Umhlahlandlela Ophelele Wenqubo Yokukhiqiza i-PCB | Incazelo Yokukhiqizwa kwe-HDI PCB
Ngemuva kwayo yonke idivayisi kagesi ethembekile kukhona ibhodi lesifunda eliphrintiwe ngokucophelela (i-PCB). Kusukela engqalasizinda ye-5G kuya kuma-elekthronikhi ezimoto, amadivayisi ezokwelapha, kanye namagajethi abathengi, ama-PCB akha umgogodla wezinhlelo ze-elekthronikhi. Ukuqonda inqubo yokukhiqiza eningiliziwe kubalulekile konjiniyela bokuklama, abaphathi bekhwalithi, kanye nochwepheshe bokuthenga abahlose ukusebenza okuphezulu nokuthembeka.
Kulesi sihloko, sembula inqubo ephelele yokukhiqiza i-PCB, kusukela ekuthathweni kwezithombe zesendlalelo sangaphakathi kuya ekuhlolweni kokugcina. Siphinde sihlole izinqubo ezikhethekile ze-HDI (High-Density Interconnect) ezivumela ukuminyana okuphezulu komzila kanye nezinto ezincane zefomu.
Inqubo Ejwayelekile Yokukhiqiza i-PCB: Izinyathelo Eziyinhloko Zichaziwe
1. Isithombe se-IL (Ukufanekisa Ngezingqimba Zangaphakathi)
Amaphethini wesekethe adluliselwa ezingqimbeni zethusi zangaphakathi kusetshenziswa amasu e-photolithography, akha imikhondo eyisisekelo yama-PCB anezingqimba eziningi.
2. I/L AOI (Ukuhlolwa Kokukhanya Okuzenzakalelayo Kwesendlalelo Sangaphakathi)
Imishini ye-AOI enesinqumo esiphezulu ihlola izendlalelo zangaphakathi ukuze ibone amafushane, ama-open, kanye namaphutha ephethini, iqinisekisa ukujikeleza okunembile ngaphambi kokubopha.
3. I-B/Oxide (Ukwelashwa Nge-Oxide Emnyama noma Ukuxutshwa Kwe-Oxidation)3. I-B/Oxide
Isembozo se-oxide noma se-black oxide sisetshenziswa ezindaweni zethusi zangaphakathi ukuze kuthuthukiswe ukunamathela ngezendlalelo ze-prepreg ngesikhathi se-lamination.
4. Ukulala phansi
Izendlalelo zangaphakathi, i-prepreg (i-semi-cured resin), kanye nama-foil ethusi angaphandle abekwe ngokwedizayini ukuze kulungiselelwe ukubopha kwezingqimba eziningi.
5. Cindezela (i-Lamination)
I-stack ifakwa ekushiseni okuphezulu kanye nengcindezi kumshini wokunyathelisa i-lamination, ohlanganisa izendlalelo zibe yi-core ye-PCB enezingqimba eziningi eqinile.
6. Ukubhoboza nge-laser
Ama-Microvia abholwa ngama-laser ukuze axhume izendlalelo zangaphandle nezendlalelo ezithile zangaphakathi, ezibalulekile kwi-BGA encishisiwe (i-Fine-pitch: https://www.richpcba.com/bga-assembly-capability/) kanye nemiklamo ye-HDI.
7. Ukubhoboza (Okomshini)
8. I-PTH (Efakwe Umgodi)
Izimbobo ezidlulayo zimbozwe ngethusi ngamakhemikhali nangama-electrolytic ukuze kusungulwe ukuxhumana kukagesi ezingqimbeni eziningi.
9. Ukufakwa Kwephaneli
Isinyathelo sokumboza ithusi esinephaneli egcwele sandisa ukujiya kwezindlela eziqhubayo futhi siqinisekisa ukwenziwa kwensimbi okufanayo kuzo zonke izimbobo ezibholiwe.
10. Isithombe se-O/L (Umfanekiso Wesendlalelo Sangaphandle)
Amaphethini wesekethe adluliselwa kuma-foil ethusi angaphandle kusetshenziswa i-photoresist kanye nokuchayeka kwe-UV, okufana nokuthwebula izithombe zengqimba yangaphakathi.
