Zvikamu zveModule

SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Kumanikidzwa kwekuisa muchina wekutora nekuisa kunogona kutsiva here kusashanda zvakanaka kweSOIC lead coplanarity?

Kugadziriswa kudiki chete mukati me ±0.05mm kunobvumirwa. Zvikamu zvine kutsauka kwakanyanya zvinofanirwa kudzoserwa kumutengesi kudzivirira kutyoka kwepini kunokonzerwa nekumanikidzwa kuiswa.
2. Ungadzivisa sei kutenderedza mativi ese ezvikamu zveSOIC zvine muviri wakafara panguva yekuisa?

Shandisa nzira ye "centre support + two - end crimping". Muchina we pick - and - place nozzle unofanirwa kubata pakati nepamativi ese echikamu panguva imwe chete kuti uve nechokwadi chekuti chinonetsa zvakafanana.
3. Ungagadzirisa sei ukobvu hwekudhinda kwe solder paste kuti ive nzvimbo yakanaka ye QFP (lead pitch ≤0.4mm)?

Ukobvu hwacho hunofanira kuderedzwa kusvika 60–90μm kudzivirira kuungana kwepaste inonamira zvichikonzera kubatanidza. Zvinokurudzirwa kushandisa stencil yakagadzirwa nemagetsi.
4. Kugadziriswa nemaoko kunobvumirwa here kune zvikamu zveQFP zvakachinjwa mushure mekuiswa?

Kugadziriswa kudiki (kuchinjika ≤0.1mm) kunobvumirwa usati waisazve mvura, asi kunoda kubatsirwa netweezer yakanyikwa muflux kudzivirira kusvibisa pad.
5. Ko solder paste isipo pa QFN thermal pads inogona kugadziriswa here ne post-soldering?

Kubatanidza mushure mekunamira hakukurudzirwi nekuti majoini epasi ekunamira haakwanise kuongororwa nemaziso. Chikamu chacho chinofanira kubviswa uye paste yekunamira inofanira kudhindwazve.
6. Nzira yekudzivirira "kutemwa nematombo" uye "chiitiko cheManhattan" pakuiswa kweQFN?

Iva nechokwadi chekuti musiyano wehuwandu hwe solder paste kumativi ese echikamu uri ≤3%, uye deredza mwero wekupisa kwe soldering kusvika ≤1.5℃/s kuderedza kusagadzikana kwekupisa kusina kuenzana.
7. Kuchenesa kwe ultrasonic kunogona kushandiswa here usati waisa mabhora eBGA solder akasanganiswa ne oxidized?

Hazvikurudzirwi nekuti zvinogona kukuvadza kuputira pamusoro pemabhora emuchina wekusonesa. Kuyerera kwakakosha (senge kusina kuchena) kunofanirwa kushandiswa kuti mvura inyorove.
8. Maitiro ekuderedza kudonha kwebhora reBGA solder kuburikidza nekuisa magadzirirwo eparameter yemuchina we pick - uye - place?

Deredza kumanikidzwa kwekuisa kusvika pa 0.05–0.1N, uye unonotsa nguva yekuburitsa nozzle (0.2–0.5s) kudzivirira kushanduka kwemabhora ekusolder kana achimanikidzwa.
9. Ndeipi nhanho ye vacuum inodiwa kuti uBGA (dhayamita yebhora re solder ≤0.3mm) iiswe?

Vacuum level inofanira kuva ≥ - 80kPa kuti zvive nechokwadi chekuti zvinhu zvidiki zvinopinda zvakanaka. Panguva imwe chete, sensor yekudzivirira kubuda kwemvura inofanira kugadzirwa.
10. Chidimbu chebhodhi chakazara chinodiwa here kana zvikamu zveuBGA zvikawanikwa zvisina mabhora ekusonesa mushure mekuiswa?

Kana huwandu hwemabhora e solder asina kusimba huri ≤5% uye ari mapini asina kukosha, kugadzirisa ne laser uye bhora - kuzadza kunogona kushandiswa; zvikasadaro, bhodhi rinofanira kuraswa.
11. Sei "kurapwa kwepakutanga" kuchidikanwa kune zvikamu zveCGA zvisati zvaiswa?

