Ikhono Lomhlangano we-PCB
I-SMT, igama eligcwele ubuchwepheshe be-surface mount. I-SMT iyindlela yokukhweza izingxenye noma izingxenye emabhodini. Ngenxa yomphumela ongcono nokusebenza kahle okuphezulu, i-SMT isiphenduke indlela eyinhloko esetshenziswa inqubo yokuhlanganisa i-PCB.
Izinzuzo zokuhlanganisa i-SMT
1. Usayizi omncane futhi ongasindi
Ukusebenzisa ubuchwepheshe be-SMT ukuhlanganisa izingxenye ebhodini kusiza ngokuqondile ukwehlisa wonke usayizi nesisindo sama-PCB. Le ndlela yokuhlanganisa isivumela ukuthi sibeke izingxenye eziningi endaweni evinjelwe, ezingafinyelela imiklamo ehlangene nokusebenza okungcono.
2. Ukuthembeka okuphezulu
Ngemva kokuqinisekisa ukuthi i-prototype, yonke inqubo yokuhlanganisa ye-SMT cishe izenzakalelayo ngemishini enembayo, okuyenza inciphise amaphutha angase abalwe ukubandakanyeka mathupha. Ngenxa yokuzenzakalela, ubuchwepheshe be-SMT buqinisekisa ukwethembeka nokuvumelana kwama-PCB.
3. Ukonga izindleko
Ukuhlangana kwe-SMT kuvame ukubona ngemishini ezenzakalelayo. Nakuba izindleko zokufakwa kwemishini ziphezulu, imishini ezenzakalelayo isiza ukunciphisa izinyathelo ezenziwa ngesandla phakathi nezinqubo ze-SMT, okuthuthukisa kakhulu ukusebenza kahle kokukhiqiza nokwehlisa izindleko zabasebenzi ngokuhamba kwesikhathi. Futhi kunezinto ezimbalwa ezisetshenziswayo kunokuhlanganisa imbobo, futhi izindleko zizokwehla, futhi.
| Amandla e-SMT: 19,000,000 amaphuzu/ngosuku | |
| Izisetshenziswa zokuhlola | Umtshina we-X-RAY ongabhubhisi, Umtshina Wokuqala Wesihloko, i-A0I, umtshina we-ICT, i-BGA Rework Instrument |
| Isivinini Sokukhweza | 0.036 S/pcs (Isimo Esingcono Kakhulu) |
| I-Components Spec. | Iphakheji elincane elinamathelayo |
| Ubuncane bokunemba kwemishini | |
| Ukunemba kwe-IC chip | |
| I-PCB Spec. | Usayizi we-substrate |
| Ubukhulu be-substrate | |
| I-Kickout Rate | 1.I-Impedance Capacitance Ratio : 0.3% |
| 2.IC ngaphandle kokukhahlela | |
| Uhlobo Lwebhodi | POP/Regular PCB/FPC/Rigid-Flex PCB/Metal based PCB |
| Ikhono le-DIP lansuku zonke | |
| I-plug-in ye-DIP | 50,000 amaphuzu/ngosuku |
| I-DIP post solder line | 20,000 amaphuzu/ngosuku |
| Umugqa wokuhlola we-DIP | 50,000pcs PCBA/ngosuku |
| Amandla Okukhiqiza Izisetshenziswa Eziyinhloko ze-SMT | ||
| Umshini | Ibanga | Ipharamitha |
| Iphrinta ye-GKG GLS | Ukuphrinta kwe-PCB | 50x50mm ~ 610x510mm |
| ukunemba kokuphrinta | ±0.018mm | |
| Usayizi wozimele | 420x520mm-737x737mm | |
| ububanzi be-PCB ukujiya | 0.4-6mm | |
| Umshini ohlanganisiwe wokupakisha | PCB ehambisa uphawu | 50x50mm~400x360mm |
| I-Unwinder | PCB ehambisa uphawu | 50x50mm~400x360mm |
| YAMAHA YSM20R | uma kudluliswa ibhodi eli-1 | L50xW50mm -L810xW490mm |
| Isivinini setiyetha ye-SMD | 95000CPH(0.027 s/chip) | |
| Ibanga lomhlangano | 0201(mm)-45*45mm ubude bokukhweza ingxenye: ≤15mm | |
| Ukunemba komhlangano | I-CHIP+0.035mmCpk ≥1.0 | |
| Inani lezingxenye | 140 izinhlobo (8mm umqulu) | |
| YAMAHA YS24 | uma kudluliswa ibhodi eli-1 | L50xW50mm -L700xW460mm |
| Isivinini setiyetha ye-SMD | 72,000CPH(0.05 s/chip) | |
| Ibanga lomhlangano | 0201(mm)-32*mm ubude bokukhweza bengxenye: 6.5mm | |
| Ukunemba komhlangano | ±0.05mm, ±0.03mm | |
| Inani lezingxenye | 120types (8mm scroll) | |
| YAMAHA YSM10 | uma kudluliswa ibhodi eli-1 | L50xW50mm ~L510xW460mm |
| Isivinini setiyetha ye-SMD | 46000CPH(0.078 s/chip) | |
| Ibanga lomhlangano | 0201(mm)-45*mm ubude bokukhweza bengxenye: 15mm | |
