Ibyiciro bya Moduli

SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Ese igitutu cyo gushyiramo imashini ifata n'aho ishyiramo gishobora kwishyura ubushobozi buke bwo gushyiramo imashini ifata n'aho ishyiramo imashini?

Impinduka ntoya gusa muri ± 0.05mm nizo zemerewe. Ibice bifite ubusumbane bukabije bigomba gusubizwa ku mucuruzi kugira ngo hirindwe ko agapira kameneka kavunika bitewe no gushyiramo ku ngufu.
2. Ni gute wakwirinda kugongana ku mpera zombi z'ibice bya SOIC binini mu gihe cyo kubishyiraho?

Koresha uburyo bwa "support center + two - end crimping". Umunwa w'imashini yo gufatiraho ugomba gukora ku mpera zombi z'igice icyarimwe kugira ngo urebe ko hari stress imwe.
3. Ni gute wahindura ubugari bw'imashini ikoresha icyuma gicapa kugira ngo ikoreshwe neza cyane (ifite uburebure bwa ≤0.4mm)?

Ubunini bugomba kugabanywa bukagera kuri 60–90μm kugira ngo hirindwe ko ifu ivanze n'umushongi itera kwegerana. Ni byiza gukoresha stencil ikozwe mu buryo bw'amashanyarazi.
4. Ese gukosora intoki byemewe ku bice bya QFP byahinduwe nyuma yo gushyirwaho?

Guhindura gato (guhindura ≤0.1mm) birakenewe mbere yo kongera gukoresha soldering, ariko bigomba gufashwa n'agakoresho k'ingufu gashyirwamo umwuka kugira ngo hirindwe kwanduza agakoresho.
5. Ese ifu ya solder ibura kuri QFN thermal pads ishobora gusanwa hakoreshejwe soldering ya post-soldering?

Gusora nyuma yo gusora ntibyemewe kuko ingingo zo hasi zisora zidashobora gusuzumwa neza. Igice cyabyo kigomba gukurwaho kandi agace kasora gakwiye kongera gucapwa.
6. Ni gute wakwirinda "gutera imva" na "Manhattan phenomenon" mu gace ka QFN?

Menya neza ko itandukaniro ry'ingano y'umusemburo wa soldering ku mpera zombi z'igice ari ≤3%, kandi ugabanye igipimo cy'ubushyuhe bwo kongera gushyuha kuri soldering kugeza kuri ≤1.5℃/s kugira ngo ugabanye ubushyuhe bungana.
7. Ese isuku ya ultrasonic ishobora gukoreshwa mbere yo gushyiramo imipira ya BGA solder ifite oxidized?

Ntibyemewe kuko bishobora kwangiza ubuso bw'imipira yo gushongesha. Hakenewe gukoreshwa flux yihariye (nk'ubwoko budasukuye) kugira ngo hongererwe ubushuhe.
8. Ni gute wagabanya kugwa kw'umupira wa solder wa BGA ukoresheje igenamiterere ry'ibipimo bya mashini yo gutoranya no gushyiramo?

Gabanya umuvuduko wo gushyiramo kugeza kuri 0.05–0.1N, kandi utinze igihe cyo kurekura amazi (0.2–0.5s) kugira ngo wirinde guhinduka kw'imipira yo gusoda iyo igitutu kigeze.
9. Ni ikihe gipimo cy'ubusamo gikenewe kugira ngo uBGA (umurambararo w'umupira w'ubusamo ≤0.3mm) ushyirwemo?

Igipimo cy'ubushyuhe kigomba kuba ≥ - 80kPa kugira ngo ibice bito birusheho kwinjira neza. Muri icyo gihe, hagomba gushyirwaho uburyo bwo kumenya aho amazi aturuka.
10. Ese hakenewe agace kuzuye k'urubaho niba ibice bya uBGA bibonetsemo udupira twa solder twabuze nyuma yo gushyirwaho?

Niba umubare w'imipira ibura ari ≤5% kandi ari imipira idakomeye, gusana imipira hakoreshejwe laser no kuyishyiramo umupira, kuzuza bishobora gukoreshwa; bitabaye ibyo, ikibaho kigomba gukurwaho.
11. Kuki "kuvura mbere yo gusaza" bikenewe ku bice bya CGA mbere yo gushyirwamo?

Amapaki ya ceramic akunze kwinjiza ubushuhe. Agomba gutekwa kuri 150°C mu gihe cy'amasaha 8 kugira ngo akureho ubushuhe bw'imbere mu mubiri kandi agabanye ubushuhe bukagera munsi ya 0.1%.
12. Itandukaniro rya CTE hagati ya CGA na PCB rigira izihe ngaruka ku buryo bwo gushyira ibintu mu mwanya wabyo?