11. Ukufakwa Kwephethini
Ukufakwa kwethusi okukhethiwe kuqinisa izindawo ezakha imikhondo yesekethe kuyilapho ithusi elingabalulekile lisuswa esinyathelweni esilandelayo.
12. Ukuqopha kwe-SES
Izicucu zamakhemikhali zincibilikisa ithusi elingavikelwe, zishiya izici zesekethe eziqondile ezihambisana nomklamo.
13. I-O/L AOI (I-AOI Yesendlalelo Sangaphandle)
Izendlalelo zangaphandle ziphinde zihlolwe ngokuzenzakalelayo ukuze kutholakale noma yiziphi iziphambeko ezifana nokuvula, ama-short, noma ukungalungi kahle.
14. Imaski/Isivikelo (Ukusetshenziswa Kwemaski Yesolder)
Uyinki wemaski we-solder uyasetshenziswa futhi uhlelwe ngendlela yokuchayeka kanye nokuthuthukiswa ukuze kuvikelwe ibhodi ekungcolisweni kwe-oxidation futhi kuvinjelwe amabhuloho e-solder ngesikhathi sokuhlanganiswa.
15. Inganekwane (Ukunyathelisa Ngesikrini Se-Silkscreen)
Izihlonzi zezingxenye, ama-logo, kanye nezinkomba zezinkomba ziphrintiwe ukusiza ekuhlanganiseni, ekuhloleni, nasekulungiseni.
16. Ukuqeda Okungaphezulu (Ukwelashwa Okungaphezulu)
Igatsha Lesobunxele (Ukuqedwa Okuphezulu):
●ENIG (Igolide Elingenagesi Le-Nickel Ecwiliswe Nge-Electroless)
●I-ENEPIG (Igolide Elingenagesi le-Nickel Elingenagesi le-Palladium Ecwiliswe)
●Igolide Eliqinile, Igolide Elithambile
●I-HASL (Ukulinganisa Umoya Oshisayo) kanye ne-LF-HASL (Ayina-Lead)
Lokhu kuqedwa kuthuthukisa ukushintshwa kwe-soldering, ukumelana ne-oxidation, kanye nokuhambisana kwe-wire bonding.
Igatsha Lesokudla (Ukuqedwa Okuhlukile):
●Ithini Lokucwilisa, Isiliva Lokucwilisa
●Izithako Zokugcina Ukushintshwa Kwezinto Eziphilayo (i-OSP)
Lezi zisebenza kahle futhi zifanelekela izinhlelo zokusebenza ezihambisana ne-RoHS.
17. Umzila (i-CNC Profiling)
Kusetshenziswa ama-router e-CNC noma imishini eqoshiwe nge-V, i-PCB iyagaywa kuze kube yilapho ifika ekugcineni bese ihlukaniswa ngamabhodi ngamanye.
18. ET (Ukuhlolwa Kukagesi)
Ukuhlolwa okuphelele okuvulekile/okufushane kuqinisekisa ukuthi wonke amasekethe axhunywe kahle futhi azikho izinkinga zikagesi.
19. FV (Ukuhlolwa Kokugcina Kokubona)
Abahloli abanekhono benza ukuhlolwa kwekhwalithi ngesandla ukuze bathole noma yiziphi iziphambeko noma ukungavumelani kokubona ngaphambi kokuthunyelwa.
Ukukhiqizwa kwe-HDI PCB: Izinyathelo Ezithuthukisiwe Zemiklamo Enobuningi Obuningi I-HDI PCB
Ama-PCB e-HDI (High-Density Interconnect) adlula izinqubo zokukhiqiza ezijwayelekile ngokunika amandla imigqa emincane kakhulu, ama-microvia, kanye nezinto ezihlanganisiwe ezidingekayo kuma-smartphone, kumadivayisi e-IoT, kanye nekhompyutha ethuthukisiwe.
Izinqubo Ezengeziwe Zokwakha Izingqimba
1. Ukugqoka nge-dielectric kwezendlalelo ezakhiwe
2. Ukubhoboza nge-Laser kwe-Blind Vias
3. Ukungaboni Nge-Metallization
4. Ukuthwebula Izithombe Nokuqopha Ukulandelela Okwakhayo
5. Imijikelezo Yokwakha Ephindaphindwayo
