Ungazibona kanjani ngokucacile iziphambeko ezingabonakali ze-PCBA?

Amazinga Okuhlola e-X-RAY

1. Amalunga e-BGA solder awanayo i-offset:
Izindlela zokwahlulela: ziyamukeleka lapho i-offset ingaphansi kwengxenye yomjikelezo wephedi yomthengisi; Uma i-offset inkulu noma ilingana nengxenye yomjikelezo wephedi yomthengisi, kufanele yenqatshwe.

2. Amalunga e-BGA solder awanayo i-short circuit:
Izindlela zokwahlulela: Uma kungekho ukuxhumana kwe-tin phakathi kwamajoyinti e-solder, kuyamukeleka; Uma kukhona ukuxhumana kwe-solder phakathi kwamajoyinti e-solder, kufanele kwenqatshwe.

3. Amalunga e-BGA solder angenazo izimbobo:
Imigomo yokwahlulela: Indawo engenalutho engaphansi kuka-20% wendawo yonke yejoyinti le-solder iyamukeleka; Uma indawo engenalutho inkulu noma ilingana no-20% wendawo yonke yejoyinti le-solder, kufanele yenqatshwe.

4. Akukho ukushoda kwe-tin kumajoyinti e-BGA solder:
Izindlela zokwahlulela: Yamukela lapho wonke amabhola ethini ebonisa osayizi abagcwele, abafanayo nabalinganayo; Uma usayizi webhola lethini uncane kakhulu uma uqhathaniswa namanye amabhola ethini azungezile, kufanele wenqatshwe.

5. Izinga lokuhlola le-E-PAD yephedi yokumisa yama-chip ekilasi le-QFP/QFN kweminye imikhiqizo ukuthi indawo yethini kumele ibe ngaphezu kuka-60% wendawo iyonke (amagridi amane ahlanganiswe ndawonye abonisa ukushiswa okuhle), kanti isilinganiso sokusampula singama-20%.

1. Inhloso yokuhlola: Amabhodi e-PCBA anezingxenye ze-BGA/LGA kanye nephedi yokumisa;

2. Imvamisa yokuhlola:

① Ngemva kokuguqulwa, abasebenzi bezobuchwepheshe bayaqinisekisa ukuthi ibhodi lokuqala lokunamathisela i-solder kanye ne-BGA surface mount zinamaphutha okuphambuka, bese beqhubeka nokudlula ekamelweni ngemuva kokuqinisekisa ukuthi azikho izinkinga;

② Abasebenzi bezobuchwepheshe bayaqinisekisa ukuthi kukhona yini izinkinga nge-BGA soldering yebhodi lokuqala lokunamathisela i-solder ngemva kokudlula ekamelweni, bese beyifaka ekukhiqizweni uma kungekho zinkinga;

③ Ngesikhathi sokukhiqiza okuvamile, abasebenzi abaqokiwe banesibopho sokuhlola, futhi uma ama-oda angu-≤ 100pcs, kufanele ahlolwe ngokugcwele ngo-100%; ama-oda angu-101-1000 kufanele athathwe amasampula ngo-30%, ama-oda angaphezu kuka-1001 kufanele athathwe amasampula ngo-20%;

④ Ngesikhathi senqubo evamile yokukhiqiza, i-IPQC yenza izivivinyo zokuthatha amasampula ezingcezu ezimbili ezinkulu ngehora;

⑤ Imikhiqizo kufanele ihlolwe ngokuphelele ngo-100% futhi izithombe kufanele zilondolozwe ngo-100%.

3. Uma kukhona amaphutha, izithombe kufanele zilondolozwe, futhi imodeli ye-BOM, inombolo ye-serial yebhakhodi kanye nemiphumela yokuhlolwa komkhiqizo ovivinyiwe kufanele kuqoshwe kwiFomu Lerekhodi Lokuhlolwa kwe-X-Ray. Engeza izithombe zokunamathisela ze-QFP kanye nama-grounding pads e-QFN, bese wonga u-100% wezithombe.

4. Uma kukhona amaphutha ngesikhathi sokuhlolwa, kufanele abikwe ngokushesha kumphathi kanye nonjiniyela wenqubo ukuze aqinisekiswe.

Isazi Sokuhlola Esihlakaniphile Se-X-ray Yezimboni

Uhlelo lwemishini ye-X-RAY luqukethe ikakhulukazi izingxenye eziyisikhombisa: umthombo we-X-ray ogxile kakhulu, iyunithi yokuthwebula izithombe, uhlelo lokucubungula izithombe zekhompyutha, uhlelo lomshini, uhlelo lokulawula ugesi, uhlelo lokuvikela ukuphepha kanye nohlelo lokuxwayisa. Luhlanganisa ukuhlolwa okungonakalisi, ubuchwepheshe besofthiwe yekhompyutha, ubuchwepheshe bokuthola nokucubungula izithombe kanye nobuchwepheshe bokudlulisa izithombe, oluhlanganisa izinkambu ezine zobuchwepheshe ezinkulu zokucubungula izithombe ezibonakalayo, ezemishini, zikagesi nezedijithali. Ngokuhlukahluka kokumuncwa kwe-X-ray ngezinto ezahlukene, isakhiwo sangaphakathi sento siyathathwa bese kutholakala ukutholwa kwezinkinga zangaphakathi. Isithombe sokutholwa komkhiqizo singabonwa ngesikhathi sangempela ukuze kunqunywe ukuthi kukhona yini amaphutha, izinhlobo zezinkinga kanye namazinga ajwayelekile embonini ngaphakathi komkhiqizo. Ngesikhathi esifanayo, uhlelo lokucubungula izithombe zekhompyutha lusetshenziselwa ukugcina nokucubungula izithombe ukuze kuthuthukiswe ukucaca kwesithombe nokuqinisekisa ukunemba kokuhlolwa. Lungalinganisa ngokuzenzakalelayo amabhamuza ezingxenyeni ze-elekthronikhi ezipakishiwe njenge-BGA ne-QFN, futhi lusekela izilinganiso zejometri njengebanga, i-engeli, ububanzi, kanye ne-polygon. Lungafinyelela kalula ukutholwa kokubekwa kwamaphuzu amaningi, okuvumela imikhiqizo ukuthi ishiye ifektri ingenamaphutha.