Isikhokelo esipheleleyo seNkqubo yokuVelisa iPCB | Inkcazo yeMveliso ye-HDI PCB

1. Umfanekiso we-IL (Umfanekiso weLeya yangaphakathi)

Iipateni zesekethe zidluliselwa kwiileya zobhedu zangaphakathi kusetyenziswa iindlela ze-photolithography, zenze imikhondo esisiseko yee-PCB ezineeleya ezininzi.

2. I/L AOI (Uhlolo lwe-Inner Layer Automated Optical)

Oomatshini be-AOI abanesisombululo esiphezulu bahlola iileya zangaphakathi ukuze babone ukuba azikho iibhulukhwe ezimfutshane, ezivulekileyo, nezingalunganga kwiipateni, beqinisekisa ukuba zichanekile iisekethe ngaphambi kokuba zifakwe i-lamination.

3. I-B/Oxide (Unyango lwe-Oxide emnyama okanye i-Oxidation)3. I-B/Oxide

Ingubo ye-oxide okanye ye-oxide emnyama ifakwa kwiindawo zobhedu zangaphakathi ukuze kuphuculwe ukunamathelana ngee-prepreg layers ngexesha le-lamination.

4. Ukulala phantsi

Iileya zangaphakathi, i-prepreg (i-semi-cured resin), kunye neefoyile zobhedu zangaphandle zibekwe ngokwendlela yoyilo ukulungiselela ukubophelela kweeleya ezininzi.

5. Cinezela (iLamination)

I-stack ifakwa kubushushu obuphezulu kunye noxinzelelo kwi-lamination press, idibanisa iileya kwi-PCB core eqinileyo ene-multilayer core.

6. Ukubhola ngeLaser

IiMicrovias zigrunjwa ngeelaser ukuze kuqhagamshelwe iileya zangaphandle kwiileya ezithile zangaphakathi, ezibalulekileyo kwi-BGA ethambileyo (i-Fine-pitch BGA) kunye noyilo lwe-HDI.

8. I-PTH (Ifakwe Umngxuma)

Imingxunya edlulayo igqunywe ngekopolo ngokweekhemikhali nangokwe-electrolytic ukuze kusekwe uqhagamshelo lombane kwiileya ezininzi.

9. Ukubekwa kwephaneli

Inyathelo lokugquma ubhedu elinephaneli epheleleyo lonyusa ubukhulu beendlela eziqhuba umbane kwaye liqinisekisa ukwenziwa kwesinyithi okufanayo kwimingxunya eyombiweyo.

10. Umfanekiso we-O/L (Umfanekiso weLeya yangaphandle)

Iipateni zesekethe zidluliselwa kwiifoyile zobhedu zangaphandle kusetyenziswa i-photoresist kunye nokuvezwa kwe-UV, okufana nemifanekiso yeleya yangaphakathi.

11. Ukupeyinta iipateni

Ukufakwa kwe-copper plating ekhethekileyo kuqinisa iindawo ezenza imikhondo yesekethe ngelixa i-non-essential copper isuswa kwinyathelo elilandelayo.

12. Ukukrola i-SES

Izinto zokusika iikhemikhali ziyanyibilikisa ubhedu olungakhuselekanga, zishiya ngasemva iimpawu zesekethe ezichanekileyo ezihambelana noyilo loyilo.

13. I-O/L AOI (Umaleko wangaphandle i-AOI)

Iileya zangaphandle ziphinda zihlolwe ngokuzenzekelayo ukuze kufunyanwe naziphi na iziphene ezifana nokuvula, iishothi, okanye ukungalungelelani kakuhle.

14. Imaski/Imaski (Ukusetyenziswa kweMaski yeSolder)

I-inki yemaski yesolder isetyenziswa kwaye ifanekiswe ngokuvezwa kunye nophuhliso ukukhusela ibhodi kwi-oxidation kunye nokuthintela iibhulorho zesolder ngexesha lokuhlanganiswa.

15. Intsomi (Ushicilelo lweSilkscreen)

Izihlonzi zecandelo, iilogo, kunye nabayili bezalathiso ziprintwa ukunceda ekuhlanganiseni, ekuvavanyeni, nasekulungiseni.

16. Ukugqitywa komphezulu (Unyango lomphezulu)

Isebe Lasekhohlo (Iimpahla Ezigqityiweyo Eziphezulu):

●ENIG (Igolide yokuntywiliselwa ngaphandle kweNickel)

●I-ENEPIG (iGolide yokuntywiliselwa kweNickel engenambane engenambane)

●Igolide Eqinileyo, Igolide Ethambileyo

●I-HASL (Ukulinganisa i-Hot Air Solder) kunye ne-LF-HASL (Engenalo i-Lead)

Ezi zinto zokugqibela ziphucula ukukwazi ukunyibilikisa i-solder, ukumelana ne-oxidation, kunye nokuhambelana kwe-wire bonding.

Isebe Lasekunene (Iindlela Ezingafaniyo Zokugqiba):

●Itini yokuntywiliselwa, iSilivere yokuntywiliselwa

●Izithinteli zokuSondeza ze-OSP (Organic Solderability Preservatives)OSP

Ezi zibiza kancinci kwaye zifanelekile kwizicelo ezihambelana ne-RoHS.

17. Indlela (iProfayili ye-CNC)

Ngokusebenzisa ii-routers ze-CNC okanye oomatshini abasikiweyo nge-V, i-PCB iyasilwa ukuya kutsho kumgca wayo wokugqibela ize yahlulwe ibe ngamabhodi ngamanye.

18. ET (Uvavanyo loMbane)

Uvavanyo olupheleleyo oluvulekileyo/olufutshane luqinisekisa ukuba zonke iisekethe ziqhagamshelwe ngokufanelekileyo kwaye akukho ziphene zombane.

19. FV (Uhlolo lokugqibela lokubona)

Abahloli abanobuchule benza uhlolo lomgangatho ngesandla ukuze babone naziphi na iziphene ezibonakalayo okanye ukungangqinelani kwazo ngaphambi kokuba zithunyelwe.

Ukwenziwa kwe-HDI PCB: Amanyathelo Aphuculweyo Oyilo Oluxineneyo I-HDI PCB

Ii-PCB ze-HDI (High-Density Interconnect) zidlula iinkqubo zokuvelisa eziqhelekileyo ngokuvumela imigca emincinci kakhulu, ii-microvias, kunye nezinto ezifunekayo kwiifowuni eziphathwayo, izixhobo ze-IoT, kunye nekhompyutha ephucukileyo.