Amandla Okuhlanganisa i-PCB
I-SMT, igama eliphelele ubuchwepheshe bokufaka ubuso. I-SMT iyindlela yokufaka izingxenye noma izingxenye emabhodini. Ngenxa yomphumela ongcono kanye nokusebenza kahle okuphezulu, i-SMT isibe yindlela eyinhloko esetshenziswa enqubweni yokuhlanganisa i-PCB.
Izinzuzo zokuhlanganiswa kwe-SMT
1. Usayizi omncane futhi olula
Ukusebenzisa ubuchwepheshe be-SMT ukuhlanganisa izingxenye ebhodini kusiza ngqo ekunciphiseni usayizi wonke kanye nesisindo sama-PCB. Le ndlela yokuhlanganisa isenza sikwazi ukubeka izingxenye eziningi endaweni elinganiselwe, okungafeza imiklamo emincane nokusebenza okungcono.
2. Ukuthembeka okuphezulu
Ngemva kokuthi i-prototype isiqinisekisiwe, yonke inqubo yokuhlanganisa i-SMT cishe izenzakalelayo ngemishini enembile, okwenza kunciphisa amaphutha angabangelwa ukubandakanyeka ngesandla. Ngenxa yokwenza okuzenzakalelayo, ubuchwepheshe be-SMT buqinisekisa ukuthembeka nokungaguquguquki kwama-PCB.
3. Ukonga izindleko
Ukuhlanganiswa kwe-SMT kuvame ukwenziwa ngemishini ezenzakalelayo. Nakuba izindleko zokufaka zemishini ziphezulu, imishini ezenzakalelayo isiza ukunciphisa izinyathelo ezenziwe ngesandla ngesikhathi sezinqubo ze-SMT, okuthuthukisa kakhulu ukusebenza kahle kokukhiqiza futhi kwehlise izindleko zomsebenzi ngokuhamba kwesikhathi. Futhi kunezinto ezimbalwa ezisetshenziswayo kune-through-hole assemble, futhi izindleko zizoncishiswa.
| Amandla e-SMT: amaphuzu angu-19,000,000 ngosuku | |
| Imishini Yokuhlola | Isitholi se-X-RAY esingonakalisi, Isitholi Sesihloko Sokuqala, i-A0I, isitholi se-ICT, Ithuluzi Lokusebenza Kabusha le-BGA |
| Isivinini Sokufaka | 0.036 S/pcs (Isimo Esingcono Kakhulu) |
| Izingxenye Ezicacisiwe. | Iphakheji encane enamathelayo |
| Ukunemba okuncane kwemishini | |
| Ukunemba kwe-chip ye-IC | |
| I-PCB Spec efakwe. | Usayizi we-substrate |
| Ubukhulu be-substrate | |
| Izinga Lokukhahlela | 1. Impedance Capacitance Isilinganiso: 0.3% |
| 2.IC ngaphandle kokukhahlela | |
| Uhlobo Lwebhodi | I-POP/I-PCB Ejwayelekile/I-FPC/I-Rigid-Flex PCB/I-PCB Esekelwe Ensimbi |
| Amandla e-DIP Daily | |
| Umugqa we-plug-in we-DIP | Amaphuzu angu-50,000 ngosuku |
| Umugqa wokugoqa weposi le-DIP | Amaphuzu angu-20,000 ngosuku |
| Umugqa wokuhlola we-DIP | Ama-PCBA angu-50,000/ngosuku |
| Amandla Okukhiqiza Emishini Eyinhloko ye-SMT | ||
| Umshini | Ibanga | Ipharamitha |
| Iphrinta ye-GKG GLS | Ukuphrinta kwe-PCB | 50x50mm ~ 610x510mm |
| ukunemba kokuphrinta | ± 0.018mm | |
| Usayizi wohlaka | 420x520mm-737x737mm | |
| ububanzi bobukhulu be-PCB | 0.4-6mm | |
| Umshini ohlanganisiwe wokufaka inqwaba | I-PCB yokudlulisa uphawu | 50x50mm ~ 400x360mm |
| Susa ukudideka | I-PCB yokudlulisa uphawu | 50x50mm ~ 400x360mm |
| I-YAMAHA YSM20R | uma kwenzeka kuthunyelwa ibhodi eli-1 | L50xW50mm -L810xW490mm |
| Isivinini se-SMD esingokwemfundiso | 95000CPH(0.027 s/itshiphu) | |
| Ibanga lokuhlanganisa | 0201(mm)-45*45mm ukuphakama kokufakwa kwengxenye: ≤15mm | |
| Ukunemba kokuhlanganiswa | I-CHIP+0.035mmCpk ≥1.0 | |
| Inani lezingxenye | Izinhlobo ezingu-140 (ukuskrola okungu-8mm) | |
| I-YAMAHA YS24 | uma kwenzeka kuthunyelwa ibhodi eli-1 | L50xW50mm -L700xW460mm |
| Isivinini se-SMD esingokwemfundiso | 72,000CPH(0.05 s/chip) | |
| Ibanga lokuhlanganisa | 0201(mm)-32*mm ukuphakama kokufakwa kwengxenye: 6.5mm | |
| Ukunemba kokuhlanganiswa | ±0.05mm, ±0.03mm | |
| Inani lezingxenye | Izinhlobo ezingu-120 (ukuskrola okungu-8mm) | |
| I-YAMAHA YSM10 | uma kwenzeka kuthunyelwa ibhodi eli-1 | L50xW50mm ~L510xW460mm |
| Isivinini se-SMD esingokwemfundiso | 46000CPH(0.078 s/itshiphu) | |
