwehla kwamandla okumuncwa okubangelwa yinsalela yokunamathisela i-solder.

Sebenzisa ama-feeder ahlakaniphile (anomsebenzi wememori) ukuze ugcine kusengaphambili amapharamitha okuphakela ezingxenye ezahlukene, futhi isikhathi sokushintsha singafinyezwa sibe phakathi kwemizuzu emi-5.

Lungiselela ukwabiwa kwezingxenye ngesofthiwe yokulingisa inqubo (njenge-Valor) ukuze wenze umehluko womsebenzi wekhanda ngalinye lokubeka libe ≤5%.

① Sebenzisa umklamo we-modular (njengamakhanda asheshayo aphethe izingxenye ezincane, amakhanda anembile aphethe i-BGA); ② Vumelanisa izindlela zokuhamba zekhanda ngalinye lokubeka ngokusebenzisa uhlelo lokulawula oluphakathi.

① Sebenzisa umklamo we-modular (njengamakhanda asheshayo aphethe izingxenye ezincane, amakhanda anembile aphethe i-BGA); ② Vumelanisa izindlela zokuhamba zekhanda ngalinye lokubeka ngokusebenzisa uhlelo lokulawula oluphakathi.

① Khulisa izinga lokushisa lokushisa kusengaphambili ngo-10 - 15℃; ② Nweba izinga lokushisa eliphakeme ngemizuzwana emi-5 - 8; ③ Nciphisa izinga lokupholisa libe ngu-≤2℃/s ukuze uvimbele ukuqhekeka kwengcindezi yangaphakathi ebhodini.

① Sebenzisa iziphakeli ezihlakaniphile ukuze ubone ngokuzenzakalelayo izinhlobo zezingxenye; ② Lungiselela uhlelo lokubeka isitsha esidlidlizayo + umbono ukuze luhambisane nezingxenye ezinkulu kanye ne-tape - kanye ne-reel.

Ijubane lokuphakelwa kwe-feeder (ngokuvamile ≤200 izikhathi ngomzuzu) kanye nokusebenza kahle kokudlulisa kwe-PCB yizona zinto eziyinhloko ezivimbelayo.

① Setha amakhethini okukhanya okuphepha (isikhathi sokuphendula ≤20ms); ② Akuvunyelwe ukuvula umnyango ovikelayo lapho imishini isebenza (amadivayisi okukhiya adinga ukucushwa); ③ Abasebenzi kudingeka bagqoke amavesti okuxwayisa akhanyayo.

① Sebenzisa i-solder paste engahlanzeki kakhulu (okuqukethwe okuqinile okugelezayo ≤1.5%); ② Geza ngamanzi ahlanzekile ngemuva kokubeka (ukumelana ≥18MΩ・cm).

Ingazivumelanisa nezingxenye ezinobukhulu obuhlukene (kusukela ku-01005 kuya ku-50mm×50mm), futhi ushintsho - ngokuhamba kwesikhathi luncishiswa lube yi-1/3 yaleyo yemishini yendabuko.

① Ikilasi le-laser kudingeka lihlangabezane nezinga le-Class 1 (amandla ≤0.5mW); ② Igobolondo lemishini lidinga ukuvalwa ukuze kugwenywe ukuvuza kwe-laser; ③ Abasebenzi bagqoka izibuko zokuvikela ze-laser.

Ukuhlushwa kwezinhlayiya zothuli >5μm kudingeka kube yizingcezu ezingu-≤3,520/m³. Ngaphandle kwalokho, izinto zakwamanye amazwe zingabangela ukuminyana ngesikhathi sokumuncwa kwezingxenye (ukwehla kwesivuno ngo-3–5%).

I-viscosity ye-solder paste (edingekayo ukuthi ibe ngu-80–120Pa·s) kanye ne-thixotropy (i-slump ≤2mm) kudingeka ihlolwe kabusha, futhi ingasetshenziswa kuphela ngemva kokudlula isivivinyo.

① Inani le-Cpk (kufanele libe ngu-≥1.33); ② Ukunemba kokuphindaphinda (3σ ≤±0.02mm); ③ Umehluko phakathi kokunemba okungaguquki kanye nokunemba okuguquguqukayo (kufanele kube ngu-≤10%).

