PCB Amandla eNdibano
I-SMT, igama elipheleleyo bubuchwephesha bokunyuka komphezulu. I-SMT yindlela yokunyusa amacandelo okanye iinxalenye kwiibhodi. Ngenxa yesiphumo esingcono kunye nokusebenza okuphezulu, i-SMT ibe yindlela ephambili esetyenziswa kwinkqubo yendibano yePCB.
Izinto eziluncedo zendibano ye-SMT
1. Ubungakanani obuncinci kunye nobunzima
Ukusebenzisa iteknoloji ye-SMT ukudibanisa amacandelo ebhodini ngokuthe ngqo kunceda ukunciphisa ubungakanani obupheleleyo kunye nobunzima bee-PCBs. Le ndlela yokudibanisa ivumela ukuba sibeke amacandelo amaninzi kwindawo ethintelweyo, enokuthi ifezekise uyilo oludibeneyo kunye nokusebenza okungcono.
2. Ukuthembeka okuphezulu
Emva kokuba iprototype iqinisekisa, yonke inkqubo yendibano ye-SMT iphantse izenzekele ngoomatshini abachanekileyo, okwenza ukuba kuncitshiswe iimpazamo ezinokubangelwa kukubandakanyeka ngesandla. Ngombulelo kwi-automation, iteknoloji ye-SMT iqinisekisa ukuthembeka kunye nokuhambelana kwee-PCBs.
3. Ukonga iindleko
Ukudityaniswa kwe-SMT ngokuqhelekileyo kuqondwa ngoomatshini abazenzekelayo. Nangona ixabiso lokufakwayo koomatshini liphezulu, oomatshini abazenzekelayo banceda ukunciphisa amanyathelo okwenziwa ngesandla ngexesha leenkqubo ze-SMT, eziphucula kakhulu ukusebenza kakuhle kwemveliso kunye nokunciphisa iindleko zabasebenzi kwixesha elide. Kwaye kukho izixhobo ezimbalwa ezisetyenzisiweyo kunokudityaniswa komngxuma, kwaye iindleko ziya kuhla, nazo.
| Ubunakho be-SMT: 19,000,000 point/day | |
| Izixhobo zokuvavanya | X-RAY detector engonakalisi, First Article Detector, A0I, ICT detector, BGA Rework Instrument |
| Isantya sokunyuka | 0.036 S/pcs (Isimo esiNgcono) |
| Amacandelo Spec. | Ubuncinci bepakethe ebambekayo |
| Ubuncinci bokuchaneka kwezixhobo | |
| IC ukuchaneka kwetshiphu | |
| Inyuswe PCB Spec. | Ubungakanani besubstrate |
| Ubukhulu be-substrate | |
| Inqanaba lokukhaba | 1.Impedance Capacitance Ratiyo : 0.3% |
| 2.IC ngaphandle kokukhaba | |
| Uhlobo lweBhodi | POP / Rhoqo PCB / FPC / Rigid-Flex PCB / Metal esekelwe PCB |
| DIP Ubuchule bemihla ngemihla | |
| DIP plug-in line | Inqaku le-50,000 / ngosuku |
| Umgca wokuthengisela weposi we-DIP | Inqaku le-20,000 / ngosuku |
| Umgca wovavanyo we-DIP | 50,000pcs PCBA / ngosuku |
| Isakhono sokuVeliswa kweZixhobo ezingundoqo ze-SMT | ||
| Umatshini | Uluhlu | Ipharamitha |
| Umshicileli we-GKG GLS | PCB yoshicilelo | 50x50mm~610x510mm |
| ukuchaneka koshicilelo | ±0.018mm | |
| Ubungakanani besakhelo | 420x520mm-737x737mm | |
| uluhlu lwePCB ubukhulu | 0.4-6mm | |
| Ukupakisha umatshini odibeneyo | PCB ehambisa itywina | 50x50mm~400x360mm |
| Unwinder | PCB ehambisa itywina | 50x50mm~400x360mm |
| YAMAHA YSM20R | kwimeko yokuhambisa ibhodi e-1 | L50xW50mm -L810xW490mm |
| Isantya sethiyori ye-SMD | 95000CPH(0.027 s/chip) | |
| Uluhlu lweNdibano | 0201(mm)-45*45mm icandelo lokuxhoma ubude: ≤15mm | |
| Ukuchaneka kweNdibano | I-CHIP+0.035mmCpk ≥1.0 | |
| Ubungakanani bamacandelo | Iindidi ezili-140 (8mm umqulu) | |
| YAMAHA YS24 | kwimeko yokuhambisa ibhodi e-1 | L50xW50mm -L700xW460mm |
| Isantya sethiyori ye-SMD | 72,000CPH(0.05 s/chip) | |
| Uluhlu lweNdibano | 0201 (mm) -32 * mm ubude becandelo lokunyuka: 6.5mm | |
| Ukuchaneka kweNdibano | ± 0.05mm, ± 0.03mm | |
| Ubungakanani bamacandelo | 120iintlobo (8mm umqulu) | |
| YAMAHA YSM10 | kwimeko yokuhambisa ibhodi e-1 | L50xW50mm ~L510xW460mm |
| Isantya sethiyori ye-SMD | 46000CPH(0.078 s/chip) | |
