Pehea e ʻike maopopo ai i nā hemahema ʻike ʻole ʻia o PCBA?
Nā Kūlana Nānā X-RAY
1. ʻAʻohe offset o nā hui solder BGA:
Nā pae hoʻoholo: ʻae ʻia ke emi ka offset ma mua o ka hapalua o ke anapuni o ka pad solder; Ke ʻoi aku ka nui o ka offset ma mua o ka hapalua o ke anapuni o ka pad solder, e hōʻole ʻia.
2. ʻAʻohe kaapuni pōkole o nā hui solder BGA:
Nā pae hoʻoholo: Inā ʻaʻohe pilina tin ma waena o nā hui solder, ua ʻae ʻia; Ke pili ka solder ma waena o nā hui solder, e hōʻole ʻia.
3. Nā hui solder BGA me ka ʻole o nā hakahaka:
Nā pae hoʻoholo: ʻAe ʻia kahi ʻāpana hakahaka ma lalo o 20% o ka huina o ka hui solder; Inā ʻoi aku ka nui o ka ʻāpana hakahaka ma mua o 20% o ka huina o ka hui solder, e hōʻole ʻia.
4. ʻAʻohe hemahema o ka tin i nā hui solder BGA:
Nā pae hoʻoholo: ʻAe ʻia ke hōʻike nā pōpō tini āpau i nā nui piha, like a kūlike; Inā ʻoi aku ka liʻiliʻi o ka nui o ka pōpō tini i hoʻohālikelike ʻia me nā pōpō tini ʻē aʻe a puni, pono e hōʻole ʻia.
5. ʻO ke kūlana nānā no ka pad grounding E-PAD o nā ʻāpana papa QFP/QFN no kekahi mau huahana, ʻo ia ka ʻāpana tin e ʻoi aku ma mua o 60% o ka ʻāpana holoʻokoʻa (ʻehā mau grids i hoʻohui ʻia e hōʻike ana i ka soldering maikaʻi), a ʻo ka lakio laʻana he 20%.
1. Pahuhopu hoʻāʻo: nā papa PCBA me BGA/LGA a me nā ʻāpana pad honua;
2. Ka pinepine o ka hoʻāʻo ʻana:
① Ma hope o ka hoʻololi ʻana, hōʻoia ka poʻe loea inā he mau hemahema ʻē aʻe ka papa hoʻopili solder mua a me ka mauna ʻili BGA, a laila e hoʻomau me ka hele ʻana ma ke keʻena ma hope o ka hōʻoia ʻana ʻaʻohe pilikia;
② Hōʻoia ka poʻe loea inā he mau pilikia me ka hoʻopili ʻana o BGA o ka papa hoʻopili solder mua ma hope o ka hala ʻana i loko o ke keʻena, a laila hoʻokomo i ka hana inā ʻaʻohe pilikia;
③ I ka wā hana maʻamau, na nā limahana i koho ʻia ke kuleana no ka hoʻāʻo ʻana, a inā he ≤ 100pcs nā kauoha, e hoʻāʻo piha ʻia ka 100%; 101-1000pcs e laʻana ʻia no 30%, nā kauoha ʻoi aku ma mua o 1001pcs e laʻana ʻia no 20%;
④ I ka wā o ke kaʻina hana maʻamau, hana ʻo IPQC i nā hoʻokolohua laʻana ma 2 mau ʻāpana nui i kēlā me kēia hola;
⑤ Pono e hoʻāʻo piha ʻia nā huahana 100% a pono e mālama ʻia nā kiʻi 100%.
3. Inā he mau hemahema, pono e mālama ʻia nā kiʻi, a pono e hoʻopaʻa ʻia ke kumu hoʻohālike BOM, ka helu serial barcode a me nā hopena hoʻāʻo o ka huahana i hoʻāʻo ʻia ma ka palapala hoʻopaʻa hoʻāʻo X-Ray. E hoʻohui i nā kiʻi soldering o nā pads grounding QFP a me QFN, a mālama i 100% o nā kiʻi.
4. Inā he mau hemahema i ka wā o ka hoʻāʻo ʻana, pono e hōʻike koke ʻia i ka luna a me ka ʻenekinia hana no ka hōʻoia.
Loea Nānā Akamai X-ray ʻOihana
ʻO ka ʻōnaehana o nā lako X-RAY he ʻehiku mau ʻāpana nui: ke kumu X-ray micro focus, ka ʻāpana kiʻi, ka ʻōnaehana hana kiʻi kamepiula, ka ʻōnaehana mechanical, ka ʻōnaehana hoʻomalu uila, ka ʻōnaehana pale palekana a me ka ʻōnaehana hoʻomaopopo. Hoʻohui ia i ka hoʻāʻo ʻole luku, ka ʻenehana polokalamu kamepiula, ka ʻenehana loaʻa kiʻi a me ka hana ʻana a me ka ʻenehana hoʻoili mechanical, e uhi ana i ʻehā mau kahua loea nui o ka hana kiʻi optical, mechanical, uila a me digital. Ma o nā ʻokoʻa omo o nā X-ray e nā mea like ʻole, ua kiʻi ʻia ke ʻano o loko o ka mea a ua hana ʻia ka ʻike ʻana i nā hemahema o loko. Hiki ke nānā ʻia ke kiʻi ʻike o ka huahana i ka manawa maoli e hoʻoholo ai inā he mau hemahema, nā ʻano hemahema a me nā pae maʻamau o ka ʻoihana i loko o ka huahana. I ka manawa like, hoʻohana ʻia ka ʻōnaehana hana kiʻi kamepiula e mālama a hana i nā kiʻi e hoʻomaikaʻi i ka maopopo o ke kiʻi a hōʻoia i ka pololei o ka loiloi. Hiki iā ia ke ana aunoa i nā pehu ma nā ʻāpana uila i hoʻopaʻa ʻia e like me BGA a me QFN, a kākoʻo i nā ana geometric e like me ka mamao, ke kihi, ke anawaena, a me ka polygon. Hiki iā ia ke hoʻokō maʻalahi i ka ʻike ʻana i ke kūlana multi-point, e ʻae ana i nā huahana e haʻalele i ka hale hana me ka ʻole o nā hemahema.