① Setha uhlelo lokuhlola amaphutha (njengokuqinisekiswa kwenombolo enezingxenye ezimbili); ② Amapharamitha enqubo ebalulekile (njengokucindezela, izinga lokushisa) adinga ukubhekwa ngesikhathi sangempela futhi alondolozwe iminyaka eyi-10; ③ Ingxenye yokuqala yeshifti ngayinye idinga ukuhlolwa ngokuphelele ngokwezilinganiso.

① Lungiselela amapharamitha okuphakelayo (njengokuvama kokudlidliza); ② Hlanza njalo ama-nozzle namapayipi e-vacuum; ③ Sungula inqubo yokuvuselela kabusha izingxenye ezinqatshiwe (njengokuhlola izingxenye ze-0402 ezingasetshenziswa kabusha).

① Ngenisa ifayela lokuklama le-PCB; ② Setha imithetho yokushintsha kwe-nozzle kanye nokulandelana kokuthathwa kwezingxenye; ③ Sebenzisa ama-algorithms okulingisa (njenge-algorithms yezakhi zofuzo) ukuze ubale indlela emfushane kakhulu futhi unciphise isikhathi sokuhamba esingasebenzi.

① Qopha isikhathi sokubekwa, inombolo yemishini, kanye nezikhathi zokusetshenziswa kwe-nozzle ye-PCB ngayinye; ② Hlanganisa inombolo ye-batch yengxenye nendawo ye-feeder ukuze ukhiye ngokushesha i-batch yenkinga.

① Thuthukisa izimo zokuqeqesha ze-VR (njengokulingisa ukushintshana kwe-nozzle, ukulungisa amaphutha e-feeder); ② Setha indlela yokuphendula ngemisebenzi engalungile (njengokudonswa kwezingxenye ezibonakalayo); ③ Qopha idatha yokusebenza ukuze uhlole ukusebenza kahle kokuqeqeshwa.

Nika kuqala amatheyiphu okuthwala ipulasitiki noma amathileyi avikelwe ngensimbi. Ukwelashwa kwe-ionization kuyadingeka ekupakisheni ngaphambi kokuvula.

① Hlanza ilensi nomthombo wokukhanya; ② Lungisa ukukhuphuka kwekhamera nesikhathi sokuchayeka; ③ Hlola ukuthi amaphuzu e-Mark angcolisiwe noma angcolisiwe yini; ④ Buyisela amaphuzu e-Mark ngezimo ezahlukene (njengokushintsha kusuka kusimo esiyindilinga kuya kwesiyingi).

I-thixotropy embi ye-solder paste noma isikhathi esiningi sokuhlala ngemva kokuphrinta (>amahora ama-2). Izinga lokushisa le-workshop lidinga ukulawulwa ku-23±2℃, kanye nomswakama ku-50±5% RH.

① Ezingxenyeni ezinkulu (njenge-QFP), beka phambili ukunemba (isivinini ≤30mm/s); ② Ezingxenyeni ezincane (njenge-0402), isivinini singandiswa sibe ngu-80 - 100mm/s, futhi ukunemba kungathuthukiswa ngokunxephezela okubonakalayo.

Ungabeki izingxenye ezingalinganisiwe, ungasebenzisi ama-nozzle agugile kakhulu, futhi ungakhiqizi ama-PCB ngaphandle kokuhlolwa kokuqala.

① Ububanzi bangaphakathi bombhobho buvinjiwe (kudingeka kusulwe ngenaliti yensimbi engu-0.2mm); ② Ijeneretha ye-vacuum iyahluleka (izinga le-vacuum

Kunconywa ukuqoqa amapharamitha ayisihluthulelo (njengokucindezela, ukuphambuka kwesikhundla) njalo ngemizuzwana engu-0.5. Ukubambezeleka kwedatha okungaphezu kwesekhondi eli-1 kungaholela ekungatholakalini kwezimo ezingavamile zekhwalithi.

Linganisa kanye ngemva kwamandla - nsuku zonke, noma ngemva kokukhiqiza ama-PCB angu-50, ukuqinisekisa ukuthi ukunemba kokuqondanisa phakathi kwezingxenye nama-pad kungu-≤ ±0.02mm.

Ukugcoba kuyadingeka njalo emahoreni angu-200 okusebenza. Ukuntuleka kwamafutha kuzoholela ekwandeni kwephutha lokudlulisela (njengokuphambuka kokubeka i-axis ye-X/Y >0.03mm).

