Bokgoni ba Kopano ya PCB
SMT, lebitso le felletseng ke theknoloji ea ho kenya holim'a metsi. SMT ke mokhoa oa ho kenya likarolo kapa likarolo holim'a mapolanka. Ka lebaka la sephetho se betere le bokhoni bo phahameng, SMT e se e le mokhoa o ka sehloohong o sebelisoang ts'ebetsong ea ho kopanya PCB.
Melemo ea kopano ea SMT
1. Boholo bo bonyenyane le bo bobebe
Ho sebedisa theknoloji ya SMT ho kopanya dikarolo botong ka ho toba ho thusa ho fokotsa boholo bohle le boima ba di-PCB. Mokgwa ona wa ho kopanya o re dumella ho beha dikarolo tse ngata sebakeng se thibetsweng, e leng se ka fihlellang meralo e menyenyane le tshebetso e betere.
2. Ho tšepahala ho phahameng
Kamora hore mohlala o tiise, ts'ebetso eohle ea kopano ea SMT e batla e iketsahalla ka mechine e nepahetseng, e leng se etsang hore e fokotse liphoso tse ka bakoang ke ho kenella ka letsoho. Ka lebaka la othomathike, theknoloji ea SMT e netefatsa ho tšepahala le ho tsitsa ha li-PCB.
3. Ho boloka litšenyehelo
Hangata kopano ea SMT e etsoa ka mechine e iketsang. Leha litšenyehelo tsa ho kenya mechini li le holimo, mechine e iketsang e thusa ho fokotsa mehato ea matsoho nakong ea lits'ebetso tsa SMT, e leng se ntlafatsang katleho ea tlhahiso haholo le ho fokotsa litšenyehelo tsa basebetsi nakong e telele. 'Me ho na le lisebelisoa tse fokolang tse sebelisoang ho feta kopano ea lesoba le phunyeletsang, 'me litšenyehelo le tsona li tla fokotseha.
| Bokhoni ba SMT: lintlha tse 19,000,000/ka letsatsi | |
| Lisebelisoa tsa Teko | Sesebelisoa sa ho lemoha se sa senyeheng sa X-RAY, Sesebelisoa sa ho lemoha sa Sehlooho sa Pele, A0I, Sesebelisoa sa ICT, Sesebelisoa sa ho Etsa Mosebetsi Bocha sa BGA |
| Lebelo la ho Phahamisa | 0.036 S/likarolo (Boemo bo Molemohali) |
| Likarolo tse Ikhethileng. | Sephutheloana se senyenyane se ka khomareloang |
| Ho nepahala ha bonyane ha lisebelisoa | |
| Ho nepahala ha chip ea IC | |
| PCB e kentsoeng. | Boholo ba substrate |
| Botenya ba substrate | |
| Sekhahla sa ho Raha | 1. Karolelano ea Matla a Impedance: 0.3% |
| 2.IC ntle le ho raha bolo | |
| Mofuta oa Boto | POP/PCB e Tloaelehileng/FPC/PCB e Tiileng-Flex/PCB e thehiloeng tšepeng |
| Bokhoni ba Letsatsi le Letsatsi ba DIP | |
| Mohala oa plug-in oa DIP | Lintlha tse 50,000 ka letsatsi |
| Mohala oa ho kopanya poso ea DIP | Lintlha tse 20,000 ka letsatsi |
| Mohala oa teko oa DIP | 50,000pcs PCBA/letsatsi |
| Bokhoni ba Tlhahiso ea Lisebelisoa tse ka Sehloohong tsa SMT | ||
| Mochini | Sebaka | Paramethara |
| Printer GKG GLS | Khatiso ea PCB | 50x50mm ~ 610x510mm |
| ho nepahala ha khatiso | ± 0.018mm | |
| Boholo ba foreimi | 420x520mm-737x737mm | |
| mefuta e fapaneng ea botenya ba PCB | 0.4-6mm | |
| Mochini o kopantsoeng oa ho bokella | Tiiso ea ho fetisa PCB | 50x50mm ~ 400x360mm |
| Tlosa moea | Tiiso ea ho fetisa PCB | 50x50mm ~ 400x360mm |
| YAMAHA YSM20R | haeba ho ka fetisoa boto e le 'ngoe | L50xW50mm -L810xW490mm |
| Lebelo la khopolo-taba la SMD | 95000CPH(0.027 s/chip) | |
| Sebaka sa kopano | Bophahamo ba ho kenya karolo ea 0201(mm)-45*45mm: ≤15mm | |
| Ho nepahala ha kopano | CHIP+0.035mmCpk ≥1.0 | |
| Palo ea likarolo | Mefuta e 140 (moqolo oa 8mm) | |
| YAMAHA YS24 | haeba ho ka fetisoa boto e le 'ngoe | L50xW50mm -L700xW460mm |
| Lebelo la khopolo-taba la SMD | 72,000CPH(0.05 s/chip) | |
| Sebaka sa kopano | Bophahamo ba ho kenya karolo ea 0201(mm)-32*mm: 6.5mm | |
| Ho nepahala ha kopano | ± 0.05mm, ± 0.03mm | |
| Palo ea likarolo | Mefuta e 120 (moqolo oa 8mm) | |
| YAMAHA YSM10 | haeba ho ka fetisoa boto e le 'ngoe | L50xW50mm ~L510xW460mm |
