Ungazichonga njani ngokucacileyo iziphene ezingabonakaliyo ze-PCBA?

Imigangatho yoHlolo lwe-X-RAY

1. Iijoyinti ze-BGA solder azinawo umlinganiselo:
Iikhrayitheriya zokugweba: ziyamkeleka xa i-offset ingaphantsi kwesiqingatha somda we-solder pad; Xa i-offset inkulu okanye ilingana nesiqingatha somda we-solder pad, iya kwaliwa.

2. Iijoyinti ze-BGA solder azinawo umjikelo omfutshane:
Iikhrayitheriya zokugweba: Ukuba akukho nxibelelwano lwetin phakathi kwamalungu e-solder, iyamkeleka; Xa kukho unxibelelwano lwe-solder phakathi kwamalungu e-solder, iyakwaliwa.

3. Iijoyinti ze-BGA solder ezingenazo izithuba:
Iikhrayitheriya zokugweba: Indawo engenanto engaphantsi kwama-20% yendawo iyonke yejoyinti yesolder iyamkeleka; Ukuba indawo engenanto inkulu okanye ilingana nama-20% yendawo iyonke yejoyinti yesolder, iya kwaliwa.

4. Akukho kunqongophala kwetin kwi-BGA solder joints:
Iikhrayitheriya zokugweba: Yamkela xa zonke iibhola zenkcenkce zibonisa ubungakanani obupheleleyo, obufanayo nobulinganayo; Ukuba ubungakanani bebhola yenkcenkce buncinci kakhulu xa kuthelekiswa nezinye iibhola zenkcenkce ezijikelezileyo, kufuneka ingavunyelwa.

5. Umgangatho wokuhlolwa kwe-grounding pad E-PAD yeetships zeklasi ze-QFP/QFN zezinye iimveliso kukuba indawo yetin mayibe ngaphezulu kwe-60% yendawo iyonke (iigridi ezine ezidityaniswe kunye zibonisa ukunyibilika kakuhle), kwaye umlinganiselo wesampulu yi-20%.

1. Injongo yovavanyo: Iibhodi ze-PCBA ezine-BGA/LGA kunye nezixhobo zephedi yokumisa umhlaba;

2. Uvavanyo oluphindaphindayo:

① Emva kotshintsho, abasebenzi bezobugcisa bayaqinisekisa ukuba ibhodi yokuqala yokuncamathisela i-solder kunye ne-BGA surface mount zinazo naziphi na iziphene zokuphambuka, baze baqhubeke nokudlula kwigumbi emva kokuqinisekisa ukuba akukho ngxaki;

② Abasebenzi bezobuchwephesha bayaqinisekisa ukuba kukho naziphi na iingxaki nge-BGA soldering yebhodi yokuqala yokuncamathisela i-solder emva kokudlula kwigumbi, baze bayifake kwimveliso ukuba akukho ngxaki;

③ Ngexesha lemveliso eqhelekileyo, abasebenzi abakhethiweyo banoxanduva lokuvavanya, kwaye ukuba iiodolo ze-≤ 100pcs, kufuneka zivavanywe ngokupheleleyo nge-100%; iiodolo ze-101-1000pcs kufuneka zithathwe iisampulu ze-30%, iiodolo ezingaphezulu kwe-1001pcs kufuneka zithathwe iisampulu ze-20%;

④ Ngexesha lenkqubo yesiqhelo yemveliso, i-IPQC yenza uvavanyo lweesampuli kwiziqwenga ezibini ezinkulu ngeyure;

⑤ Iimveliso mazivavanywe ngokupheleleyo ngokupheleleyo kwaye iifoto mazigcinwe ngokupheleleyo.

3. Ukuba kukho naziphi na iziphene, iifoto mazigcinwe, kwaye imodeli ye-BOM, inombolo ye-serial yebhakhowudi kunye neziphumo zovavanyo lwemveliso evavanyiweyo kufuneka zirekhodwe kwiFomu yeRekhodi yoVavanyo lwe-X-Ray. Yongeza imifanekiso yokunyibilikisa ye-QFP kunye nee-grounding pads ze-QFN, kwaye ugcine i-100% yeefoto.

4. Ukuba kukho naziphi na iziphene ngexesha lovavanyo, mazixelwe ngoko nangoko kumphathi omkhulu nakwinjineli yenkqubo ukuze ziqinisekiswe.

Ingcali yoHlolo oluNgqondi lwe-X-ray yezeShishini

Inkqubo yezixhobo ze-X-RAY ikakhulu inamacandelo asixhenxe: umthombo we-X-ray ogxile kwi-micro focus, iyunithi yokufota, inkqubo yokucubungula imifanekiso yekhompyutha, inkqubo yoomatshini, inkqubo yolawulo lombane, inkqubo yokukhusela ukhuseleko kunye nenkqubo yesilumkiso. Idibanisa uvavanyo olungonakalisiyo, iteknoloji yesoftware yekhompyutha, iteknoloji yokufumana nokucubungula imifanekiso kunye neteknoloji yokudlulisa imifanekiso, igubungela amacandelo amane obuchwephesha obuchwephesha bokucubungula imifanekiso ye-optical, mechanical, electrical kunye nedijithali. Ngokusebenzisa umahluko wokufunxa kwe-X-rays ngezinto ezahlukeneyo, ulwakhiwo lwangaphakathi lwento luyathathwa kwaye kuchongwa iziphene zangaphakathi. Umfanekiso wokufumanisa imveliso unokubonwa ngexesha langempela ukuze kuchongwe ukuba kukho iziphene, iintlobo zeziphene kunye namanqanaba asemgangathweni oshishino ngaphakathi kwimveliso. Kwangaxeshanye, inkqubo yokucubungula imifanekiso yekhompyutha isetyenziselwa ukugcina nokucubungula imifanekiso ukuphucula ukucaca komfanekiso kunye nokuqinisekisa ukuchaneka kovavanyo. Ingalinganisa ngokuzenzekelayo amaqamza kwizinto ze-elektroniki ezipakishiweyo ezifana ne-BGA kunye ne-QFN, kwaye ixhasa imilinganiselo yejometri efana nomgama, i-engile, ububanzi, kunye ne-polygon. Ingafikelela ngokulula ekufumaneni indawo yokuma kwamanqaku amaninzi, ivumela iimveliso ukuba zishiye umzi-mveliso zingenaziphene.