Iyo itandukaniro rya CTE riri kuri > 10×10⁻⁶/℃, hagomba kongerwamo uburyo bwo gukonjesha buhoro buhoro (igipimo cya ≤1℃/s) nyuma yo kongera gukoresha solder kugira ngo bigabanye gusenyuka kw'ingingo z'isolder.
13. Ese imiyoboro isanzwe ya BGA ishobora gukoreshwa mu gushyira ibice bya LGA?

Oya. Kubera ko LGA pads zitagira imipira yo gusoda, umunwa ugororotse ufite sensor y'umuvuduko urakenewe kugira ngo umenye neza ko umuvuduko ushyirwa mu mwanya umwe.
14. Ni izihe ngaruka z'ubugari bw'ubuso bw'aho ibikoresho bya LGA bishyirwa ku buryo bworoshye?

Urukuta rwa zahabu rugomba kuba ≥3μm, naho urundi rukuta rwa nikeli rukaba ≥5μm. Bitabaye ibyo, ubushobozi bwo guhangana n'ibintu bishobora gutuma ibimenyetso bigabanuka cyangwa ubushyuhe bugabanuka.
15. Ni gute wakwirinda inenge "zihindagurika" mu gushyira ibice bya CSP mu mwanya wabyo?

Hagati mu gice cy'umuyoboro hagomba kuba hahujwe n'uburemere bw'igice (kuyoba ≤0.01mm), kandi akazi ko kumenya aho ibice bihagaze kagomba gukoreshwa mu mashini ifata n'aho ishyira.
16. Ni ibihe bintu igikoresho gishyigikira PCB kigomba kugira kugira ngo gishyireho CSP yoroshye?

Udupira two gushyigikira ibyuma (ubukomere bw'inkombe 60–70) turakenewe kugira ngo hirindwe ko ibice bihinduka bitewe no kugonga substrate.
17. Ni izihe ngaruka zo kwanduzwa kwa kamera y’amaso ku kuntu isuzuma rya QFP rikorwa?

Amabara y'indorerwamo atera ikosa ryo kumenya icyuma gifata utwenda >0.02mm. Igomba gusukurwa na ethanol yuzuye rimwe mu cyumweru.
18. Ni gute wagenzura ko ingingo zo hasi z’umugozi zizewe nyuma yo gusubiramo ibice bya QFN?

SAM (Scanning Acoustic Microscopy) ikoreshwa mu kumenya imiterere y'aho icyuma gihurira. Agace k'aho icyuma gihurira kagomba kuba ≤10% by'agace k'aho icyuma gihurira.
19. Ni irihe tandukaniro ry'ingenzi riri hagati ya flip chip na CSP placement processes?

Udupira two kuzunguruka dukenera kugenzura neza uburyo imipira n'udupira bihurira (ubuziranenge ≤±0.002mm), kandi inzira yo kuzura hasi igomba gukoreshwa.
20. Ni izihe nyungu zo gukoresha vacuum eutectic bonding mu gushyira mu bikorwa LGA?

Ishobora kugera ku gusudira idafite solder-paste, ifite igipimo cy'ubusa bw'ako gahuriro ka solder
21. Ni ubuhe buryo bushya bwo gushyira fotoni mu mwanya wa BGA?

Ikoresha imirasire ya laser kugira ngo ikoreshwe mu buryo butaziguye ibice (ubuziranenge ≤±0.001mm), idakeneye imiyoboro ya mekanike, kandi ikwiriye gupakira nanoscale.
22. Agaciro k'ikoreshwa ry'impanga y'ikoranabuhanga ni akahe mu bikorwa byo gushyira abantu mu myanya?

Ishobora kwigana uburyo bwo gushyira ibintu mu buryo bufatika mu gihe nyacyo, igahanura uko ibice bizajya bikwirakwira, kandi ikanoza ibipimo mbere y’igihe kugira ngo igabanye ibyago byo kwangirika kw’ingingo z’umushongi.
23. Ni izihe ngamba z'agateganyo zikwiye gufatwa mu gihe ushyira ibice bya CGA ahantu hashyushye cyane (>30℃)?

Ongeraho ibikoresho byo gukonjesha umwuka wo mu gace uherereyemo (ubushyuhe bugenzurwa kuri 23±2℃), kandi icyarimwe, gabanya igihe cyo gushyiramo ibice nyuma yo gufungura (iminota ≤30) kugira ngo wirinde kongera ubushyuhe bw'umupira w'amashanyarazi.
24. Ni izihe ngamba zirinda ubushuhe zihari zo gushyira ibice bya QFN ahantu hafite ubushuhe bwinshi (RH>70%)?