| Lebelo la khopolo-taba la SMD | 46000CPH(0.078 s/chip) | |
| Sebaka sa kopano | Bophahamo ba ho kenya karolo ea 0201(mm)-45*mm: 15mm | |
| Ho nepahala ha kopano | ± 0.035mm Cpk ≥1.0 | |
| Palo ea likarolo | Mefuta e 48 (reel ea 8mm)/mefuta e 15 ea literei tsa IC tse iketsang | |
| JT TEA-1000 | Pina e 'ngoe le e 'ngoe e habeli e ka fetoloa | W50~270mm substrate/trane e le 'ngoe e ka fetoloa W50*W450mm |
| Bophahamo ba likarolo ho PCB | holimo/tlase 25mm | |
| Lebelo la conveyor | 300~2000mm/sec | |
| ALeader ALD7727D AOI inthaneteng | Qeto/Sebaka sa pono/Lebelo | Khetho: 7um/pixel FOV: 28.62mmx21.00mm Standard: 15um pixel FOV: 61.44mmx45.00mm |
| Lebelo la ho lemoha | ||
| Sistimi ea khoutu ea bare | ho lemoha khoutu ea bareng ka boiketsetso (khoutu ea bareng kapa khoutu ea QR) | |
| Mefuta e fapaneng ea boholo ba PCB | 50x50mm(metsotso)~510x300mm(max) | |
| Pina e le 'ngoe e tsitsitse | Pina e le 'ngoe e tsitsitse, pina ea 2/3/4 e ka fetoloa; boholo bo fokolang pakeng tsa pina ea 2 le ea 3 ke 95mm; boholo bo phahameng ka ho fetisisa pakeng tsa pina ea 1 le ea 4 ke 700mm. | |
| Mohala o le mong | Bophara bo boholo ba pina ke 550mm. Tsela e habeli: bophara bo boholo ba pina e habeli ke 300mm (bophara bo ka lekanngoang); | |
| Mefuta e fapaneng ea botenya ba PCB | 0.2mm-5mm | |
| Sebaka sa PCB pakeng tsa holimo le tlase | Lehlakore le ka holimo la PCB: 30mm / Lehlakore le ka tlase la PCB: 60mm | |
| 3D SPI SINIC-TEK | Sistimi ea khoutu ea bare | ho lemoha khoutu ea bareng ka boiketsetso (khoutu ea bareng kapa khoutu ea QR) |
| Mefuta e fapaneng ea boholo ba PCB | 50x50mm(metsotso)~630x590mm(max) | |
| Ho nepahala | 1μm, bophahamo: 0.37um | |
| Ho Pheta-pheta | 1um (4sigma) | |
| Lebelo la tšimo ea pono | 0.3s/sebaka sa pono | |
| Nako ea ho lemoha ntlha ea litšupiso | 0.5s/ntlha | |
| Bolelele bo phahameng ba ho lemoha | ± 550um ~ 1200μm | |
| Bolelele bo boholo ba ho lekanya ba PCB e sothang | ±3.5mm~±5mm | |
| Sebaka se senyenyane sa pad | 100um (e thehiloe holim'a soler pad e bolelele ba 1500um) | |
| Boholo bo fokolang ba teko | khutlonnetsepa 150um, selikalikoe 200um | |
| Bophahamo ba karolo ho PCB | holimo/tlase 40mm | |
| Botenya ba PCB | 0.4 ~ 7mm | |
| Sesebelisoa sa ho lemoha X-ray sa Unicomp 7900MAX | Mofuta oa phaephe e bobebe | mofuta o koetsoeng |
| Motlakase oa phaephe | 90kV | |
| Matla a tlhahiso a maholo | 8W | |
| Boholo ba ho tsepamisa maikutlo | 5μm | |
| Sesupa-tsela | FPD ea tlhaloso e phahameng | |
| Boholo ba pixel | ||
| Boholo ba ho lemoha bo sebetsang | 130*130[limilimithara] | |
| Matrix ea pixel | 1536*1536[piksele] | |
| Sekhahla sa foreimi | 20fps | |
| Kgodiso ya sistimi | 600X | |
| Sebaka sa ho tsamaya | E ka fumana litšoantšo tsa 'mele kapele | |
| Tekanyo e iketsang | E ka lekanya lipululana ka bohona ka har'a lisebelisoa tsa elektroniki tse pakiloeng joalo ka BGA le QFN | |
| Tlhahlobo ea CNC e iketsang | Tšehetsa ntlha e le 'ngoe le ho eketsa matrix, hlahisa merero kapele 'me u e bone ka mahlo a kelello | |
| Ho holisa sebopeho sa jeometri | Makgetlo a 300 | |
| Lisebelisoa tsa ho lekanya tse fapaneng | Tšehetsa litekanyo tsa jeometri tse kang sebaka, sekhutlo, bophara, poligoni, jj. | |
| E ka lemoha disampole ka sekhutlo sa di-degree tse 70 | Sistimi ena e na le keketseho ea ho fihla ho 6,000 | |
| Ho lemoha BGA | Kgodiso e kgolo, setshwantsho se hlakileng haholoanyane, mme ho bonolo ho bona manonyeletso a solder a BGA le mapetso a thini | |
| Sethaleng | E khona ho beha lipeipi tsa X-ray le li-detector tsa X-ray ka tsela e nepahetseng; | |