Cikakken Jagora ga Tsarin Masana'antar PCB | Bayanin Samar da PCB na HDI

1. Hoton IL (Hoton Layer na Ciki)

Ana canja tsarin da'ira zuwa cikin layukan tagulla ta amfani da dabarun photolithography, suna samar da alamun tushe na PCBs masu layuka da yawa.

2. I/L AOI (Dubawar Hasken Ciki Mai Aiki da Kai)

Injinan AOI masu inganci suna duba layukan ciki don ganin gajerun wando, buɗewa, da lahani na tsari, suna tabbatar da daidaiton kewaye kafin a yi amfani da laminating.

3. B/Oxide (Baƙin Oxide ko Maganin Oxidation)3. B/Oxide

Ana shafa wani shafi na oxide ko black oxide a saman jan ƙarfe na ciki don ƙara mannewa tare da yadudduka na prepreg yayin lamination.

4. Layuka

Ana tara layukan ciki, prepreg (resin mai-warkewa), da kuma foil ɗin jan ƙarfe na waje bisa ga ƙirar don shirya don haɗa layuka da yawa.

5. Dannawa (Lamination)

Ana sanya tarin a cikin yanayin zafi mai yawa da matsin lamba a cikin injin matse lamination, yana haɗa layukan zuwa cikin babban core na PCB mai layer da yawa.

6. Hakowar Laser

Ana haƙa ƙananan ƙwayoyin microvia da na'urorin laser don haɗa layukan waje zuwa takamaiman layukan ciki, waɗanda suke da mahimmanci don ƙirar BGA mai kyau da HDI.

8. PTH (Ramin da aka Rufe ta Ramin)

An lulluɓe ramukan da ke ratsawa ta hanyar sinadarai da kuma ta hanyar lantarki da jan ƙarfe don kafa haɗin lantarki a fadin layuka da yawa.

9. Rufe Faifan Rufi

Matakin rufewa da tagulla mai cikakken panel yana ƙara kauri na hanyoyin sarrafawa kuma yana tabbatar da daidaiton ƙarfe a cikin ramukan da aka haƙa.

10. Hoton O/L (Hoton Layer na Waje)

Ana canja tsarin da'ira zuwa foils na jan ƙarfe na waje ta amfani da hasken photoresist da hasken UV, kama da hoton Layer na ciki.

11. Rufe Tsarin

Zaɓaɓɓun faranti na jan ƙarfe yana ƙarfafa wuraren da ke samar da alamun da'ira yayin da ake cire jan ƙarfe mara mahimmanci a mataki na gaba.

12. Sake yin SES

Sinadaran da ke lalata tagulla suna narkar da jan ƙarfe mara kariya, suna barin takamaiman fasalulluka na da'ira waɗanda suka dace da tsarin ƙira.

13. O/L AOI (Layin waje AOI)

Ana sake duba saman saman ta atomatik don gano duk wani lahani kamar buɗewa, gajeren wando, ko kuskuren daidaitawa.

14. S/Mask (Aika abin rufe fuska na solder)

Ana amfani da tawada mai rufe fuska ta hanyar fallasawa da haɓakawa don kare allon daga iskar shaka da kuma hana gadojin solder yayin haɗuwa.

15. Legend (Buga Allon Silk)

Ana buga alamun sassa, tambari, da masu tsara ma'auni don taimakawa wajen haɗawa, gwaji, da kuma yin hidima.

16. Kammalawa a saman (Maganin saman)

Reshen Hagu (Mafi Girman Ƙarshe):

●ENIG (Zinare Mai Nutsewa Ba Tare da Wutar Lantarki ba)

●ENEPIG (Zinare Mai Nutsewa Ba Tare da Electro Nickel Ba Tare da Electroless Palladium Ba)

●Zinare Mai Tauri, Zinare Mai Taushi

●HASL (Matsayin Solder Mai Zafi) da LF-HASL (Ba Ya Da Guba)

Waɗannan ƙarewa suna haɓaka ƙarfin soldering, juriya ga iskar shaka, da kuma dacewa da haɗin waya.

Reshen Dama (Madadin Gamawa):

●Tin Nutsewa, Azurfa Mai Nutsewa

●OSP (Masu kiyayewa na Organic) OSP

Waɗannan suna da inganci kuma sun dace da aikace-aikacen da suka dace da RoHS.

17. Hanyar (Bayanin CNC)

Ta amfani da na'urorin CNC ko na'urorin V-cut, ana niƙa PCB ɗin zuwa ga tsarinsa na ƙarshe kuma a raba shi zuwa allunan daban-daban.

18. ET (Gwajin Wutar Lantarki)

Gwaje-gwaje masu zurfi da na gajeru suna tabbatar da cewa dukkan da'irori suna da alaƙa da kyau kuma babu lahani a cikin wutar lantarki.

19. FV (Dubawar Gani ta Ƙarshe)

Masu duba ƙwararru suna yin gwajin inganci da hannu don gano duk wata matsala ta gani ko rashin daidaito kafin jigilar kaya.

Manufofin Samfurin PCB na HDI: Matakai Masu Inganci don Zane-zane Masu Yawan Kauri na HDI PCB

Cab ɗin HDI (High-Density Interconnect) sun wuce tsarin masana'antu na yau da kullun ta hanyar ba da damar layuka masu kyau, microvias, da ƙananan siffofi da ake buƙata a cikin wayoyin komai da ruwanka, na'urorin IoT, da kwamfuta mai ci gaba.