Mapakeji esimbi anowanzo nyorova. Anofanira kubikwa pa150℃ kwemaawa masere kuti abvise kushushikana mukati uye kuderedza hunyoro kusvika pasi pe0.1%.
12. Musiyano weCTE pakati peCGA nePCB unokanganisa sei kururama kwekuisa?

Kana musiyano weCTE uri > 10×10⁻⁶/℃, maitiro ekutonhodza anononoka (muyero ≤1℃/s) anofanira kuwedzerwa mushure mekugadziriswazve kwe solder kuti pasave nekutsemuka kwe solder joint.
13. Manozzle eBGA akajairika anogona kushandiswa here pakuisa zvikamu zveLGA?

Kwete. Sezvo LGA pads dzisina mabhora ekusolder, muromo wakatsetseka une sensor yekumanikidza unodiwa kuti uve nechokwadi chekuti kumanikidzwa kwakafanana.
14. Ko ukobvu hweLGA pad surface plating hunokanganisa sei kuvimbika kwenzvimbo yacho?

Rutivi rwegoridhe rwekuputira runofanira kunge ruri ≥3μm, uye rutivi rwenickel rwekuputira runofanira kunge ruri ≥5μm. Zvikasadaro, kuramba kubatwa zvakanyanya kunogona kukonzera kudzikira kwechiratidzo kana kutadza kushanda zvakanaka kwekupisa.
15. Ungadzivisa sei zvikanganiso "zvinotsamira" pakuiswa kwechikamu cheCSP?

Pakati pemuromo panofanira kunge pakaenzana nepakati pesimba regiravhiti rechikamu (kutsauka ≤0.01mm), uye basa rekuona mamiriro echikamu chemuchina wekutora-uye-nzvimbo rinofanira kugoneswa.
16. Chii chinofanira kuva nePCB support fixture pakuisa CSP substrate inochinjika?

Mapini ekutsigira elastic (kuomarara kwemahombekombe 60–70) anodiwa kudzivirira kusuduruka kwezvikamu kunokonzerwa nekukombama kwepasi.
17. Kusvibiswa kwelenzi yekamera yekuona kunokanganisa sei kuonekwa kwelead yeQFP?

Mavara egirazi anokonzera kukanganisa kwekuona lead >0.02mm. Inofanira kucheneswa ne absolute ethanol kamwe chete pasvondo.
18. Ungaratidza sei kuvimbika kwemajoini epasi pesolder mushure mekugadzirisa chikamu cheQFN?

SAM (Scanning Acoustic Microscopy) inoshandiswa kuona delamination panzvimbo inosundwa. Nzvimbo yedelamination inofanira kunge iri ≤10% yenzvimbo yepad.
19. Ndeupi musiyano mukuru uripo pakati pemagadzirirwo e flip chip nemagadzirirwo e CSP?

Maflip chips anoda kudzorwa kwakanyatsojeka kwemamiriro emabhora e solder nema bumps (kururama ≤±0.002mm), uye nzira yekuzadza pasi pevhu inofanira kushandiswa.
20. Ndezvipi zvakanakira zvekushandisa vacuum eutectic bonding muLGA placement?

Inogona kusanganisa solder-paste-free welding, ine solder joint void rate
21. Chii chiri kuvandudzwa kwetekinoroji yekuisa photon pakuisa BGA?

Inoshandisa matanda elaser kuti ishandise zvakananga zvikamu (kururama ≤±0.001mm), pasina chikonzero chekushandisa ma nozzles emakanika, uye yakakodzera kurongedza nanoscale.
22. Ndeipi kukosha kwekushandiswa kwedhijitari twin muzvirongwa zvekuisa?

Inogona kutevedzera maitiro ekuisa zvinhu panguva chaiyo, kufanotaura kugoverwa kwekushushikana kwezvikamu, uye kugadzirisa maparameter pachine nguva kuderedza njodzi yekukundikana kwejoini resolder.
23. Ndeapi matanho enguva pfupi anofanira kutorwa pakuisa zvikamu zveCGA munzvimbo dzinopisa zvakanyanya (>30℃)?

Wedzerai michina inotonhodza mhepo yemuno (tembiricha inodzorwa pa23±2℃), uye panguva imwe chete, pfupisai nguva yekuratidzwa kwezvinhu mushure mekuvhurwa (≤maminitsi makumi matatu) kudzivirira kuwedzera oxidation yebhora resolder.
24. Ndedzipi mhinduro dzinodzivirira hunyoro dziripo dzekuisa zvikamu zveQFN munzvimbo dzine hunyoro hwakawanda (RH>70%)?