| Ibanga lokuhlanganisa | 0201(mm)-45*mm ukuphakama kokufakwa kwengxenye: 15mm | |
| Ukunemba kokuhlanganiswa | ±0.035mm Cpk ≥1.0 | |
| Inani lezingxenye | Izinhlobo ezingu-48 (i-reel engu-8mm)/izinhlobo ezingu-15 zamathreyi e-IC azenzakalelayo | |
| Itiye le-JT-1000 | Ithrekhi ngayinye ekabili iyalungiseka | I-W50~270mm substrate/ithrekhi eyodwa iyalungiseka W50*W450mm |
| Ukuphakama kwezingxenye ku-PCB | phezulu/phansi 25mm | |
| Isivinini se-Conveyor | 300~2000mm/umzuzwana | |
| I-ALeader ALD7727D AOI eku-inthanethi | Isixazululo/Ububanzi bokubuka/Isivinini | Inketho: 7um/pixel FOV: 28.62mmx21.00mm Okujwayelekile: 15um pixel FOV: 61.44mmx45.00mm |
| Isivinini sokuthola | ||
| Uhlelo lwekhodi yebha | ukuqashelwa kwekhodi yebha okuzenzakalelayo (ikhodi yebha noma ikhodi ye-QR) | |
| Ububanzi bosayizi we-PCB | 50x50mm(iminithi)~510x300mm(ubuningi) | |
| Ithrekhi eli-1 lilungisiwe | Ithrekhi eli-1 lizinzile, ithrekhi eli-2/3/4 lingalungiseka; usayizi omncane ophakathi kwethrekhi eli-2 neli-3 ungama-95mm; usayizi ophezulu ophakathi kwethrekhi eli-1 neli-4 ungama-700mm. | |
| Umugqa owodwa | Ububanzi bethrekhi obuphezulu bungu-550mm. Ithrekhi ephindwe kabili: ububanzi bethrekhi ephindwe kabili obuphezulu bungu-300mm (ububanzi obulinganiswayo); | |
| Ububanzi bobukhulu be-PCB | 0.2mm-5mm | |
| Isikhala se-PCB phakathi kwephezulu nephansi | Uhlangothi oluphezulu lwe-PCB: 30mm / Uhlangothi olungezansi lwe-PCB: 60mm | |
| I-3D SPI SINIC-TEK | Uhlelo lwekhodi yebha | ukuqashelwa kwekhodi yebha okuzenzakalelayo (ikhodi yebha noma ikhodi ye-QR) |
| Ububanzi bosayizi we-PCB | 50x50mm(iminithi)~630x590mm(ubuningi) | |
| Ukunemba | 1μm, ukuphakama: 0.37um | |
| Ukuphindaphinda | 1um (4sigma) | |
| Isivinini sensimu ebonakalayo | 0.3s/insimu ebonakalayo | |
| Isikhathi sokuthola indawo yokubhekisela | 0.5s/iphuzu | |
| Ukuphakama okuphezulu kokutholwa | ±550um~1200μm | |
| Ukuphakama okuphezulu kokulinganisa kwe-PCB yokugoba | ±3.5mm~±5mm | |
| Isikhala esincane sephedi | 100um (isekelwe kuphedi yesoli enokuphakama okungu-1500um) | |
| Usayizi wokuhlola omncane | unxande ongu-150um, umjikelezo ongu-200um | |
| Ukuphakama kwengxenye ku-PCB | phezulu/phansi 40mm | |
| Ubukhulu be-PCB | 0.4 ~ 7mm | |
| Isitholi se-X-ray se-Unicomp 7900MAX | Uhlobo lwepayipi elikhanyayo | uhlobo oluvalekile |
| I-voltage yeshubhu | 90kV | |
| Amandla okukhipha aphezulu | 8W | |
| Usayizi wokugxila | 5μm | |
| Isitholi | i-FPD enencazelo ephezulu | |
| Usayizi we-Pixel | ||
| Usayizi wokutholwa osebenzayo | 130*130[mm] | |
| I-matrix ye-Pixel | 1536*1536[iphikseli] | |
| Ukukalwa kwe fulemu | 20fps | |
| Ukukhuliswa kwesistimu | 600X | |
| Indawo yokuzulazula | Ingathola ngokushesha izithombe ezibonakalayo | |
| Ukulinganisa okuzenzakalelayo | Ingalinganisa ngokuzenzakalelayo amabhamuza kuma-elekthronikhi apakishiwe njenge-BGA ne-QFN | |
| Ukutholwa okuzenzakalelayo kwe-CNC | Sekela iphuzu elilodwa kanye nokwengezwa kwe-matrix, khiqiza ngokushesha amaphrojekthi bese uwabona ngeso lengqondo | |
| Ukukhuliswa kwejiyometri | Izikhathi ezingu-300 | |
| Amathuluzi okulinganisa ahlukahlukene | Sekela izilinganiso zejometri ezifana nebanga, i-engeli, ububanzi, i-polygon, njll. | |
| Ingathola amasampula nge-engeli engama-degree angu-70 | Uhlelo lunokukhuliswa okufika ku-6,000 | |
| Ukutholwa kwe-BGA | Ukukhulisa okukhulu, isithombe esicacile, futhi kulula ukubona amajoyinti e-BGA solder kanye nemifantu yethini | |
| Isiteji | Iyakwazi ukubeka amashubhu e-X-ray kanye nezitholi ze-X-ray ngendlela eqondile; | |