Ubuchule boMhlangano wePCB
I-SMT, igama elipheleleyo yiteknoloji yokuxhoma umphezulu. I-SMT yindlela yokufaka izinto okanye iindawo kwiibhodi. Ngenxa yesiphumo esingcono kunye nokusebenza kakuhle, i-SMT iye yaba yindlela ephambili esetyenziswayo kwinkqubo yokuhlanganisa i-PCB.
Iingenelo zokuhlanganiswa kwe-SMT
1. Ubungakanani obuncinci kunye nobunzima obuncinci
Ukusebenzisa iteknoloji ye-SMT ukudibanisa izinto ebhodini ngokuthe ngqo kunceda ukunciphisa ubungakanani kunye nobunzima be-PCB. Le ndlela yokuhlanganisa ivumela ukuba sibeke izinto ezininzi kwindawo encinci, nto leyo enokwenza uyilo oluncinci kunye nokusebenza ngcono.
2. Ukuthembeka okuphezulu
Emva kokuba iprototype iqinisekisiwe, yonke inkqubo yokuhlanganisa i-SMT iphantse izenzekele ngoomatshini abachanekileyo, nto leyo eyenza ukuba inciphise iimpazamo ezinokubangelwa kukubandakanyeka ngesandla. Ngenxa yokwenziwa kwe-automation, iteknoloji ye-SMT iqinisekisa ukuthembeka kunye nokuhambelana kwee-PCB.
3. Ukonga iindleko
I-SMT assemble idla ngokwenziwa ngoomatshini abazenzekelayo. Nangona iindleko zokufaka ezi matshini ziphezulu, oomatshini abazenzekelayo banceda ekunciphiseni amanyathelo enziwe ngesandla ngexesha leenkqubo ze-SMT, nto leyo ephucula kakhulu ukusebenza kakuhle kwemveliso kwaye inciphise iindleko zomsebenzi kwixesha elide. Kwaye zimbalwa izinto ezisetyenziswayo kune-through-hole assemble, kwaye neendleko ziya kuncipha.
| Amandla e-SMT: 19,000,000 amanqaku/ngosuku | |
| Izixhobo zovavanyo | Isitshisi se-X-RAY esingatshabalalisiyo, Isitshisi seNqaku lokuQala, i-A0I, isitshisi se-ICT, isixhobo sokuSebenza kwakhona se-BGA |
| Isantya sokuFaka | 0.036 S/pcs (Eyona meko ilungileyo) |
| Iinkcukacha zeCandelo. | Iphakheji encinci enamathelayo |
| Ukuchaneka kwezixhobo okuncinci | |
| Ukuchaneka kwe-IC chip | |
| I-PCB Spec efakwe apha. | Ubungakanani be-substrate |
| Ubukhulu be-substrate | |
| Inqanaba lokuKhutshwa | 1. Umlinganiselo woMbane wokuNgasebenzi: 0.3% |
| 2.IC ngaphandle kokukhaba ibhola | |
| Uhlobo lweBhodi | I-POP/I-PCB eqhelekileyo/I-FPC/I-PCB eguquguqukayo/I-PCB esekelwe kwisinyithi |
| Ubuchule bemihla ngemihla be-DIP | |
| Umgca we-DIP plug-in | Amanqaku angama-50,000/ngosuku |
| Umgca wokunyibilikisa emva kwe-DIP | Amanqaku angama-20,000/ngosuku |
| Umgca wovavanyo lwe-DIP | IiPCBA ezingama-50,000/ngosuku |
| Amandla okuvelisa izixhobo eziphambili ze-SMT | ||
| Umatshini | Uluhlu | Ipharamitha |
| Iphrinta yeGKG GLS | Ukuprinta kwe-PCB | 50x50mm~610x510mm |
| ukuchaneka kokuprinta | ± 0.018mm | |
| Ubungakanani besakhelo | 420x520mm-737x737mm | |
| uluhlu lobukhulu bePCB | 0.4-6mm | |
| Umatshini odibeneyo wokubeka izinto ngokweestaki | Itywina lokuhambisa i-PCB | 50x50mm~400x360mm |
| Susa umjikelo | Itywina lokuhambisa i-PCB | 50x50mm~400x360mm |
| YAMAHA YSM20R | xa kuthunyelwa ibhodi e-1 | L50xW50mm -L810xW490mm |
| Isantya sethiyori se-SMD | 95000CPH(0.027 s/tship) | |
| Uluhlu lwendibano | 0201(mm)-45*45mm ukuphakama kokufakelwa kwecandelo: ≤15mm | |
| Ukuchaneka kwendibano | I-CHIP+0.035mmCpk ≥1.0 | |
| Ubungakanani bezinto ezisetyenzisiweyo | Iintlobo ezili-140 (ukuskrola okungu-8mm) | |
| I-YAMAHA YS24 | xa kuthunyelwa ibhodi e-1 | L50xW50mm -L700xW460mm |
| Isantya sethiyori se-SMD | 72,000CPH(0.05 s/tship) | |
| Uluhlu lwendibano | Ukuphakama kokufakelwa kwecandelo le-0201(mm)-32*mm: 6.5mm | |
| Ukuchaneka kwendibano | ± 0.05mm, ± 0.03mm | |
| Ubungakanani bezinto ezisetyenzisiweyo | Iintlobo ezili-120 (umqulu we-8mm) | |
| I-YAMAHA YSM10 | xa kuthunyelwa ibhodi e-1 | L50xW50mm ~L510xW460mm |
| Isantya sethiyori se-SMD | 46000CPH(0.078 s/tship) | |