| Uluhlu lweNdibano | 0201 (mm) -45 * mm ubude becandelo lokunyuka: 15mm | |
| Ukuchaneka kweNdibano | ± 0.035mm Cpk ≥1.0 | |
| Ubungakanani bamacandelo | Iintlobo ezingama-48 (i-8mm reel)/15 iintlobo zeetreyi ze-IC ezizenzekelayo | |
| JT TEA-1000 | Ingoma nganye emibini iyahlengahlengiswa | I-W50 ~ 270mm substrate / ingoma enye iyahlengahlengiswa W50 * W450mm |
| Ubude bamacandelo kwi-PCB | phezulu/ezantsi 25mm | |
| Isantya somhambisi | 300 ~ 2000mm/umzuzwana | |
| I-ALEader ALD7727D AOI kwi-intanethi | Isisombululo/Uluhlu olubonakalayo/Isantya | Ukhetho:7um/pixel FOV:28.62mmx21.00mm Standard:15um pixel FOV:61.44mmx45.00mm |
| Ukubona isantya | ||
| Inkqubo yekhowudi yebha | ukuqondwa kwekhowudi yebha ngokuzenzekelayo (ikhowudi yebha okanye ikhowudi yeQR) | |
| Uluhlu lobungakanani bePCB | 50x50mm(min)~510x300mm(ubukhulu) | |
| Ingoma e-1 ilungisiwe | Ingoma e-1 ilungisiwe, i-2/3/4 ingoma iyahlengahlengiswa; ubungakanani phakathi kwe-2 kunye ne-3 track yi-95mm; ubungakanani obukhulu phakathi kwe-1 kunye ne-4 track yi-700mm. | |
| Umgca omnye | Ubukhulu bengoma ububanzi yi-550mm. Ingoma ephindwe kabini : ubukhulu bengoma ephindwe kabini ububanzi yi-300mm(ububanzi obunokumetwa); | |
| Uluhlu lwePCB ubukhulu | 0.2mm-5mm | |
| PCB imvume phakathi phezulu nasezantsi | PCB icala eliphezulu: 30mm / PCB icala ezantsi: 60mm | |
| I-3D SPI SINIC-TEK | Inkqubo yekhowudi yebha | ukuqondwa kwekhowudi yebha ngokuzenzekelayo (ikhowudi yebha okanye ikhowudi yeQR) |
| Uluhlu lobungakanani bePCB | 50x50mm(min)~630x590mm(ubukhulu) | |
| Ukuchaneka | 1μm, ubude: 0.37um | |
| Ukuphindaphinda | 1um (4sigma) | |
| Isantya sebala elibonakalayo | 0.3s/indawo yokubona | |
| Indawo yokukhangela ixesha lokubona | 0.5s/inqaku | |
| Ubude obuphezulu bokubona | ± 550um ~ 1200μm | |
| Ubude bokulinganisa obuphezulu be-PCB elwayo | ±3.5mm~±5mm | |
| Ubuncinci besithuba sepadi | I-100um (esekelwe kwi-soler pad kunye nobude be-1500um) | |
| Ubuncinci bobungakanani bovavanyo | uxande 150um, setyhula 200um | |
| Ubude becandelo kwi-PCB | phezulu/ezantsi 40mm | |
| PCB ubukhulu | 0.4~7mm | |
| Unicomp X-Ray detector 7900MAX | Uhlobo lwetyhubhu yokukhanya | uhlobo oluvalelweyo |
| Umbane wetyhubhu | 90kV | |
| Ubuninzi bemveliso yamandla | 8W | |
| Ubungakanani bojoliso | 5μm | |
| Umtshini | inkcazo ephezulu FPD | |
| Ubungakanani bePixel | ||
| Ubungakanani bokubona obusebenzayo | 130*130[mm] | |
| Imatrix yePixel | 1536*1536[pixel] | |
| Umgangatho wefreyimu | 20fps | |
| Ukwandiswa kwenkqubo | 600X | |
| Indawo yokukhangela | Inokukhangela ngokukhawuleza imifanekiso ebonakalayo | |
| Ukulinganisa okuzenzekelayo | Unokulinganisa ngokuzenzekelayo amaqamza kwii-elektroniki ezipakishweyo njenge-BGA & QFN | |
| Ubhaqo oluzenzekelayo lwe-CNC | Xhasa inqaku elinye kunye nokudibanisa imatrix, ukuvelisa ngokukhawuleza iiprojekthi kwaye uzibone ngeso lengqondo | |
| Ukwandiswa kwejiyometri | 300 amaxesha | |
| Izixhobo zokulinganisa ezohlukeneyo | Xhasa imilinganiselo yejometri enjengomgama, i-engile, i-diameter, ipholygon, njl | |
| Iyakwazi ukubona iisampulu kwi-engile ye-70 degree | Inkqubo inokwandisa ukuya kuthi ga kwi-6,000 | |
| Ukufunyanwa kwe-BGA | Ukwandiswa okukhulu, umfanekiso ocacileyo, kwaye kulula ukubona amalungu e-solder ye-BGA kunye nokuqhekeka kwetoti | |
| Iqonga | Iyakwazi ukumisa kwizalathiso ze-X,Y kunye no-Z; Ukubekwa ngokwemigaqo yeetyhubhu ze-X-ray kunye ne-X-ray detectors | |