① PCB igomba gutekwa kuri 120°C mu gihe cy'amasaha 4 mbere yo gucapa imashini ikoresha solder paste; ② Ibice bigomba gushyirwa mu bikorwa ako kanya nyuma yo gufungura, kandi hagashyirwaho icyuma gikuraho ubushuhe (RH≤40%) mu bikoresho.
25. Ni ibihe bikorwa mbere yo gutunganya PCB pads bikenewe mu gihe cyo kongera gushyiramo ibice bya BGA?

Igikoresho gisigaye gikeneye gusukurwa hakoreshejwe agapira gakuraho ububoshyi, naho okiside zigakurwaho hakoreshejwe isukura rya plasma kugira ngo hamenyekane ko ubuso bwa Ra bw'agapira ari ≤1.6μm.

SOIC, QFP, QFN, BGA, uBGA, CGA, LGA, CSP

1. Ese igitutu cyo gushyiramo imashini ifata n'aho ishyiramo gishobora kwishyura ubushobozi buke bwo gushyiramo imashini ifata n'aho ishyiramo imashini?

2. Ni gute wakwirinda kugongana ku mpera zombi z'ibice bya SOIC binini mu gihe cyo kubishyiraho?

3. Ni gute wahindura ubugari bw'imashini ikoresha icyuma gicapa kugira ngo ikoreshwe neza cyane (ifite uburebure bwa ≤0.4mm)?

4. Ese gukosora intoki byemewe ku bice bya QFP byahinduwe nyuma yo gushyirwaho?

5. Ese ifu ya solder ibura kuri QFN thermal pads ishobora gusanwa hakoreshejwe soldering ya post-soldering?

6. Ni gute wakwirinda "gutera imva" na "Manhattan phenomenon" mu gace ka QFN?

7. Ese isuku ya ultrasonic ishobora gukoreshwa mbere yo gushyiramo imipira ya BGA solder ifite oxidized?

8. Ni gute wagabanya kugwa kw'umupira wa solder wa BGA ukoresheje igenamiterere ry'ibipimo bya mashini yo gutoranya no gushyiramo?

9. Ni ikihe gipimo cy'ubusamo gikenewe kugira ngo uBGA (umurambararo w'umupira w'ubusamo ≤0.3mm) ushyirwemo?

10. Ese hakenewe agace kuzuye k'urubaho niba ibice bya uBGA bibonetsemo udupira twa solder twabuze nyuma yo gushyirwaho?

11. Kuki "kuvura mbere yo gusaza" bikenewe ku bice bya CGA mbere yo gushyirwamo?

12. Itandukaniro rya CTE hagati ya CGA na PCB rigira izihe ngaruka ku buryo bwo gushyira ibintu mu mwanya wabyo?

13. Ese imiyoboro isanzwe ya BGA ishobora gukoreshwa mu gushyira ibice bya LGA?

14. Ni izihe ngaruka z'ubugari bw'ubuso bw'aho ibikoresho bya LGA bishyirwa ku buryo bworoshye?

15. Ni gute wakwirinda inenge "zihindagurika" mu gushyira ibice bya CSP mu mwanya wabyo?

16. Ni ibihe bintu igikoresho gishyigikira PCB kigomba kugira kugira ngo gishyireho CSP yoroshye?

17. Ni izihe ngaruka zo kwanduzwa kwa kamera y’amaso ku kuntu isuzuma rya QFP rikorwa?

18. Ni gute wagenzura ko ingingo zo hasi z’umugozi zizewe nyuma yo gusubiramo ibice bya QFN?

19. Ni irihe tandukaniro ry'ingenzi riri hagati ya flip chip na CSP placement processes?

20. Ni izihe nyungu zo gukoresha vacuum eutectic bonding mu gushyira mu bikorwa LGA?

21. Ni ubuhe buryo bushya bwo gushyira fotoni mu mwanya wa BGA?

22. Agaciro k'ikoreshwa ry'impanga y'ikoranabuhanga ni akahe mu bikorwa byo gushyira abantu mu myanya?

23. Ni izihe ngamba z'agateganyo zikwiye gufatwa mu gihe ushyira ibice bya CGA ahantu hashyushye cyane (>30℃)?

24. Ni izihe ngamba zirinda ubushuhe zihari zo gushyira ibice bya QFN ahantu hafite ubushuhe bwinshi (RH>70%)?

25. Ni ibihe bikorwa mbere yo gutunganya PCB pads bikenewe mu gihe cyo kongera gushyiramo ibice bya BGA?

Aderesi y'ibiro

Uruganda rwa SMT

Uruganda rwa PCB

Uruganda rwa PCB