| Uluhlu lwendibano | 0201(mm)-45*mm ukuphakama kokufakelwa kwecandelo: 15mm | |
| Ukuchaneka kwendibano | ±0.035mm Cpk ≥1.0 | |
| Ubungakanani bezinto ezisetyenzisiweyo | Iintlobo ezingama-48 (i-reel ye-8mm)/iintlobo ezili-15 zeetreyi ze-IC ezizenzekelayo | |
| I-JT TEA-1000 | Ithrekhi nganye ephindwe kabini iyalungiseka | I-W50~270mm substrate/ithrekhi enye iyalungiseka W50*W450mm |
| Ukuphakama kwamacandelo kwi-PCB | phezulu/ezantsi 25mm | |
| Isantya sokuhambisa | 300~2000mm/umzuzwana | |
| I-ALeader ALD7727D AOI kwi-intanethi | Isisombululo/Uluhlu lokubonakala/Isantya | Ukhetho: 7um/pixel FOV: 28.62mmx21.00mm Umgangatho: 15um pixel FOV: 61.44mmx45.00mm |
| Isantya sokufumanisa | ||
| Inkqubo yekhowudi yebha | ukuqondwa kwekhowudi yebha ngokuzenzekelayo (ikhowudi yebha okanye ikhowudi yeQR) | |
| Uluhlu lobukhulu bePCB | 50x50mm(umzuzu)~510x300mm(ubuninzi) | |
| Ithrekhi e-1 ilungisiwe | Ithrekhi e-1 ilungisiwe, ithrekhi e-2/3/4 inokulungiswa; ubungakanani obuncinci phakathi kwethrekhi e-2 ne-3 yi-95mm; ubungakanani obuphezulu phakathi kwethrekhi e-1 ne-4 yi-700mm. | |
| Umgca omnye | Ububanzi bendlela obuphezulu yi-550mm. I-Double track: ububanzi bendlela obuphezulu obuphindwe kabini yi-300mm (ububanzi obulinganiswayo); | |
| Uluhlu lobukhulu bePCB | 0.2mm-5mm | |
| Ukususwa kwe-PCB phakathi kwephezulu nezantsi | Icala eliphezulu le-PCB: 30mm / Icala elisezantsi le-PCB: 60mm | |
| I-3D SPI SINIC-TEK | Inkqubo yekhowudi yebha | ukuqondwa kwekhowudi yebha ngokuzenzekelayo (ikhowudi yebha okanye ikhowudi yeQR) |
| Uluhlu lobukhulu bePCB | 50x50mm(umzuzu)~630x590mm(ubuninzi) | |
| Ukuchaneka | 1μm, ukuphakama: 0.37um | |
| Ukuphindaphinda | 1um (4sigma) | |
| Isantya sentsimi ebonakalayo | 0.3s/intsimi ebonakalayo | |
| Ixesha lokufumanisa indawo yokubhekisa | 0.5s/inqaku | |
| Ukuphakama okuphezulu kokufunyanwa | ±550um~1200μm | |
| Ukuphakama okuphezulu kokulinganisa kwe-PCB yokugoba | ±3.5mm~±5mm | |
| Ubuncinci besithuba sephedi | I-100um (isekelwe kwi-soler pad enokuphakama kwe-1500um) | |
| Ubungakanani obuncinci bovavanyo | uxande oluyi-150um, oluyi-200um oluyi-circular | |
| Ukuphakama kwecandelo kwi-PCB | phezulu/ezantsi 40mm | |
| Ubukhulu bePCB | 0.4 ~ 7mm | |
| Isitshisi se-X-ray se-Unicomp 7900MAX | Uhlobo lwetyhubhu yokukhanya | uhlobo oluvaliweyo |
| I-voltage yetyhubhu | 90kV | |
| Amandla okukhupha aphezulu | 8W | |
| Ubungakanani bokugxila | 5μm | |
| Isitshicileli | i-FPD yenkcazo ephezulu | |
| Ubungakanani bePixel | ||
| Ubungakanani bokuchongwa obusebenzayo | 130*130[mm] | |
| I-matrix yePixel | 1536*1536[iphikseli] | |
| Umgangatho wefreyimu | 20fps | |
| Ukwandiswa kwenkqubo | 600X | |
| Indawo yokujikajika | Ndinokufumana imifanekiso ebonakalayo ngokukhawuleza | |
| Ukulinganisa ngokuzenzekelayo | Ingalinganisa ngokuzenzekelayo amaqamza kwii-elektroniki ezipakishiweyo ezifana ne-BGA kunye ne-QFN | |
| Ukufunyanwa ngokuzenzekelayo kwe-CNC | Xhasa inqaku elinye kunye nokongezwa kwe-matrix, yenza ngokukhawuleza iiprojekthi kwaye uzibone ngeliso lengqondo | |
| Ukwandiswa kwejometri | Izihlandlo ezingama-300 | |
| Izixhobo zokulinganisa ezahlukeneyo | Xhasa imilinganiselo yejometri efana nomgama, i-engile, ububanzi, i-polygon, njl. | |
| Ingabona iisampulu kwi-engile ye-70 degrees | Le nkqubo inokwandiswa ukuya kuthi ga kwi-6,000 | |
| Ukufunyanwa kwe-BGA | Ukwandiswa okukhulu, umfanekiso ocacileyo, kwaye kulula ukubona amalungu e-BGA solder kunye nemifantu yetin | |
| Iqonga | Uyakwazi ukubeka iityhubhu ze-X-ray kunye nee-X-ray kwicala ngalinye; Ukubeka iityhubhu ze-X-ray kwicala ngalinye kunye nee-X-ray detectors | |