Khetha amaphuzu amathathu okumaka ezindaweni ezahlukene ku-PCB, bese ulinganisa ukuphakama kwe-axis ka-Z kwe-nozzle ngokulandelana. Iphutha kudingeka libe ngu-≤±0.005mm.

① Izimiso zemishini kanye nokuhlela (njenge-G - ikhodi, i-teach - uhlelo lwe-pendant); ② Ukwenziwa ngcono kwamapharamitha enqubo (njengokucindezela, ama-curve okushisa); ③ Ukuxilongwa kwamaphutha kanye nokugcinwa kokuvimbela; ④ Ukusetshenziswa kwamathuluzi ekhwalithi (njenge-SPC, i-FMEA).

① Sebenzisa ama-nozzle e-ceramic noma e-carbide aqiniswe nge-cement (isikhathi sokuphila sande ngokuphindwe ka-3 - 5); ② Sungula inqubo yokuvuselela ama-nozzle (njenge-laser - ukulungisa indawo egugile).

① Engeza amamojula wokubala onqenqemeni (njengamasango e-PLC); ② Sebenzisa iphrothokholi ye-OPC UA ukuze ufinyelele ukuxhumana phakathi kwamadivayisi; ③ Misa isikhungo sedatha sokugcina idatha yokukhiqiza ngesikhathi sangempela.

Kudingeka kufakwe uhlelo lokucisha umlilo olungenagesi, futhi ukugcwala komoya-mpilo endaweni yokusebenzela kudinga ukulawulwa phakathi kuka-18 no-21%.

Isikhathi esiphakathi kusukela ekuphrinteni kuya ekubekweni sidinga ukuba yihora elingu-≤1 ukuze kugwenywe ukuthi i-solder paste imunce umswakama futhi ibangele ukugeleza kabusha kwe-soldering voids.

I-solder engenalo i-lead inezinga eliphezulu lokuncibilika (cishe ama-217℃), okuholela ekukhuleni okungu-15 - 20% kokusetshenziswa kwamandla okuphinda kufakwe i-solder. Ukusetshenziswa kwamandla kungancishiswa ngokwenza ngcono ijika lokushisa lesithando (njengokunciphisa isikhathi sokubamba).

① Qinisekisa i-logic yohlelo kusenesikhathi (ukunciphisa isikhathi sokulungisa amaphutha endaweni ngo-50%); ② Lingisa izimo zokusebenza ezimbi kakhulu ukuze uhlole ukuzinza kwemishini; ③ Qeqesha abaqhubi ngaphandle kokusebenzisa imishini yangempela.

① Bhukha unqenqema lwenqubo oluyi-≥5mm ukuze kuboshwe izinto ezisetshenziswayo; ② Isikhala phakathi kwezingxenye eziseduze kufanele sibe yi-≥3mm ukuze kugwenywe ukuphazamiseka ngesikhathi sokufafaza ngethini.

① Iqoqo ngalinye lezingxenye kudingeka linikeze uhlu lwezinto zokwakha (i-BOM); ② I-ID yomqhubi kanye nesikhathi sokusebenza kudingeka kuqoshwe ngesikhathi senqubo yokubeka; ③ Amalunga e-Solder kudingeka ahlolwe ngo-100% X - Imisebe futhi amarekhodi esithombe adinga ukulondolozwa.

Ezingxenyeni ezingu-0402 nangaphezulu, izinga lokwenqatshwa kufanele libe ngu-≤0.5%; ezingxenyeni ezincane ezingu-0201 nangaphansi, izinga lokwenqatshwa kufanele libe ngu-≤1.5%.

Ukuzihlola komqhubi → Ukuhlolwa kabusha komholi weqembu → Ukuhlolwa kwesampula komhloli wekhwalithi. Ukukhiqizwa ngobuningi kuvunyelwe kuphela ngemva kokuqinisekiswa.

Ukuphambuka kwe-engeli okungaphezulu kuka-5° kungabangela ukungalungi kahle kwamabhola e-lead/solder nama-pad, okwandisa ingozi yokubopha noma ukugoqa okungamanga. Kudinga ukukhokhelwa nokulungiswa ngesofthiwe yemishini.