① PCB inofanira kubikwa pa120℃ kwemaawa mana isati yadhindwa ne solder paste; ② Zvikamu zvinofanirwa kuiswa mukugadzirwa nekukurumidza mushure mekuvhurwa, uye mudziyo wekubvisa hunyoro (RH≤40%) unofanirwa kugadzirwa mumidziyo.
25. Ndezvipi zvinodiwa kuti PCB pads dzigadziriswe pakuisazve zvikamu zveBGA?

Solder yasara inofanira kucheneswa ne desoldering braid, uye ma oxide anofanira kubviswa ne plasma cleansing kuti ive nechokwadi chekuti surface roughness Ra ye pad iri ≤1.6μm.

SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Kumanikidzwa kwekuisa muchina wekutora nekuisa kunogona kutsiva here kusashanda zvakanaka kweSOIC lead coplanarity?

2. Ungadzivisa sei kutenderedza mativi ese ezvikamu zveSOIC zvine muviri wakafara panguva yekuisa?

3. Ungagadzirisa sei ukobvu hwekudhinda kwe solder paste kuti ive nzvimbo yakanaka ye QFP (lead pitch ≤0.4mm)?

4. Kugadziriswa nemaoko kunobvumirwa here kune zvikamu zveQFP zvakachinjwa mushure mekuiswa?

5. Ko solder paste isipo pa QFN thermal pads inogona kugadziriswa here ne post-soldering?

6. Nzira yekudzivirira "kutemwa nematombo" uye "chiitiko cheManhattan" pakuiswa kweQFN?

7. Kuchenesa kwe ultrasonic kunogona kushandiswa here usati waisa mabhora eBGA solder akasanganiswa ne oxidized?

8. Maitiro ekuderedza kudonha kwebhora reBGA solder kuburikidza nekuisa magadzirirwo eparameter yemuchina we pick - uye - place?

9. Ndeipi nhanho ye vacuum inodiwa kuti uBGA (dhayamita yebhora re solder ≤0.3mm) iiswe?

10. Chidimbu chebhodhi chakazara chinodiwa here kana zvikamu zveuBGA zvikawanikwa zvisina mabhora ekusonesa mushure mekuiswa?

11. Sei "kurapwa kwepakutanga" kuchidikanwa kune zvikamu zveCGA zvisati zvaiswa?

12. Musiyano weCTE pakati peCGA nePCB unokanganisa sei kururama kwekuisa?

13. Manozzle eBGA akajairika anogona kushandiswa here pakuisa zvikamu zveLGA?

14. Ko ukobvu hweLGA pad surface plating hunokanganisa sei kuvimbika kwenzvimbo yacho?

15. Ungadzivisa sei zvikanganiso "zvinotsamira" pakuiswa kwechikamu cheCSP?

16. Chii chinofanira kuva nePCB support fixture pakuisa CSP substrate inochinjika?

17. Kusvibiswa kwelenzi yekamera yekuona kunokanganisa sei kuonekwa kwelead yeQFP?

18. Ungaratidza sei kuvimbika kwemajoini epasi pesolder mushure mekugadzirisa chikamu cheQFN?

19. Ndeupi musiyano mukuru uripo pakati pemagadzirirwo e flip chip nemagadzirirwo e CSP?

20. Ndezvipi zvakanakira zvekushandisa vacuum eutectic bonding muLGA placement?

21. Chii chiri kuvandudzwa kwetekinoroji yekuisa photon pakuisa BGA?

22. Ndeipi kukosha kwekushandiswa kwedhijitari twin muzvirongwa zvekuisa?

23. Ndeapi matanho enguva pfupi anofanira kutorwa pakuisa zvikamu zveCGA munzvimbo dzinopisa zvakanyanya (>30℃)?

24. Ndedzipi mhinduro dzinodzivirira hunyoro dziripo dzekuisa zvikamu zveQFN munzvimbo dzine hunyoro hwakawanda (RH>70%)?

25. Ndezvipi zvinodiwa kuti PCB pads dzigadziriswe pakuisazve zvikamu zveBGA?

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