| Ukunemba komhlangano | ±0.035mm Cpk ≥1.0 | |
| Inani lezingxenye | Izinhlobo ezingu-48(i-8mm reel)/15 izinhlobo zamathreyi e-IC azenzakalelayo | |
| I-JT TEA-1000 | Ithrekhi ngayinye ekabili iyalungiseka | I-W50~270mm substrate/ithrekhi eyodwa iyalungiseka W50*W450mm |
| Ukuphakama kwezingxenye ku-PCB | phezulu/phansi 25mm | |
| Isivinini se-Conveyor | 300 ~ 2000mm / isekhondi | |
| I-ALEader ALD7727D AOI ku-inthanethi | Ukulungiswa/Ibanga elibonakalayo/Isivinini | Inketho:7um/pixel FOV:28.62mmx21.00mm Okujwayelekile:15um pixel FOV:61.44mmx45.00mm |
| Ithola isivinini | ||
| Isistimu yekhodi yebha | ukuqashelwa kwekhodi yebha okuzenzakalelayo (ikhodi yebha noma ikhodi ye-QR) | |
| Ibanga losayizi we-PCB | 50x50mm(min)~510x300mm(ubukhulu) | |
| Ithrekhi engu-1 ilungisiwe | Ithrekhi engu-1 ilungisiwe, ithrekhi engu-2/3/4 iyalungiseka; usayizi ophakathi kuka-2 no-3 wethrekhi ungu-95mm; usayizi omkhulu phakathi kwethrekhi engu-1 no-4 ngu-700mm. | |
| Umugqa owodwa | Ububanzi bethrekhi obukhulu bungu-550mm. Ithrekhi ekabili : ububanzi bethrekhi ekabili ubukhulu bungu-300mm(ububanzi obulinganisekayo); | |
| Ububanzi be-PCB ukujiya | 0.2mm-5mm | |
| PCB imvume phakathi phezulu naphansi | Uhlangothi olungaphezulu lwe-PCB: 30mm / PCB ohlangothini olungezansi: 60mm | |
| I-3D SPI SINIC-TEK | Isistimu yekhodi yebha | ukuqashelwa kwekhodi yebha okuzenzakalelayo (ikhodi yebha noma ikhodi ye-QR) |
| Ibanga losayizi we-PCB | 50x50mm(min)~630x590mm(ubukhulu) | |
| Ukunemba | 1μm, ubude: 0.37um | |
| Ukuphindaphinda | 1um (4sigma) | |
| Isivinini senkambu ebonakalayo | 0.3s/inkambu yokubuka | |
| Isikhathi sokuthola iphoyinti lesithenjwa | 0.5s/iphoyinti | |
| Ukuphakama okuphezulu kokutholwa | ±550um~1200μm | |
| Ukuphakama kokulinganisa okuphezulu kwe-PCB eguquguqukayo | ±3.5mm~±5mm | |
| Isikhala sephedi esincane | I-100um (kusekelwe kuphedi ye-soler enobude obungu-1500um) | |
| Usayizi omncane wokuhlola | unxande 150um, indilinga 200um | |
| Ukuphakama kwengxenye ku-PCB | phezulu / phansi 40mm | |
| Ubukhulu be-PCB | 0.4-7mm | |
| Umtshina we-Unicomp X-Ray 7900MAX | Uhlobo lweshubhu elikhanyayo | uhlobo olufakiwe |
| I-tube voltage | 90kV | |
| Amandla okukhipha aphezulu | 8W | |
| Usayizi wokugxila | 5mm | |
| Umtshina | Inani eliphakeme kakhulu lama-FPD | |
| Usayizi wephikseli | ||
| Usayizi wokutholwa osebenzayo | 130*130[mm] | |
| I-Pixel matrix | 1536*1536[pixel] | |
| Ukukalwa kwe fulemu | 20fps | |
| Ukukhulisa uhlelo | 600X | |
| Ukuma kokuzulazula | Ingathola ngokushesha izithombe ezibonakalayo | |
| Ukulinganisa okuzenzakalelayo | Ingakwazi ukulinganisa amabhamuza ngokuzenzakalela kuma-electronics apakishiwe njenge-BGA ne-QFN | |
| Ukutholwa okuzenzakalelayo kwe-CNC | Sekela iphuzu elilodwa kanye nokwengezwa kwe-matrix, khiqiza ngokushesha amaphrojekthi futhi uwabone ngeso lengqondo | |
| Ukukhulisa iJiyomethri | izikhathi ezingu-300 | |
| Amathuluzi okulinganisa ahlukahlukene | Sekela izilinganiso zejiyomethri njengebanga, i-engeli, ububanzi, ipholygoni, njll | |
| Ingathola amasampula nge-engeli engu-70 degree | Uhlelo lunokukhuliswa okungafika ku-6,000 | |
| Ukutholwa kwe-BGA | Ukukhuliswa okukhudlwana, isithombe esicacile, futhi kulula ukubona amalunga e-BGA solder nokuqhekeka kwethini | |
| Isiteji | Iyakwazi ukubeka ku-X,Y kanye no-Z; Ukuma okuqondile kwamashubhu e-X-ray kanye nezitholi ze-X-ray | |